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TRF7970ARHBT

Texas Instruments

TRF7970ARHBT by Texas Instruments

TRF7970ARHBT by Texas Instruments is a telecom IC with 32 terminals, operating at 5V. It offers a data rate of 0.848 Mbps and can withstand temperatures from -40 to 110°C. Ideal for industrial applications requiring high-speed communication in compact spaces.

Median Price

$4.276

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 96 parts In-Stock

1+ parts

$3.070

100+ parts

$3.008

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-

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96

$3.070

$3.008

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Chip1Stop

Japan . 4 parts In-Stock

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$4.060

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4

$4.060

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Texas Instruments

USA . 27,094 parts In-Stock

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$4.276

100+ parts

$3.486

1k+ parts

$2.324

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-

27,094

$4.276

$3.486

$2.324

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DigiKey

USA . 1,100 parts In-Stock

1+ parts

$6.290

100+ parts

$4.755

1k+ parts

$4.249

10k+ parts

$3.986

1,100

$6.290

$4.755

$4.249

$3.986

Mouser Electronics

USA . 1,683 parts In-Stock

1+ parts

$7.050

100+ parts

$4.830

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$4.100

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1,683

$7.050

$4.830

$4.100

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RS (Exports)

UK . 199 parts In-Stock

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$5.272

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199

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$5.272

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Farnell

UK . 1 parts In-Stock

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$3.740

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$3.571

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1

-

$3.740

$3.571

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,016 parts In-Stock

1+ parts

$2.916

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4,016

$2.916

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Nova Conductors

Japan . 22 parts In-Stock

1+ parts

$3.694

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22

$3.694

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Chip Stock

USA . 62,940 parts In-Stock

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Vyrian

USA . 3,126 parts In-Stock

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Classic Components Corporation

USA . 750 parts In-Stock

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750

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LIBRA Elektronik GmbH

Germany . 634 parts In-Stock

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634

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Semi Source

USA . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,530 parts In-Stock

1+ parts

$2.610

100+ parts

$2.545

1k+ parts

$2.532

10k+ parts

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3,530

$2.610

$2.545

$2.532

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Ampacity Inc.

Singapore . 3,059 parts In-Stock

1+ parts

$2.610

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3,059

$2.610

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Corphita

USA . 2,958 parts In-Stock

1+ parts

$2.763

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2,958

$2.763

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.620

100+ parts

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1k+ parts

$3.475

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100

$3.620

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$3.475

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Argo Parts USA

USA . 4,116 parts In-Stock

1+ parts

$3.694

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4,116

$3.694

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Component Stockers USA

USA . 34,745 parts In-Stock

1+ parts

$3.720

100+ parts

$3.340

1k+ parts

$2.500

10k+ parts

$2.500

34,745

$3.720

$3.340

$2.500

$2.500

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$4.284

100+ parts

$3.942

1k+ parts

$3.694

10k+ parts

-

100

$4.284

$3.942

$3.694

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Continental Prestige Electronics

USA . 4 parts In-Stock

1+ parts

$5.820

100+ parts

$3.910

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4

$5.820

$3.910

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Parana Technologies

USA . 523 parts In-Stock

1+ parts

$8.070

100+ parts

$749.388

1k+ parts

$7.263

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523

$8.070

$749.388

$7.263

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DigiPath Technology Company

USA . 276 parts In-Stock

1+ parts

$8.886

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276

$8.886

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ChromeModa Solutions

Germany . 4,519 parts In-Stock

1+ parts

$9.067

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$7.435

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4,519

$9.067

$7.435

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IDEA Electronic Components Group

UK . 1,712 parts In-Stock

1+ parts

$9.067

100+ parts

$8.614

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$8.160

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1,712

$9.067

$8.614

$8.160

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Corohmni

South Africa . 921 parts In-Stock

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$11.929

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QUARKTWIN TECHNOLOGY LTD

USA . 24,658 parts In-Stock

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Perfect Parts

USA . 16,928 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Lixinc

USA . 5,052 parts In-Stock

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5,052

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Metaverse IC Inc.

Canada . 900 parts In-Stock

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900

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Overview

Enhance your telecommunications projects with the TRF7970ARHBT by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge telecom interface ICs like no other. This versatile component offers a wide range of applications in various industries, providing seamless connectivity and efficient performance. With a focus on reliability and precision, the TRF7970ARHBT ensures optimal functionality and durability. Upgrade your systems today and experience the value and benefits that Texas Instruments products bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

The surface mount capability allows for easy integration into various electronic devices.

Package Shape: SQUARE

The square package shape helps in efficient use of space on a circuit board.

Power Supplies (V): 5

Operating at a power supply of 5V makes this product compatible with standard electronic systems.

No. of Terminals: 32

With 32 terminals, this product offers ample connectivity options for versatile applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier packaging with heat sink/slug and very thin profile design ensures optimal thermal management and space efficiency.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature allows reliable performance even in extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold for terminal finish enhances conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position offers secure and stable connections for enhanced performance.

Maximum Seated Height: 1 mm

The low maximum seated height helps in conserving space on the circuit board.

Width: 5 mm

The compact width of 5mm allows for easy installation in tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

The brief maximum time at peak reflow temperature ensures safe soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure solder joints for reliable operation.

Length: 5 mm

With a length of 5mm, this product offers a space-efficient design for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental standards and regulations.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC provides optimized performance in telecommunications systems.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this product is compatible with standard electronic systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for efficient use of space on the circuit board.

Data Rate: 0.848 Mbps

The data rate of 0.848 Mbps ensures fast and efficient data transfer in telecom applications.

Moisture Sensitivity Level (MSL): 2

With moisture sensitivity level 2, this product can withstand moderate exposure to humidity during storage and handling.

Technical Specifications

Other Function Telecom Interface ICs TRF7970ARHBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.848 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TRF7970ARHBT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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