Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon BGSA12GN10E6327XTSA1 is a 10-terminal telecom IC with nominal voltage of 2.85V. It operates b/w -30°C to 85°C, in a rectangular chip carrier package style. Suitable for telecom circuits, it has surface mount capability and terminal pitch of 0.4mm.
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Perfect Parts
Surface mount technology allows for easy and quick installation on PCBs, making this product convenient for manufacturers.
Rectangular shape allows for efficient use of space on the PCB, enabling a compact design for the overall system.
Having 10 terminals provides flexibility in connectivity options for different circuit configurations and applications.
Chip carrier packages offer good thermal performance and protection for the IC, making it reliable for telecom applications.
The high maximum operating temperature ensures reliability under various environmental conditions, suitable for telecom applications in diverse settings.
The low minimum operating temperature allows for functionality in cold environments, adding versatility to the product for different deployment scenarios.
Bottom terminal position facilitates easy PCB layout and soldering, simplifying manufacturing processes.
Low seated height saves space in the overall system design, enabling compact and slim telecom devices.
The narrow width helps in accommodating the IC in tight spaces or densely populated PCB layouts, contributing to the product's versatility.
Compact length saves PCB real estate, making this product suitable for space-constrained telecom equipment.
Butt terminal form ensures secure electrical connections, enhancing the reliability of the product in telecom applications.
Specifically designed as a telecom circuit IC, this product is optimized for telecom functions, ensuring reliable performance in communication systems.
The nominal supply voltage of 2.85V is commonly used in telecom applications, ensuring compatibility with standard power requirements in the industry.
With a small terminal pitch of 0.4mm, this product can accommodate fine-pitch connections, suitable for high-density PCB designs in telecom systems.
Other Function Telecom Interface ICs BGSA12GN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
BGSA12GN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
1N4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
BAV99
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Frontier Electronics
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
261
Deltrol Controls
Other Relays;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
BQ51013BYFPR
Texas Instruments
BQ51013BYFPR by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.
BGB741L7ESDE6327XTSA1
TELECOM CIRCUIT; Terminal Finish: GOLD; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1;
MAX-8Q-0-10
U-blox Ag
The U-blox Ag MAX-8Q-0-10 is a surface mount telecom IC with 18 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3V. With a compact size (9.7mm x 10.1mm), it's ideal for applications requiring telecom circuit functionality in tight spaces.
TDA5201XUMA1
TDA5201XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminals, and 5V supply voltage. Ideal for telecom circuits in industrial applications due to its compact size and high temperature range.
NINA-B301-00B-00
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
BLUENRG-132
STMicroelectronics
BLUENRG-132 by STMicroelectronics is a 32-terminal telecom IC with a nominal voltage of 3V. It operates in industrial temperature range (-40 to 105°C) and has a compact square package style (5x5mm). Ideal for telecom circuits, it features surface mount capability and quad terminal position.
LMH0384SQX/NOPB
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: QCCN; Package Shape: SQUARE;
NINA-B112-05B
TELECOM CIRCUIT;
ESP32-D0WDQ6-V3
Espressif Systems (shanghai)
ESP32-D0WDQ6-V3 by Espressif Systems is a surface mount telecom IC with 1 function. It has a square package shape, 48 terminals, and a very thin profile. With a data rate of 150 Mbps, it is suitable for various telecom circuit applications.
SX1302IMLTRT
Semtech
TELECOM CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
DA14531-00000OG2
Dialog Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 17; Package Code: VFBGA; Package Shape: RECTANGULAR;
PCM3060PWR
PCM3060PWR by Texas Instruments is a 2-channel Telecom IC with CMOS technology. It operates b/w -25°C to 85°C, with a supply voltage of 3.3V. The package style is small outline, thin profile, and shrink pitch, making it suitable for telecom circuit applications.
MAX-M8C-0
MAX-M8C-0 by U-blox Ag is a GNSS module with 18 terminals and a rectangular package shape. It operates in temperatures ranging from -40 to 85 °C, making it suitable for industrial applications. With a compact size of 9.7mm width and 10.1mm length, it is ideal for space-constrained projects.
EFR32BG12P432F1024GM48-B
Silicon Labs
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
JODY-W263-00B
CC3135MODRNMMOBR
CC3135MODRNMMOBR by Texas Instruments is a telecom IC with 63 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring reliable communication interfaces in compact spaces. With surface mount capability and nickel gold finish, it offers robust connectivity solutions in various electronic devices.
RN4870-V/RM118
Microchip Technology
RN4870-V/RM118 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and data rate of 0.01 Mbps. It is used in applications requiring a nominal voltage of 3.3V, such as IoT devices and wireless communication systems.
LBEE5HY1MW-230
Murata Manufacturing
Murata Manufacturing's LBEE5HY1MW-230 is a telecom IC with 72 terminals, operating at -30 to 85°C. With a compact size of 7.9mm x 7.3mm x 1.1mm, it has a supply voltage of 3.3V and peak reflow temp of 250°C. Ideal for telecom applications due to its no-lead terminal form and MSL level of 3.
PN5120A0HN1/C2,157
NXP Semiconductors
NXP Semiconductors PN5120A0HN1/C2,157 is a telecom IC with 32 terminals in a square chip carrier package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V for various applications requiring surface mount technology and no-lead terminal form.
BGM13P22F512GE-V2R
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGSA14GN10E6327XTSA1
Infineon BGSA14GN10E6327XTSA1 is a 10-terminal chip carrier IC with telecom circuit type. Operating temp range -30 to 85°C, nominal voltage of 2.85V. Used in telecom interfaces due to its compact rectangular package shape and surface mount capability.
BGSA11GN10E6327XTSA1
Infineon BGSA11GN10E6327XTSA1 is a 10-terminal telecom IC with nominal voltage of 2.85V. It operates b/w -30°C to 85°C, in a rectangular chip carrier package style. Ideal for telecom circuits, it's surface mountable and has terminals at the bottom with dimensions of 1.1mm width and 1.5mm length.
BGSA13GN10E6327XTSA1
BGSA13GN10E6327XTSA1 by Infineon Technologies is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits. Nominal voltage of 2.85V, ideal for surface mount applications requiring compact design.
BGSA11GN10
Other Telecom ICs; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
BGSA12UGL8
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
BGSA12UGL8E6327XTSA1
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
BGSA12UGL8E6327XTSA1/SAMPLE
BGSA141MN10
BGSA141MN10E6327XTSA1
BGSA143GL10
BGSA143ML10
BGSA143ML10E6327XTSA1
BGSA14GN10
BGSA402ML10
Other Telecom ICs;
BGSA402ML10E6327XTSA1
Supply Digital Components
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