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TLK2711JRGQE

Texas Instruments

TLK2711JRGQE by Texas Instruments

TLK2711JRGQE by Texas Instruments is a telecom interface IC with 80 terminals in a square grid array package. Operating at 2.5V, it has a temperature range of 0-70°C and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC features a very thin profile suitable for surface mount applications.

Median Price

$9.765

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,121 parts In-Stock

1+ parts

-

100+ parts

$10.470

1k+ parts

-

10k+ parts

-

1,121

-

$10.470

-

-

Rochester

USA . 1,057 parts In-Stock

1+ parts

-

100+ parts

$9.060

1k+ parts

$8.110

10k+ parts

$7.630

1,057

-

$9.060

$8.110

$7.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 89 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$8.970

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-

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Digiode

USA . 540 parts In-Stock

1+ parts

$9.566

100+ parts

-

1k+ parts

-

10k+ parts

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540

$9.566

-

-

-

DigiKey Marketplace

USA . 1,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,121

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-

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Vyrian

USA . 1,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,047

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,003 parts In-Stock

1+ parts

$8.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,003

$8.560

-

-

-

Semicontronic

India . 819 parts In-Stock

1+ parts

$8.560

100+ parts

$8.346

1k+ parts

$8.303

10k+ parts

-

819

$8.560

$8.346

$8.303

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

$8.522

10k+ parts

$8.342

2,000

$8.970

-

$8.522

$8.342

Continental Prestige Electronics

USA . 865 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

-

10k+ parts

$8.791

865

$8.970

-

-

$8.791

Corphita

USA . 4,410 parts In-Stock

1+ parts

$9.063

100+ parts

-

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4,410

$9.063

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Parana Technologies

USA . 1,039 parts In-Stock

1+ parts

$11.090

100+ parts

-

1k+ parts

$11.550

10k+ parts

-

1,039

$11.090

-

$11.550

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DigiPath Technology Company

USA . 841 parts In-Stock

1+ parts

$12.212

100+ parts

-

1k+ parts

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10k+ parts

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841

$12.212

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-

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ChromeModa Solutions

Germany . 2,119 parts In-Stock

1+ parts

$12.461

100+ parts

$10.218

1k+ parts

-

10k+ parts

-

2,119

$12.461

$10.218

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-

IDEA Electronic Components Group

UK . 218 parts In-Stock

1+ parts

$12.461

100+ parts

$11.838

1k+ parts

$11.215

10k+ parts

-

218

$12.461

$11.838

$11.215

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Argo Parts USA

USA . 3,915 parts In-Stock

1+ parts

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100+ parts

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3,915

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Microchip USA

USA . 400 parts In-Stock

1+ parts

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400

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-

Overview

Elevate your telecommunications projects to the next level with the TLK2711JRGQE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This telecom interface IC boasts a compact square package body made of high-quality plastic/epoxy material, allowing for efficient surface mounting. With 80 terminals and a terminal pitch of 0.5mm, this IC is perfect for various telecom circuit applications. Experience seamless connectivity and superior performance with the TLK2711JRGQE - innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into circuit boards.

Package Shape: SQUARE

The square package shape provides efficient use of space on the circuit board.

Power Supplies (V): 2.5

The power supply voltage of 2.5V is commonly used in telecom applications, ensuring compatibility.

No. of Terminals: 80

The high number of terminals allows for versatile connectivity options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style enable high-density mounting and efficient signal routing.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in colder environments without issues.

Terminal Position: BOTTOM

The terminal position on the bottom facilitates easy connections and maintenance.

Maximum Seated Height: 1 mm

The low maximum seated height ensures compatibility with slim devices and space-constrained designs.

Width: 5 mm

The compact width makes the product suitable for small form factor applications.

Length: 5 mm

The short length contributes to space-saving on the circuit board.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates standard operating temperature range for commercial applications.

Terminal Form: BALL

The ball terminal form ensures reliable electrical connections and withstands mechanical stress.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in telecommunication systems.

Nominal Supply Voltage: 2.5 V

The 2.5V nominal supply voltage aligns with common telecom power requirements for seamless integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and precise signal routing.

Technical Specifications

Other Function Telecom Interface ICs TLK2711JRGQE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B80

Length:

5 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TLK2711JRGQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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