Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon BGSA14GN10E6327XTSA1 is a 10-terminal chip carrier IC with telecom circuit type. Operating temp range -30 to 85°C, nominal voltage of 2.85V. Used in telecom interfaces due to its compact rectangular package shape and surface mount capability.
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Authorized Procurement Solutions
Perfect Parts
GreenTree Electronics
Allows for easy installation and soldering onto circuit boards.
Provides a compact and space-saving design for efficient PCB layout.
Offers enough connections for various functions without being overwhelming.
Ensures reliability and durability for long-term use in telecom applications.
Can withstand high temperatures, ideal for use in demanding environments.
Functions effectively even in extremely cold conditions.
Facilitates easy connection and integration into existing systems.
Low profile design is suitable for compact electronic devices.
Narrow form factor allows for flexibility in layout and placement.
Compact size makes it suitable for space-constrained applications.
Provides secure connections for reliable performance.
Specifically designed for telecom applications, ensuring compatibility and efficiency.
Operates efficiently at a standard voltage, ensuring stable performance.
Allows for precise positioning of terminals, minimizing risk of shorts.
Other Function Telecom Interface ICs BGSA14GN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
BGSA14GN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
BAV99
Nexperia
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Micro Commercial Components
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
ZED-F9P-01B-01
U-blox Ag
Other Telecom ICs;
NEO-M9N-00B
NEO-M9N-00B by U-blox Ag is a GNSS Module with 24 terminals, operating at -40 to 85°C. It has a data rate of 12 Mbps and operates at 3V supply voltage. This surface-mount module in rectangular shape is ideal for telecom applications requiring precise positioning.
MAX-M8Q
TELECOM CIRCUIT;
CY7B933-JXI
Infineon Technologies
CY7B933-JXI by Infineon Technologies is a telecom interface IC with 1 function and a data rate of 400 Mbps. It operates at a nominal voltage of 5V and has a max seated height of 4.572mm. This IC is commonly used in telecom circuits for various applications.
USB3740B-AI9-TR
Microchip Technology
USB3740B-AI9-TR by Microchip is a telecom IC with 10 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is ideal for telecom circuit applications.
RN52-I/RM
Microchip Technology's RN52-I/RM is a rectangular package IC with 40 terminals, 2.7mm height, and dimensions of 13.5mm x 26mm. It operates at a data rate of 3 Mbps and is used in telecom circuits for various applications requiring surface mount technology.
ZOE-M8G-0
ZOE-M8G-0 by U-blox Ag is a telecom IC with 51 terminals in a square grid array package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 1.8V and thin profile design, it's ideal for telecom circuit applications.
AD9874ABSTZ
Analog Devices
AD9874ABSTZ by Analog Devices is a telecom IC with 48 terminals in a square flatpack package. It operates b/w -40°C to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features gull wing terminals and matte tin finish, suitable for industrial temperature grade applications.
JN5168-001-M06Z
TELECOM CIRCUIT; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 3;
XB3-24AUT-J
Digi International
XB3-24AUT-J by Digi International is a TELECOM CIRCUIT with 1 Mbps Data Rate. Operating Temperature ranges from -40 to 85 °C. It is used in telecom interfaces for various applications due to its RECTANGULAR package shape and SPECIAL SHAPE style.
NRF52840-QIAA
Nordic Semiconductor Asa
NRF52840-QIAA by Nordic Semiconductor Asa is a 73-terminal IC with 3V supply voltage, operating from -40 to 85°C. It features a grid array package style, suitable for industrial telecom circuits. With a 0.5mm terminal pitch and 0.85mm seated height, it offers high performance in compact applications.
CC1190RGVT
Texas Instruments
CC1190RGVT by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with power supplies of 2.5/3.3V. Ideal for industrial applications requiring a compact design and reliable performance.
TSC2000IPW
TSC2000IPW by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, GULL WING terminal form, and SINGLE-ENDED input type. Ideal for telecom circuits due to its small outline package style and industrial temperature grade suitability.
SA602AD
Philips Components
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Nominal Supply Voltage: 6 V;
CLRC66303HNY
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4;
WT12-A-AI4
Silicon Labs
Silicon Labs' WT12-A-AI4 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 31 terminals. Operating from -40 to 85 °C, it's ideal for INDUSTRIAL applications requiring TELECOM CIRCUIT ICs at 3.3 V supply voltage and 1.5 mm terminal pitch.
450-0178C
Ls Research
SPSGRF-915
STMicroelectronics
SPSGRF-915 by STMicroelectronics is a telecom IC with 11 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm. This surface-mount IC is ideal for industrial telecom applications due to its compact rectangular package design.
XB3-24Z8RM-J
The Digi International XB3-24Z8RM-J is a surface mount telecom IC with 34 terminals. It operates in industrial temperature range (-40 to 85°C) and has a rectangular package style (13x19mm). Ideal for telecom circuits, this IC is designed for various applications requiring reliable communication interfaces.
RN4020-V/RM
RN4020-V/RM by Microchip Technology is a telecom IC with 24 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and operates b/w -30°C to 85°C. Ideal for applications requiring surface mount technology in compact spaces.
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BGSA12GN10E6327XTSA1
Infineon BGSA12GN10E6327XTSA1 is a 10-terminal telecom IC with nominal voltage of 2.85V. It operates b/w -30°C to 85°C, in a rectangular chip carrier package style. Suitable for telecom circuits, it has surface mount capability and terminal pitch of 0.4mm.
BGSA11GN10E6327XTSA1
Infineon BGSA11GN10E6327XTSA1 is a 10-terminal telecom IC with nominal voltage of 2.85V. It operates b/w -30°C to 85°C, in a rectangular chip carrier package style. Ideal for telecom circuits, it's surface mountable and has terminals at the bottom with dimensions of 1.1mm width and 1.5mm length.
BGSA13GN10E6327XTSA1
BGSA13GN10E6327XTSA1 by Infineon Technologies is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits. Nominal voltage of 2.85V, ideal for surface mount applications requiring compact design.
BGSA11GN10
Other Telecom ICs; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
BGSA12UGL8
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
BGSA12UGL8E6327XTSA1
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
BGSA12UGL8E6327XTSA1/SAMPLE
BGSA141MN10
BGSA141MN10E6327XTSA1
BGSA143GL10
BGSA143ML10
BGSA143ML10E6327XTSA1
BGSA14GN10
BGSA402ML10
BGSA402ML10E6327XTSA1
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