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BGSA11GN10E6327XTSA1

Infineon Technologies

BGSA11GN10E6327XTSA1 by Infineon Technologies

Infineon BGSA11GN10E6327XTSA1 is a 10-terminal telecom IC with nominal voltage of 2.85V. It operates b/w -30°C to 85°C, in a rectangular chip carrier package style. Ideal for telecom circuits, it's surface mountable and has terminals at the bottom with dimensions of 1.1mm width and 1.5mm length.

Median Price

$0.441

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 7,276 parts In-Stock

1+ parts

$0.419

100+ parts

$0.361

1k+ parts

$0.344

10k+ parts

$0.339

7,276

$0.419

$0.361

$0.344

$0.339

Arrow

USA . 162 parts In-Stock

1+ parts

$0.457

100+ parts

$0.300

1k+ parts

-

10k+ parts

-

162

$0.457

$0.300

-

-

Mouser Electronics

USA . 514 parts In-Stock

1+ parts

$0.680

100+ parts

$0.382

1k+ parts

$0.337

10k+ parts

$0.309

514

$0.680

$0.382

$0.337

$0.309

Newark

USA . 11,728 parts In-Stock

1+ parts

$0.721

100+ parts

$0.403

1k+ parts

$0.346

10k+ parts

-

11,728

$0.721

$0.403

$0.346

-

DigiKey

USA . 336 parts In-Stock

1+ parts

$0.830

100+ parts

$0.461

1k+ parts

$0.395

10k+ parts

$0.378

336

$0.830

$0.461

$0.395

$0.378

Element14

Singapore . 7,276 parts In-Stock

1+ parts

$0.861

100+ parts

-

1k+ parts

-

10k+ parts

-

7,276

$0.861

-

-

-

Rochester

USA . 75,749 parts In-Stock

1+ parts

-

100+ parts

$0.373

1k+ parts

$0.310

10k+ parts

$0.276

75,749

-

$0.373

$0.310

$0.276

Verical

USA . 75,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.388

10k+ parts

$0.345

75,749

-

-

$0.388

$0.345

RS (Exports)

UK . 7,300 parts In-Stock

1+ parts

-

100+ parts

$0.425

1k+ parts

$0.403

10k+ parts

-

7,300

-

$0.425

$0.403

-

Chip1Stop

Japan . 1,073 parts In-Stock

1+ parts

-

100+ parts

$0.356

1k+ parts

-

10k+ parts

-

1,073

-

$0.356

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 188 parts In-Stock

1+ parts

$0.244

100+ parts

-

1k+ parts

-

10k+ parts

-

188

$0.244

-

-

-

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$0.296

-

-

-

Vyrian

USA . 56,268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56,268

-

-

-

-

VNN

France . 4,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,333

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 54,850 parts In-Stock

1+ parts

$0.172

100+ parts

$0.168

1k+ parts

$0.167

10k+ parts

-

54,850

$0.172

$0.168

$0.167

-

Ampacity Inc.

Singapore . 54,839 parts In-Stock

1+ parts

$0.172

100+ parts

-

1k+ parts

-

10k+ parts

-

54,839

$0.172

-

-

-

Corphita

USA . 34 parts In-Stock

1+ parts

$0.231

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$0.231

-

-

-

Argo Parts USA

USA . 4,303 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

10k+ parts

$0.288

4,303

$0.296

-

-

$0.288

Continental Prestige Electronics

USA . 13,341 parts In-Stock

1+ parts

$0.442

100+ parts

-

1k+ parts

-

10k+ parts

-

13,341

$0.442

-

-

-

Modulus Dynamics

Lithuania . 2,290 parts In-Stock

1+ parts

$8.826

100+ parts

$8.473

1k+ parts

$8.120

10k+ parts

-

2,290

$8.826

$8.473

$8.120

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,019

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.282

10k+ parts

$0.276

50

-

$0.291

$0.282

$0.276

Perfect Parts

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Overview

Unlock seamless communication with the BGSA11GN10E6327XTSA1 by Infineon Technologies. Crafted with precision and expertise, this Telecom Interface IC guarantees top-notch quality and reliability. With its surface mount design and compact chip carrier package, this IC is perfect for a wide range of applications. From telecommunications to networking, this versatile product ensures smooth operation and superior performance. Experience the value and benefits of Infineon's cutting-edge technology with the BGSA11GN10E6327XTSA1.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving time and cost.

Package Shape: RECTANGULAR

Rectangular package shape makes the component easier to handle and integrate into circuit designs.

No. of Terminals: 10

Having 10 terminals provides flexibility in connecting the IC to other components or subsystems.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal performance and protection for the IC, ensuring reliable operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the IC to operate in a wide range of environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures the IC can function in cold environments without any issues.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and routing of traces for efficient design implementation.

Maximum Seated Height: 0.4 mm

Low maximum seated height helps in compact PCB designs and reduces the overall profile of the product.

Width: 1.1 mm

Narrow width allows for space-saving integration of the IC into densely populated PCB layouts.

Length: 1.5 mm

Compact length contributes to the overall small form factor of the product, ideal for applications with space constraints.

Terminal Form: BUTT

Butt terminal form provides reliable electrical connections and facilitates automated assembly processes during manufacturing.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and functionality in telecommunications systems.

Nominal Supply Voltage: 2.85 V

Stable nominal supply voltage simplifies power management and ensures consistent operation of the IC within specified limits.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting of the IC on the PCB, increasing the functionality per unit area.

Technical Specifications

Other Function Telecom Interface ICs BGSA11GN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XBCC-B10

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGSA11GN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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