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BGS14PN10E6327XTSA1

Infineon Technologies

BGS14PN10E6327XTSA1 by Infineon Technologies

BGS14PN10E6327XTSA1 by Infineon is a Telecom IC with 10 terminals in a very thin profile chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a supply voltage of 2.85V, it is designed for telecom circuit applications.

Median Price

$0.544

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9 parts In-Stock

1+ parts

$0.156

100+ parts

-

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9

$0.156

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Mouser Electronics

USA . 18,444 parts In-Stock

1+ parts

$0.730

100+ parts

$0.407

1k+ parts

$0.351

10k+ parts

$0.322

18,444

$0.730

$0.407

$0.351

$0.322

Newark

USA . 7,037 parts In-Stock

1+ parts

$0.752

100+ parts

$0.419

1k+ parts

$0.362

10k+ parts

-

7,037

$0.752

$0.419

$0.362

-

Future Electronics

Canada . 30 parts In-Stock

1+ parts

$0.820

100+ parts

$0.725

1k+ parts

$0.610

10k+ parts

$0.555

30

$0.820

$0.725

$0.610

$0.555

Verical

USA . 22,500 parts In-Stock

1+ parts

-

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$0.491

22,500

-

-

-

$0.491

RS (Exports)

UK . 17,500 parts In-Stock

1+ parts

-

100+ parts

$0.611

1k+ parts

$0.553

10k+ parts

-

17,500

-

$0.611

$0.553

-

DigiKey

USA . 13,039 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

$0.378

13,039

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-

-

$0.378

Farnell

UK . 5,846 parts In-Stock

1+ parts

-

100+ parts

$0.535

1k+ parts

$0.373

10k+ parts

$0.306

5,846

-

$0.535

$0.373

$0.306

Element14

Singapore . 5,846 parts In-Stock

1+ parts

-

100+ parts

$0.554

1k+ parts

$0.386

10k+ parts

$0.318

5,846

-

$0.554

$0.386

$0.318

Chip1Stop

Japan . 1,274 parts In-Stock

1+ parts

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1,274

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Rochester

USA . 67 parts In-Stock

1+ parts

-

100+ parts

$0.389

1k+ parts

$0.323

10k+ parts

$0.287

67

-

$0.389

$0.323

$0.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 877 parts In-Stock

1+ parts

$0.292

100+ parts

-

1k+ parts

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877

$0.292

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-

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Nova Conductors

Japan . 33 parts In-Stock

1+ parts

$0.409

100+ parts

-

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33

$0.409

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-

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IBS Electronics

USA . 30 parts In-Stock

1+ parts

$1.129

100+ parts

$0.996

1k+ parts

$0.834

10k+ parts

$0.449

30

$1.129

$0.996

$0.834

$0.449

VNN

France . 33,315 parts In-Stock

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33,315

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Vyrian

USA . 11,822 parts In-Stock

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11,822

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Sensible Micro Corp

USA . 190 parts In-Stock

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190

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,195 parts In-Stock

1+ parts

$0.261

100+ parts

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12,195

$0.261

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Semicontronic

India . 12,167 parts In-Stock

1+ parts

$0.261

100+ parts

$0.254

1k+ parts

$0.253

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12,167

$0.261

$0.254

$0.253

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Corphita

USA . 277 parts In-Stock

1+ parts

$0.276

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277

$0.276

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Modulus Dynamics

Lithuania . 3,350 parts In-Stock

1+ parts

$0.376

100+ parts

$0.361

1k+ parts

$0.346

10k+ parts

-

3,350

$0.376

$0.361

$0.346

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Corohmni

South Africa . 90 parts In-Stock

1+ parts

$0.376

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90

$0.376

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Argo Parts USA

USA . 1,552 parts In-Stock

1+ parts

$0.409

100+ parts

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1k+ parts

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10k+ parts

$0.397

1,552

$0.409

-

-

$0.397

Component Stockers USA

USA . 64,091 parts In-Stock

1+ parts

$0.460

100+ parts

$0.320

1k+ parts

$0.320

10k+ parts

$0.290

64,091

$0.460

$0.320

$0.320

$0.290

Aztec Data Supply Inc.

USA . 14,330 parts In-Stock

1+ parts

$6.547

100+ parts

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14,330

$6.547

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Perfect Parts

USA . 23,232 parts In-Stock

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23,232

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Continental Prestige Electronics

USA . 10,408 parts In-Stock

1+ parts

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100+ parts

$0.419

1k+ parts

$0.281

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10,408

-

$0.419

$0.281

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$0.401

1k+ parts

$0.389

10k+ parts

$0.380

2,000

-

$0.401

$0.389

$0.380

Overview

Unlock the power of seamless communication with the BGS14PN10E6327XTSA1 from Infineon Technologies. Designed with precision and expertise, this telecom interface IC offers unparalleled quality and reliability for various applications. With a compact chip carrier design and industrial-grade temperature range, this product ensures optimal performance in any environment. Experience the value of smooth connectivity and enhanced functionality with the BGS14PN10E6327XTSA1, setting new standards in telecom circuit technology. Elevate your communication systems with this advanced solution from Infineon Technologies.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product a user-friendly choice for manufacturers.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of PCB real estate, ensuring space-saving and compact design for the overall product.

No. of Terminals: 10

With 10 terminals, this product offers versatility in connectivity options, allowing for multiple interfaces and connections to be utilized.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can be used in a wide range of environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C ensures reliability and functionality in harsh and extreme conditions.

Nominal Supply Voltage: 2.85 V

The nominal supply voltage of 2.85V offers energy efficiency and compatibility with a wide range of power sources, making this product suitable for various applications.

Technical Specifications

Other Function Telecom Interface ICs BGS14PN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XQCC-N10

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.1 mm

Trade Compliance

BGS14PN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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