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BLUENRG-MSCSP

STMicroelectronics

BLUENRG-MSCSP by STMicroelectronics

BLUENRG-MSCSP by STMicroelectronics is a telecom IC with 34 terminals, operating at -40 to 85°C. Its grid array package has a very thin profile and fine pitch, suitable for industrial applications requiring a 3V supply voltage. The IC is designed for surface mount assembly in compact devices due to its small dimensions of 2.56mm width and 2.66mm length.

Median Price

$3.330

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$2.593

100+ parts

-

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1,000

$2.593

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Digiode

USA . 2,270 parts In-Stock

1+ parts

$4.066

100+ parts

-

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2,270

$4.066

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ComSIT Distribution GmbH

Germany . 5,633 parts In-Stock

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5,633

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VNN

France . 2,405 parts In-Stock

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2,405

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Vyrian

USA . 1,945 parts In-Stock

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1,945

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LIBRA Elektronik GmbH

Germany . 962 parts In-Stock

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962

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J2 Sourcing AB

Sweden . 653 parts In-Stock

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653

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Anansix

USA . 618 parts In-Stock

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618

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,576 parts In-Stock

1+ parts

$2.374

100+ parts

-

1k+ parts

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10k+ parts

$2.327

5,576

$2.374

-

-

$2.327

Argo Parts USA

USA . 1,045 parts In-Stock

1+ parts

$2.374

100+ parts

-

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1,045

$2.374

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Corohmni

South Africa . 180 parts In-Stock

1+ parts

$2.593

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180

$2.593

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Netroflash

USA . 50 parts In-Stock

1+ parts

$2.593

100+ parts

$2.541

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-

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50

$2.593

$2.541

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Semicontronic

India . 1,972 parts In-Stock

1+ parts

$3.640

100+ parts

$3.549

1k+ parts

$3.531

10k+ parts

-

1,972

$3.640

$3.549

$3.531

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Ampacity Inc.

Singapore . 1,645 parts In-Stock

1+ parts

$3.640

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1,645

$3.640

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Corphita

USA . 4,209 parts In-Stock

1+ parts

$3.852

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4,209

$3.852

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Aztec Data Supply Inc.

USA . 4,808 parts In-Stock

1+ parts

$7.350

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4,808

$7.350

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IDEA Electronic Components Group

UK . 568 parts In-Stock

1+ parts

$13.301

100+ parts

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$11.971

10k+ parts

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568

$13.301

-

$11.971

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$17.705

100+ parts

$16.112

1k+ parts

$14.518

10k+ parts

-

1,000

$17.705

$16.112

$14.518

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MKK Technologies

India . 980 parts In-Stock

1+ parts

$25.012

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980

$25.012

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DigiPath Technology Company

USA . 980 parts In-Stock

1+ parts

$25.012

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980

$25.012

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Kepictronics

USA . 46,062 parts In-Stock

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46,062

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RC Electronics

USA . 37,395 parts In-Stock

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37,395

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Lixinc

USA . 10,772 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,783 parts In-Stock

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6,783

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XScomponents

USA . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 4,522 parts In-Stock

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4,522

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Parana Technologies

USA . 1,995 parts In-Stock

1+ parts

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100+ parts

$15.904

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1,995

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$15.904

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Futuretech Components

Singapore . 151 parts In-Stock

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151

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Overview

Unleash the power of seamless connectivity with the BLUENRG-MSCSP from STMicroelectronics. Crafted by a trusted industry leader, this Telecom Interface IC promises unrivaled quality and reliability. Perfect for a wide range of applications, this versatile product offers customers unparalleled value and convenience. Experience the future of telecom technology with the BLUENRG-MSCSP and stay ahead of the curve in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and stability of the product.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-saving design, ideal for modern electronic devices.

No. of Terminals: 34

Having 34 terminals allows for multiple connections and functionalities within the telecom interface IC.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array design with a very thin profile and fine pitch enables high performance and efficiency in data transmission.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can function reliably even under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to perform at temperatures as low as -40 °C ensures versatility in various operating environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections, enhancing the reliability of the product.

Maximum Seated Height: 0.5 mm

The low maximum seated height of 0.5 mm allows for a compact and streamlined overall design.

Width: 2.56 mm

The 2.56 mm width offers a slim and space-efficient form factor for the telecom interface IC.

Length: 2.66 mm

With a length of 2.66 mm, this product is compact and suitable for integration into small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in demanding industrial applications.

Terminal Form: BUTT

The butt terminal form provides a secure and stable connection for optimized functionality.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring compatibility and efficiency in telecommunications applications.

Nominal Supply Voltage: 3 V

The 3 V nominal supply voltage is common in many electronic systems, offering compatibility and ease of integration.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch allows for precise and reliable connections, critical for telecom interface IC performance.

Technical Specifications

Other Function Telecom Interface ICs BLUENRG-MSCSP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B34

Length:

2.66 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

34

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.56 mm

Trade Compliance

BLUENRG-MSCSP Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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