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BLUENRG-132Y

STMicroelectronics

BLUENRG-132Y by STMicroelectronics

BLUENRG-132Y by STMicroelectronics is a 32-terminal telecom IC with 3V supply voltage, operating from -40 to 105°C. It comes in a square chip carrier package style suitable for industrial applications. With a compact size of 5x5mm and terminal pitch of 0.5mm, it's ideal for telecom circuit interfaces requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,128 parts In-Stock

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4,128

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Vyrian

USA . 1,431 parts In-Stock

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1,431

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VNN

France . 1,151 parts In-Stock

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1,151

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Anansix

USA . 132 parts In-Stock

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132

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Nova Conductors

Japan . 95 parts In-Stock

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 477 parts In-Stock

1+ parts

$8.873

100+ parts

-

1k+ parts

$7.986

10k+ parts

-

477

$8.873

-

$7.986

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Aztec Data Supply Inc.

USA . 948 parts In-Stock

1+ parts

$9.570

100+ parts

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948

$9.570

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Corohmni

South Africa . 83 parts In-Stock

1+ parts

$10.969

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83

$10.969

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AZTECH Wire

Italy . 816 parts In-Stock

1+ parts

$11.668

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816

$11.668

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MKK Technologies

India . 898 parts In-Stock

1+ parts

$16.686

100+ parts

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898

$16.686

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DigiPath Technology Company

USA . 898 parts In-Stock

1+ parts

$16.686

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898

$16.686

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Ampacity Inc.

Singapore . 1,496 parts In-Stock

1+ parts

$641.000

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$641.000

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Argo Parts USA

USA . 4,058 parts In-Stock

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Continental Prestige Electronics

USA . 2,838 parts In-Stock

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Corphita

USA . 1,953 parts In-Stock

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1,953

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Parana Technologies

USA . 593 parts In-Stock

1+ parts

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$10.610

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593

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$10.610

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unleash the power of seamless connectivity with the BLUENRG-132Y by STMicroelectronics. Crafted with precision and innovation, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Stay ahead of the curve with the BLUENRG-132Y and experience the advantages of cutting-edge technology at your fingertips. Elevate your projects to new heights with STMicroelectronics, a trusted manufacturer known for delivering excellence in every product.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation and offers compact design for space-saving solutions.

Package Shape: SQUARE

Square shape provides efficient use of board space and simplified layout design.

No. of Terminals: 32

Sufficient number of terminals for versatile connectivity options in telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style offers heat dissipation and slim profile for enhanced performance.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability in various operating conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in extreme environments.

Terminal Position: QUAD

Quad terminal position facilitates easy connections and soldering processes.

Maximum Seated Height: 1 mm

Low seated height enables installation in compact spaces without sacrificing performance.

Width: 5 mm

Compact width allows for integration into small electronic devices and systems.

Length: 5 mm

Short length contributes to overall space-saving design and efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and provides better soldering reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, providing optimized performance and functionality.

Nominal Supply Voltage: 3 V

Compatible with common voltage requirements in telecom systems for seamless integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and connectivity options for telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs BLUENRG-132Y attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

BLUENRG-132Y Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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