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BGB707L7ESDE6327XTSA1

Infineon Technologies

BGB707L7ESDE6327XTSA1 by Infineon Technologies

BGB707L7ESDE6327XTSA1 by Infineon is a telecom IC with 3V supply voltage. It features a small outline package with 7 terminals, gold palladium finish, and dual terminal position. Ideal for telecom circuit applications due to its AEC-Q101 screening level and very thin profile design.

Median Price

$0.651

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,058 parts In-Stock

1+ parts

$0.503

100+ parts

$0.473

1k+ parts

$0.428

10k+ parts

-

2,058

$0.503

$0.473

$0.428

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Chip1Stop

Japan . 9,724 parts In-Stock

1+ parts

$0.645

100+ parts

$0.489

1k+ parts

-

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9,724

$0.645

$0.489

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Arrow

USA . 77 parts In-Stock

1+ parts

$0.647

100+ parts

$0.491

1k+ parts

-

10k+ parts

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77

$0.647

$0.491

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-

Newark

USA . 10,485 parts In-Stock

1+ parts

$0.906

100+ parts

$0.678

1k+ parts

$0.629

10k+ parts

-

10,485

$0.906

$0.678

$0.629

-

DigiKey

USA . 10,887 parts In-Stock

1+ parts

$1.200

100+ parts

$0.888

1k+ parts

$0.773

10k+ parts

-

10,887

$1.200

$0.888

$0.773

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Verical

USA . 9,724 parts In-Stock

1+ parts

-

100+ parts

$0.645

1k+ parts

$0.559

10k+ parts

$0.522

9,724

-

$0.645

$0.559

$0.522

RS (Exports)

UK . 7,440 parts In-Stock

1+ parts

-

100+ parts

$0.954

1k+ parts

$0.764

10k+ parts

-

7,440

-

$0.954

$0.764

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Farnell

UK . 6,929 parts In-Stock

1+ parts

-

100+ parts

$0.655

1k+ parts

$0.483

10k+ parts

$0.473

6,929

-

$0.655

$0.483

$0.473

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 480 parts In-Stock

1+ parts

$0.319

100+ parts

-

1k+ parts

-

10k+ parts

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480

$0.319

-

-

-

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$0.582

100+ parts

-

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-

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32

$0.582

-

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Chip Stock

USA . 20,361 parts In-Stock

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20,361

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Vyrian

USA . 6,490 parts In-Stock

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6,490

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VNN

France . 4,216 parts In-Stock

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4,216

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Semi Source

USA . 1,090 parts In-Stock

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1,090

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Prism Electronics

USA . 88 parts In-Stock

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88

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,635 parts In-Stock

1+ parts

$0.283

100+ parts

-

1k+ parts

-

10k+ parts

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5,635

$0.283

-

-

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Semicontronic

India . 5,532 parts In-Stock

1+ parts

$0.291

100+ parts

$0.284

1k+ parts

$0.282

10k+ parts

-

5,532

$0.291

$0.284

$0.282

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Corphita

USA . 45 parts In-Stock

1+ parts

$0.302

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-

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45

$0.302

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-

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Argo Parts USA

USA . 4,591 parts In-Stock

1+ parts

$0.582

100+ parts

-

1k+ parts

-

10k+ parts

$0.565

4,591

$0.582

-

-

$0.565

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.582

100+ parts

-

1k+ parts

$0.553

10k+ parts

$0.541

500

$0.582

-

$0.553

$0.541

Advanced Electronics

New Zealand . 68 parts In-Stock

1+ parts

$12.091

100+ parts

$11.487

1k+ parts

$11.487

10k+ parts

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68

$12.091

$11.487

$11.487

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Corohmni

South Africa . 695 parts In-Stock

1+ parts

$12.535

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-

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695

$12.535

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Aztec Data Supply Inc.

USA . 840 parts In-Stock

1+ parts

$14.610

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840

$14.610

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Modulus Dynamics

Lithuania . 2,083 parts In-Stock

1+ parts

$15.009

100+ parts

$14.409

1k+ parts

$13.808

10k+ parts

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2,083

$15.009

$14.409

$13.808

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S.R.D Solutions

India . 30,000 parts In-Stock

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Perfect Parts

USA . 27,498 parts In-Stock

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27,498

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Lixinc

USA . 15,751 parts In-Stock

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15,751

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Continental Prestige Electronics

USA . 3,753 parts In-Stock

1+ parts

-

100+ parts

$0.602

1k+ parts

$0.479

10k+ parts

$0.402

3,753

-

$0.602

$0.479

$0.402

iodParts Technologies Inc.

India . 679 parts In-Stock

1+ parts

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679

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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150

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Overview

Enhance your telecom systems with the BGB707L7ESDE6327XTSA1 from Infineon Technologies. Known for their top-notch quality, Infineon Technologies delivers innovative solutions that surpass industry standards. This Other Function Telecom Interface IC offers exceptional performance and reliability, making it a valuable addition to any project. Whether you're looking to improve communication networks or enhance telecommunication devices, this product provides the efficiency and functionality you need. Upgrade your system today with the BGB707L7ESDE6327XTSA1 and experience the unmatched benefits it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and reliability of the product for long-term use.

Surface Mount: YES

Being surface mountable makes the installation process easier and more convenient, saving time and effort.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space in circuit design and layout.

Terminal Finish: GOLD PALLADIUM

The use of gold palladium terminals ensures excellent conductivity and resistance to corrosion for enhanced performance.

Max Seated Height: 0.5 mm

The low maximum seated height offers a compact design, making it suitable for applications with space constraints.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is commonly used and compatible with various telecom systems, providing versatility.

Technical Specifications

Other Function Telecom Interface ICs BGB707L7ESDE6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-N7

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

7

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q101

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.3 mm

Trade Compliance

BGB707L7ESDE6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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