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BM77SPPS3MC2-0007AA

Microchip Technology

BM77SPPS3MC2-0007AA by Microchip Technology

BM77SPPS3MC2-0007AA by Microchip Technology is a telecom IC with 30 terminals, operating at -20 to 70°C. It has a data rate of 0.1125 Mbps and nominal voltage of 3.3V. This rectangular package is surface mountable and suitable for various telecom interface applications.

Median Price

$15.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

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$15.420

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Chip Stock

USA . 3,524 parts In-Stock

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3,524

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Vyrian

USA . 3,138 parts In-Stock

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3,138

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VNN

France . 800 parts In-Stock

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800

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 341 parts In-Stock

1+ parts

$6.372

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341

$6.372

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AZTECH Wire

Italy . 377 parts In-Stock

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$9.438

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377

$9.438

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Corohmni

South Africa . 922 parts In-Stock

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$12.295

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922

$12.295

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Advanced Electronics

New Zealand . 90 parts In-Stock

1+ parts

$12.664

100+ parts

$12.031

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$12.031

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90

$12.664

$12.031

$12.031

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Continental Prestige Electronics

USA . 5,026 parts In-Stock

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$13.926

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$13.647

5,026

$13.926

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$13.647

Aranea Global

USA . 500 parts In-Stock

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$15.112

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$14.507

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500

$15.112

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$14.507

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Semicontronic

India . 847 parts In-Stock

1+ parts

$784.000

100+ parts

$764.400

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$760.480

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847

$784.000

$764.400

$760.480

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Ampacity Inc.

Singapore . 1,620 parts In-Stock

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$938.000

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Lixinc

USA . 6,660 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,303 parts In-Stock

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RGB Technical Solutions

Ukraine . 4,196 parts In-Stock

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Kepictronics

USA . 3,837 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,535 parts In-Stock

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Argo Parts USA

USA . 2,924 parts In-Stock

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Perfect Parts

USA . 690 parts In-Stock

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690

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Overview

Unlock seamless connectivity with the BM77SPPS3MC2-0007AA by Microchip Technology. Known for their top-notch quality and reliability, Microchip delivers yet another game-changing product in the realm of Other Function Telecom Interface ICs. This versatile device boasts a wide range of applications, promising to enhance your connectivity experience like never before. With its compact design, high performance, and user-friendly interface, the BM77SPPS3MC2-0007AA offers unparalleled value, benefits, and advantages that are sure to exceed your expectations. Elevate your connectivity game today with Microchip Technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for modern manufacturing processes.

Package Shape: RECTANGULAR

Rectangular package shape offers compatibility with standard PCB layouts and allows for efficient use of space on the board.

No. of Terminals: 30

With a high number of terminals, this IC can handle complex telecom interfaces and provide multiple connection options.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand extended operation in diverse environmental conditions.

Nominal Supply Voltage: 3.3 V

Operating at a standard nominal supply voltage of 3.3V, this IC is compatible with common power sources.

Technical Specifications

Other Function Telecom Interface ICs BM77SPPS3MC2-0007AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

Data Rate:

.1125 Mbps

JESD-30 Code:

R-XXMA-N30

Length:

15 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,30LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.86 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.1 mm

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

BM77SPPS3MC2-0007AA Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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