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BGS13PN10E6327XTSA1

Infineon Technologies

BGS13PN10E6327XTSA1 by Infineon Technologies

BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.

Median Price

$0.292

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,153,604 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

1,153,604

-

$0.304

$0.252

$0.225

Verical

USA . 1,135,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.281

1,135,317

-

-

-

$0.281

Chip1Stop

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

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10

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-

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Distributors (In-Stock)

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Digiode

USA . 113 parts In-Stock

1+ parts

$0.237

100+ parts

-

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113

$0.237

-

-

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Nova Conductors

Japan . 97 parts In-Stock

1+ parts

$0.246

100+ parts

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97

$0.246

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Vyrian

USA . 7,996 parts In-Stock

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7,996

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VNN

France . 5,063 parts In-Stock

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5,063

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DigiKey Marketplace

USA . 4,747 parts In-Stock

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4,747

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Bristol Electronics

USA . 4,028 parts In-Stock

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4,028

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Distributors (Availability)

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Ampacity Inc.

Singapore . 762,766 parts In-Stock

1+ parts

$0.212

100+ parts

-

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762,766

$0.212

-

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Corphita

USA . 133 parts In-Stock

1+ parts

$0.224

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133

$0.224

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.241

100+ parts

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1k+ parts

$0.231

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2,000

$0.241

-

$0.231

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Continental Prestige Electronics

USA . 3,566 parts In-Stock

1+ parts

$0.246

100+ parts

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1k+ parts

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10k+ parts

$0.241

3,566

$0.246

-

-

$0.241

Argo Parts USA

USA . 2,187 parts In-Stock

1+ parts

$0.246

100+ parts

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1k+ parts

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10k+ parts

$0.238

2,187

$0.246

-

-

$0.238

Modulus Dynamics

Lithuania . 2,001 parts In-Stock

1+ parts

$0.278

100+ parts

$0.267

1k+ parts

$0.256

10k+ parts

-

2,001

$0.278

$0.267

$0.256

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AZTECH Wire

Italy . 158 parts In-Stock

1+ parts

$14.210

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158

$14.210

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Perfect Parts

USA . 16,800 parts In-Stock

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16,800

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Legend Electronics Inc. (Excess)

USA . 8,097 parts In-Stock

1+ parts

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8,097

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Speed Components Ltd (Excess)

Israel . 8,097 parts In-Stock

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8,097

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Overview

Discover the cutting-edge BGS13PN10E6327XTSA1 by Infineon Technologies, a top-tier manufacturer known for its superior quality and innovative technology. This telecom interface IC offers unmatched performance and reliability in a compact chip carrier package, making it ideal for a wide range of applications. With a nominal supply voltage of 2.85V and industrial temperature grade, this product delivers exceptional value and benefits to customers seeking high-quality solutions for their telecom circuit needs. Experience the advantages of Infineon's expertise with the BGS13PN10E6327XTSA1 today.

Feature Benefit Bullets

Surface Mount: YES

This product is easy to install and saves space on the PCB due to surface mount packaging.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on the PCB, maximizing space utilization.

No. of Terminals: 10

With 10 terminals, this product offers versatile connectivity options for various telecom applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides protection and durability for the IC, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

This telecom IC can operate effectively even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures makes this product versatile and adaptable to different operating conditions.

Terminal Finish: TIN

The use of tin as the terminal finish ensures good electrical conductivity and reliability in signal transmission.

Terminal Position: BOTTOM

The bottom terminal position allows for easy soldering and connection on the PCB.

Maximum Seated Height: 0.4 mm

The low seated height of the IC saves space and enables slim design of the overall telecom system.

Width: 1.1 mm

This slim width makes the IC suitable for compact telecom devices where space is a constraint.

Length: 1.5 mm

The short length of the IC contributes to a compact design and efficient layout on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BUTT

The butt terminal form simplifies the connection process, making it user-friendly for telecom engineers and technicians.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC offers specialized features and functions for telecommunications systems.

Nominal Supply Voltage: 2.85 V

The nominal supply voltage of 2.85 V is ideal for telecom devices, providing stable power for consistent operation.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for dense packing of terminals on the IC, maximizing connectivity options.

Technical Specifications

Other Function Telecom Interface ICs BGS13PN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XBCC-B10

JESD-609 Code:

e3

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGS13PN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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