Loading...

TLK2501IRCPR

Texas Instruments

TLK2501IRCPR by Texas Instruments

TLK2501IRCPR by Texas Instruments is a telecom IC with 2.5V supply voltage, 2500 Mbps data rate, and operates in industrial temperature range. It comes in a square package with 64 terminals for surface mount applications. Ideal for high-speed communication systems requiring reliable performance in harsh environments.

Median Price

$18.290

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 51,195 parts In-Stock

1+ parts

$15.530

100+ parts

$15.220

1k+ parts

$14.910

10k+ parts

-

51,195

$15.530

$15.220

$14.910

-

Texas Instruments

USA . 16,805 parts In-Stock

1+ parts

$21.049

100+ parts

$18.386

1k+ parts

$12.680

10k+ parts

-

16,805

$21.049

$18.386

$12.680

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 246 parts In-Stock

1+ parts

$19.997

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$19.997

-

-

-

Vyrian

USA . 7,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,137

-

-

-

-

QIE Inc.

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,747 parts In-Stock

1+ parts

$6.582

100+ parts

$611.279

1k+ parts

$5.924

10k+ parts

-

1,747

$6.582

$611.279

$5.924

-

DigiPath Technology Company

USA . 350 parts In-Stock

1+ parts

$7.248

100+ parts

$6.668

1k+ parts

-

10k+ parts

-

350

$7.248

$6.668

-

-

IDEA Electronic Components Group

UK . 845 parts In-Stock

1+ parts

$7.396

100+ parts

-

1k+ parts

$6.656

10k+ parts

-

845

$7.396

-

$6.656

-

ChromeModa Solutions

Germany . 628 parts In-Stock

1+ parts

$7.396

100+ parts

$6.065

1k+ parts

-

10k+ parts

-

628

$7.396

$6.065

-

-

AZTECH Wire

Italy . 1,082 parts In-Stock

1+ parts

$14.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,082

$14.080

-

-

-

Corphita

USA . 2,741 parts In-Stock

1+ parts

$18.944

100+ parts

-

1k+ parts

-

10k+ parts

-

2,741

$18.944

-

-

-

S.R.D Solutions

India . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 8,209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,209

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Kepictronics

USA . 962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

962

-

-

-

-

Overview

Elevate your telecom interface solutions with the TLK2501IRCPR by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Whether you're in need of high-speed data transmission or secure communication networks, this telecom IC is designed to exceed expectations. With a wide range of applications and industrial-grade performance, the TLK2501IRCPR delivers value, efficiency, and innovation. Experience the advantages of cutting-edge technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing overall system size.

Power Supplies (V): 2.5

Operating at a low voltage of 2.5V helps in reducing power consumption and heat dissipation, making it energy-efficient.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

The combination of flatpack, heat sink/slug, very thin profile, and fine pitch design allows for efficient heat dissipation and compact packaging, suitable for high-performance telecom applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40 to 85°C) ensures reliable operation in harsh environments without compromising performance.

Data Rate: 2500 Mbps

High data rate of 2500 Mbps enables fast and reliable communication, making it suitable for high-speed telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs TLK2501IRCPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

2500 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2501IRCPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19