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TLK2711AJRZQE

Texas Instruments

TLK2711AJRZQE by Texas Instruments

TLK2711AJRZQE by Texas Instruments is a telecom interface IC with 80 terminals in a square grid array package. Operating at 2.5V, it has a temperature range of 0-70°C and terminal finish of Tin Silver Copper. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,449 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,449

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Digiode

USA . 4,357 parts In-Stock

1+ parts

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4,357

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,584 parts In-Stock

1+ parts

$6.124

100+ parts

-

1k+ parts

$6.894

10k+ parts

-

1,584

$6.124

-

$6.894

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ChromeModa Solutions

Germany . 6,133 parts In-Stock

1+ parts

$6.881

100+ parts

$5.642

1k+ parts

-

10k+ parts

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6,133

$6.881

$5.642

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

1+ parts

$6.881

100+ parts

-

1k+ parts

$6.193

10k+ parts

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1,982

$6.881

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$6.193

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AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$12.679

100+ parts

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677

$12.679

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One Stop Electronics

USA . 1,201 parts In-Stock

1+ parts

$470.000

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1,201

$470.000

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Semicontronic

India . 1,355 parts In-Stock

1+ parts

$837.000

100+ parts

$816.075

1k+ parts

$811.890

10k+ parts

-

1,355

$837.000

$816.075

$811.890

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Ampacity Inc.

Singapore . 1,535 parts In-Stock

1+ parts

$890.000

100+ parts

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1,535

$890.000

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Lixinc

USA . 10,055 parts In-Stock

1+ parts

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10,055

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A-Z Elektronik GmbH

Germany . 6,968 parts In-Stock

1+ parts

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6,968

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Corphita

USA . 4,158 parts In-Stock

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4,158

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Argo Parts USA

USA . 3,540 parts In-Stock

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3,540

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Continental Prestige Electronics

USA . 2,475 parts In-Stock

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2,475

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DigiPath Technology Company

USA . 1,458 parts In-Stock

1+ parts

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100+ parts

$6.204

1k+ parts

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1,458

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$6.204

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Perfect Parts

USA . 758 parts In-Stock

1+ parts

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758

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

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300

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Microchip USA

USA . 270 parts In-Stock

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270

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Overview

Elevate your telecom interface systems with the TLK2711AJRZQE by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality products that guarantee reliability and performance. The TLK2711AJRZQE is a game-changer in the telecom IC category, offering unparalleled value with its cutting-edge technology and versatile applications. Experience seamless connectivity and enhanced functionality with this innovative product that brings convenience and efficiency to your projects. Trust Texas Instruments to provide you with the best solutions for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the IC, making it durable and resistant to external elements.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape maximizes space utilization on the PCB and allows for efficient routing of traces and connections.

Power Supplies (V): 2.5

Operating at a low voltage of 2.5V helps in reducing power consumption and heat generation, making it energy-efficient.

No. of Terminals: 80

Having 80 terminals provides a high degree of connectivity and functionality, allowing for a wide range of applications and configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact design with a thin profile and fine pitch, enabling high-density mounting and reducing overall PCB footprint.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance under normal operating conditions without risk of overheating.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this IC can function effectively in a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

The Tin Silver Copper terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable signal transmission.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and facilitates easier routing of traces and connections.

Maximum Seated Height: 1 mm

Low seated height of 1mm helps in reducing overall profile and allows for compact designs in space-constrained applications.

Width: 5 mm

With a width of 5mm, this IC can fit into tight spaces on the PCB while still providing ample room for connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature of 260°C ensures proper soldering of the IC without damaging its components.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range makes this IC suitable for applications in standard operating environments.

Terminal Form: BALL

Ball terminal form offers good solder joint reliability and conductivity, ensuring robust connections on the PCB.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, this product is designed specifically for telecommunications applications, ensuring optimized performance and functionality.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures stable and consistent power delivery for reliable IC performance.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this IC offers precise and compact soldering connections, enabling high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this IC has a moderate sensitivity to moisture, requiring proper handling and storage to prevent damage during assembly.

Technical Specifications

Other Function Telecom Interface ICs TLK2711AJRZQE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLK2711AJRZQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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