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TLK2500RCP

Texas Instruments

TLK2500RCP by Texas Instruments

TLK2500RCP by Texas Instruments is a 64-terminal telecom IC with 2.5V supply voltage, operating b/w 0-70°C. Its quad terminal position and gull wing form make it suitable for telecom circuit applications requiring a very thin profile in a square package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,669

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-

-

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Digiode

USA . 2,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 34 parts In-Stock

1+ parts

$11.089

100+ parts

$1,029.736

1k+ parts

$9.980

10k+ parts

-

34

$11.089

$1,029.736

$9.980

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AZTECH Wire

Italy . 708 parts In-Stock

1+ parts

$12.174

100+ parts

-

1k+ parts

-

10k+ parts

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708

$12.174

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DigiPath Technology Company

USA . 1,831 parts In-Stock

1+ parts

$12.210

100+ parts

-

1k+ parts

-

10k+ parts

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1,831

$12.210

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-

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ChromeModa Solutions

Germany . 2,893 parts In-Stock

1+ parts

$12.459

100+ parts

$10.216

1k+ parts

-

10k+ parts

-

2,893

$12.459

$10.216

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-

IDEA Electronic Components Group

UK . 580 parts In-Stock

1+ parts

$12.459

100+ parts

$11.836

1k+ parts

$11.213

10k+ parts

-

580

$12.459

$11.836

$11.213

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One Stop Electronics

USA . 1,052 parts In-Stock

1+ parts

$901.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,052

$901.000

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Corphita

USA . 3,220 parts In-Stock

1+ parts

-

100+ parts

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3,220

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Overview

Unleash the power of seamless communication with the TLK2500RCP by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The TLK2500RCP falls under the category of Telecom Interface ICs, offering unmatched performance for various applications. With its cutting-edge technology and user-friendly design, this product delivers exceptional value to customers by providing efficient and effective communication solutions. Experience the benefits and advantages of the TLK2500RCP today and take your communication game to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the PCB layout, enabling compact and sleek designs.

No. of Terminals: 64

Higher number of terminals allow for increased connectivity options and functionality in the telecom interface.

Package Style: FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

The combination of flatpack, heat sink/slug, thin profile, and fine pitch design ensures optimized thermal management and signal integrity in the IC.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliability and performance under varying environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the IC to function effectively even in cold environments.

Terminal Position: QUAD

Quad terminal position enables easy connection and compatibility with standard PCB layouts and designs.

Maximum Seated Height: 1 mm

Low seated height facilitates slim and compact device designs, ideal for space-constrained applications.

Width: 10 mm

Narrow width makes the IC suitable for applications requiring a small form factor and efficient use of board space.

Length: 10 mm

Short length contributes to a compact overall size of the IC, further enhancing space-saving benefits.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable solder connections, enhancing the durability and longevity of the IC.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimized performance in telecommunications systems.

Nominal Supply Voltage: 2.5 V

Fixed nominal supply voltage simplifies power management and ensures consistent and stable operation of the IC.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for more terminals to be packed into a small space, increasing connectivity options and functionality.

Technical Specifications

Other Function Telecom Interface ICs TLK2500RCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TLK2500RCP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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