Loading...

TLK2711IRCPG4

Texas Instruments

TLK2711IRCPG4 by Texas Instruments

TLK2711IRCPG4 by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and peak reflow temp of 260°C. Ideal for telecom circuits, it features a flatpack package style and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,253

-

-

-

-

Vyrian

USA . 3,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,876

-

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 407 parts In-Stock

1+ parts

$15.220

100+ parts

-

1k+ parts

$15.618

10k+ parts

-

407

$15.220

-

$15.618

-

AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$15.987

100+ parts

-

1k+ parts

-

10k+ parts

-

766

$15.987

-

-

-

ChromeModa Solutions

Germany . 3,360 parts In-Stock

1+ parts

$17.101

100+ parts

$14.023

1k+ parts

-

10k+ parts

-

3,360

$17.101

$14.023

-

-

IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$17.101

100+ parts

$16.246

1k+ parts

$15.391

10k+ parts

-

400

$17.101

$16.246

$15.391

-

Semicontronic

India . 1,045 parts In-Stock

1+ parts

$311.000

100+ parts

$303.225

1k+ parts

$301.670

10k+ parts

-

1,045

$311.000

$303.225

$301.670

-

One Stop Electronics

USA . 245 parts In-Stock

1+ parts

$597.000

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$597.000

-

-

-

Ampacity Inc.

Singapore . 423 parts In-Stock

1+ parts

$788.000

100+ parts

-

1k+ parts

-

10k+ parts

-

423

$788.000

-

-

-

Corphita

USA . 4,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,506

-

-

-

-

Argo Parts USA

USA . 3,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,542

-

-

-

-

Continental Prestige Electronics

USA . 3,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,371

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 2,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,582

-

-

-

-

DigiPath Technology Company

USA . 1,880 parts In-Stock

1+ parts

-

100+ parts

$15.418

1k+ parts

-

10k+ parts

-

1,880

-

$15.418

-

-

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Microchip USA

USA . 323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

323

-

-

-

-

Overview

Discover the cutting-edge TLK2711IRCPG4 by Texas Instruments, a top-quality Telecom Interface IC that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is ideal for a wide range of applications in the telecommunications industry. From its innovative design to its high-quality materials, the TLK2711IRCPG4 delivers exceptional value and benefits to customers seeking advanced telecom solutions. Trust Texas Instruments to provide you with the best in class products for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.5

Operates at a low voltage, which is ideal for telecom applications and helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments where temperature fluctuations may occur.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent electrical conductivity and corrosion resistance, ensuring reliable performance over time.

Width: 10 mm

Compact size allows for efficient use of space on a circuit board, especially in applications where space is limited.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering processes, ensuring proper and secure connections.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings where temperatures may vary, providing consistent performance.

Moisture Sensitivity Level (MSL): 3

Has a moderate moisture sensitivity level, making it suitable for a variety of environments without risk of damage from moisture exposure.

Technical Specifications

Other Function Telecom Interface ICs TLK2711IRCPG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2711IRCPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19