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BGSA12GN10E6327XTSA1

Infineon Technologies

BGSA12GN10E6327XTSA1 by Infineon Technologies

Infineon BGSA12GN10E6327XTSA1 is a 10-terminal telecom IC with nominal voltage of 2.85V. It operates b/w -30°C to 85°C, in a rectangular chip carrier package style. Suitable for telecom circuits, it has surface mount capability and terminal pitch of 0.4mm.

Median Price

$0.429

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,450 parts In-Stock

1+ parts

$0.495

100+ parts

$0.365

1k+ parts

$0.300

10k+ parts

-

2,450

$0.495

$0.365

$0.300

-

Mouser Electronics

USA . 7,864 parts In-Stock

1+ parts

$0.670

100+ parts

$0.372

1k+ parts

$0.307

10k+ parts

$0.286

7,864

$0.670

$0.372

$0.307

$0.286

Rochester

USA . 8,552,830 parts In-Stock

1+ parts

-

100+ parts

$0.373

1k+ parts

$0.310

10k+ parts

$0.276

8,552,830

-

$0.373

$0.310

$0.276

DigiKey

USA . 8,546,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.470

10k+ parts

-

8,546,239

-

-

$0.470

-

Verical

USA . 6,562,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.388

10k+ parts

$0.345

6,562,500

-

-

$0.388

$0.345

EBV Elektronik

Germany . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

Chip1Stop

Japan . 7,500 parts In-Stock

1+ parts

-

100+ parts

$0.308

1k+ parts

$0.227

10k+ parts

$0.222

7,500

-

$0.308

$0.227

$0.222

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 521 parts In-Stock

1+ parts

$0.229

100+ parts

-

1k+ parts

-

10k+ parts

-

521

$0.229

-

-

-

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$0.305

-

-

-

Vyrian

USA . 2,523,752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,523,752

-

-

-

-

IBS Electronics

USA . 195,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.386

195,000

-

-

-

$0.386

NAC Semi

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.636

7,500

-

-

-

$0.636

TME

Poland . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.364

7,500

-

-

-

$0.364

VNN

France . 624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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624

-

-

-

-

ComSIT Distribution GmbH

Germany . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,164,041 parts In-Stock

1+ parts

$0.205

100+ parts

$0.200

1k+ parts

$0.199

10k+ parts

-

2,164,041

$0.205

$0.200

$0.199

-

Ampacity Inc.

Singapore . 2,164,028 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

2,164,028

$0.205

-

-

-

Corphita

USA . 743 parts In-Stock

1+ parts

$0.217

100+ parts

-

1k+ parts

-

10k+ parts

-

743

$0.217

-

-

-

Continental Prestige Electronics

USA . 3,084 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

$0.299

3,084

$0.305

-

-

$0.299

Argo Parts USA

USA . 1,733 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

$0.296

1,733

$0.305

-

-

$0.296

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

$0.290

10k+ parts

$0.284

1,000

$0.305

-

$0.290

$0.284

Modulus Dynamics

Lithuania . 2,098 parts In-Stock

1+ parts

$7.484

100+ parts

$7.185

1k+ parts

$6.885

10k+ parts

-

2,098

$7.484

$7.185

$6.885

-

Aztec Data Supply Inc.

USA . 8,392 parts In-Stock

1+ parts

$9.530

100+ parts

-

1k+ parts

-

10k+ parts

-

8,392

$9.530

-

-

-

Corohmni

South Africa . 648 parts In-Stock

1+ parts

$17.250

100+ parts

-

1k+ parts

-

10k+ parts

-

648

$17.250

-

-

-

Perfect Parts

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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112

-

-

-

-

Overview

Elevate your telecom interface systems with the BGSA12GN10E6327XTSA1 from Infineon Technologies. Known for their top-notch quality and reliability, Infineon brings you a cutting-edge solution that promises seamless performance and durability. This telecom IC is perfect for a wide range of applications, offering superior functionality and efficiency. With its compact design and advanced features, this product ensures maximum value for customers looking to enhance their communication systems. Upgrade your telecom interface experience today with the BGSA12GN10E6327XTSA1.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and quick installation on PCBs, making this product convenient for manufacturers.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, enabling a compact design for the overall system.

No. of Terminals: 10

Having 10 terminals provides flexibility in connectivity options for different circuit configurations and applications.

Package Style: CHIP CARRIER

Chip carrier packages offer good thermal performance and protection for the IC, making it reliable for telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability under various environmental conditions, suitable for telecom applications in diverse settings.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for functionality in cold environments, adding versatility to the product for different deployment scenarios.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering, simplifying manufacturing processes.

Maximum Seated Height: 0.4 mm

Low seated height saves space in the overall system design, enabling compact and slim telecom devices.

Width: 1.1 mm

The narrow width helps in accommodating the IC in tight spaces or densely populated PCB layouts, contributing to the product's versatility.

Length: 1.5 mm

Compact length saves PCB real estate, making this product suitable for space-constrained telecom equipment.

Terminal Form: BUTT

Butt terminal form ensures secure electrical connections, enhancing the reliability of the product in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed as a telecom circuit IC, this product is optimized for telecom functions, ensuring reliable performance in communication systems.

Nominal Supply Voltage: 2.85 V

The nominal supply voltage of 2.85V is commonly used in telecom applications, ensuring compatibility with standard power requirements in the industry.

Terminal Pitch: 0.4 mm

With a small terminal pitch of 0.4mm, this product can accommodate fine-pitch connections, suitable for high-density PCB designs in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs BGSA12GN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XBCC-B10

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGSA12GN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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