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BGSA13GN10E6327XTSA1

Infineon Technologies

BGSA13GN10E6327XTSA1 by Infineon Technologies

BGSA13GN10E6327XTSA1 by Infineon Technologies is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits. Nominal voltage of 2.85V, ideal for surface mount applications requiring compact design.

Median Price

$0.334

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

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30

$1.850

-

-

-

Rochester

USA . 737,500 parts In-Stock

1+ parts

-

100+ parts

$0.299

1k+ parts

$0.248

10k+ parts

$0.221

737,500

-

$0.299

$0.248

$0.221

DigiKey

USA . 737,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.370

10k+ parts

-

737,500

-

-

$0.370

-

Verical

USA . 587,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.277

587,500

-

-

-

$0.277

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.220

-

-

-

Digiode

USA . 356 parts In-Stock

1+ parts

$0.233

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$0.233

-

-

-

DigiKey Marketplace

USA . 737,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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737,500

-

-

-

-

Vyrian

USA . 515,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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515,218

-

-

-

-

Chip Stock

USA . 53,500 parts In-Stock

1+ parts

-

100+ parts

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53,500

-

-

-

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VNN

France . 3,602 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,602

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 515,613 parts In-Stock

1+ parts

$0.208

100+ parts

$0.203

1k+ parts

$0.202

10k+ parts

-

515,613

$0.208

$0.203

$0.202

-

Ampacity Inc.

Singapore . 515,413 parts In-Stock

1+ parts

$0.208

100+ parts

-

1k+ parts

-

10k+ parts

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515,413

$0.208

-

-

-

Continental Prestige Electronics

USA . 6,032 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

$0.215

6,032

$0.220

-

-

$0.215

Argo Parts USA

USA . 1,613 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

$0.213

1,613

$0.220

-

-

$0.213

Corphita

USA . 124 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

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124

$0.220

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-

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Corohmni

South Africa . 177 parts In-Stock

1+ parts

$9.656

100+ parts

-

1k+ parts

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10k+ parts

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177

$9.656

-

-

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Aztec Data Supply Inc.

USA . 35,802 parts In-Stock

1+ parts

$11.196

100+ parts

-

1k+ parts

-

10k+ parts

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35,802

$11.196

-

-

-

Modulus Dynamics

Lithuania . 3,228 parts In-Stock

1+ parts

$12.184

100+ parts

$11.697

1k+ parts

$11.209

10k+ parts

-

3,228

$12.184

$11.697

$11.209

-

RC Electronics

USA . 37,000 parts In-Stock

1+ parts

-

100+ parts

$0.220

1k+ parts

$0.200

10k+ parts

$0.200

37,000

-

$0.220

$0.200

$0.200

QUARKTWIN TECHNOLOGY LTD

USA . 4,549 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,549

-

-

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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50

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-

Overview

Enhance your telecommunications systems with the BGSA13GN10E6327XTSA1 by Infineon Technologies. Known for their top-notch quality and innovative solutions, Infineon Technologies delivers superior performance and reliability in every product. This Telecom Interface IC is designed for seamless integration, offering a compact package shape and surface mount capability for easy installation. Elevate your telecom applications with this versatile component, providing unmatched value, efficiency, and precision. Trust Infineon Technologies to elevate your telecommunications experience.

Feature Benefit Bullets

Surface Mount: YES

Easy and efficient mounting process for use in various applications.

Package Shape: RECTANGULAR

Allows for easy integration into existing circuit designs.

No. of Terminals: 10

Provides multiple connection points for versatile functionality.

Package Style: CHIP CARRIER, VERY THIN PROFILE

Space-saving design ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating conditions.

Minimum Operating Temperature: -30 °C

Can function in extreme temperature environments.

Terminal Position: BOTTOM

Simplifies connection and installation processes.

Maximum Seated Height: 0.4 mm

Enables low-profile circuit designs.

Width: 1.1 mm

Compact size suitable for small electronic devices.

Length: 1.5 mm

Ideal dimensions for miniaturized applications.

Terminal Form: NO LEAD

Environmentally friendly option with no lead content.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecommunications applications.

Nominal Supply Voltage: 2.85 V

Compatible with standard voltage requirements for telecom interfaces.

Terminal Pitch: 0.4 mm

Allows for precise connections in tight spaces.

Technical Specifications

Other Function Telecom Interface ICs BGSA13GN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XBCC-N10

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGSA13GN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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