Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.
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This product is easy to install and saves space on the PCB due to surface mount packaging.
The rectangular shape of the package allows for efficient placement on the PCB, maximizing space utilization.
With 10 terminals, this product offers versatile connectivity options for various telecom applications.
The chip carrier package style provides protection and durability for the IC, ensuring reliable performance.
This telecom IC can operate effectively even in high-temperature environments, making it suitable for industrial applications.
The ability to function in low temperatures makes this product versatile and adaptable to different operating conditions.
The use of tin as the terminal finish ensures good electrical conductivity and reliability in signal transmission.
The bottom terminal position allows for easy soldering and connection on the PCB.
The low seated height of the IC saves space and enables slim design of the overall telecom system.
This slim width makes the IC suitable for compact telecom devices where space is a constraint.
The short length of the IC contributes to a compact design and efficient layout on the PCB.
The industrial temperature grade ensures reliable performance in harsh operating conditions.
The CMOS technology used in this product offers low power consumption and high noise immunity for efficient operation.
The butt terminal form simplifies the connection process, making it user-friendly for telecom engineers and technicians.
Specifically designed for telecom applications, this IC offers specialized features and functions for telecommunications systems.
The nominal supply voltage of 2.85 V is ideal for telecom devices, providing stable power for consistent operation.
The small terminal pitch of 0.4 mm allows for dense packing of terminals on the IC, maximizing connectivity options.
Other Function Telecom Interface ICs BGS13PN10E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
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No. of Terminals:
Maximum Operating Temperature:
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BGS13PN10E6327XTSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
1N4148WT
Sangdest Microelectronics (Nanjing)
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
BLUENRG-M0A
BLUENRG-M0A by STMicroelectronics is a telecom IC with 11 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring low power consumption and compact design in surface-mount assemblies.
GS2972-IBE3
Semtech
Semtech's GS2972-IBE3 is a telecom IC with 100 terminals in a square package. It operates b/w -20°C to 85°C, with a low profile grid array style. Featuring TIN SILVER COPPER finish, it has a 1.2V supply voltage and is ideal for telecom interface applications.
ATWILC3000-MR110UA
Microchip Technology
ATWILC3000-MR110UA by Microchip Technology is a telecom IC with 36 terminals, operating at 3.3V. It offers a data rate of 65 Mbps and operates b/w -40 to 85°C. Ideal for applications requiring high-speed wireless communication in compact devices.
SL2S2002FTB,115
NXP Semiconductors
The NXP Semiconductors SL2S2002FTB,115 is a small outline, very thin profile IC with 3 terminals and CMOS technology. It operates in industrial temperature range (-40 to 85 °C) and is suitable for telecom circuit applications. The package material is plastic/epoxy, surface mountable with tin finish terminals at 0.55mm pitch.
SAM-M8Q-0
U-blox Ag
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
NINA-B112-01B-00
TELECOM CIRCUIT;
CYBLE-214015-01
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
RFSA3513TR7
Rf Micro Devices
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
MLX90109EDC-AAA-000-RE
Melexis N V
MLX90109EDC-AAA-000-RE by Melexis N V is an 8-terminal telecom IC with a small outline package. Operating from -40 to 85°C, it has a nominal voltage of 5V and matte tin terminal finish. Widely used in telecom circuits, this IC is designed for industrial-grade applications.
MAX-M8W-0-10
MAX-M8W-0-10 by U-blox Ag is a GNSS module with 18 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a compact size of 2.5mm width and 10.1mm length. This module is suitable for various applications requiring precise positioning and navigation capabilities.
NEO-M8T-0
NEO-M8T-0 by U-blox Ag is a telecom IC with 24 terminals, operating from -40 to 85°C. With a compact size of 12.2mm x 16mm and low supply voltage of 3V, it's ideal for industrial applications requiring precise positioning and timing accuracy. Its no-lead terminal form and dual position make it suitable for various telecom circuit designs.
M2-JODY-W377-00C
NEO-M8Q-01A
SN65HVD1050QDRQ1
Texas Instruments
SN65HVD1050QDRQ1 by Texas Instruments is an AEC-Q100 compliant telecom IC with 5V supply, 1Mbps data rate, and 0.07mA max supply current. It is ideal for automotive applications due to its operating temperature range of -40 to 125°C and small outline package style.
XB3-24Z8RM-J
Digi International
The Digi International XB3-24Z8RM-J is a surface mount telecom IC with 34 terminals. It operates in industrial temperature range (-40 to 85°C) and has a rectangular package style (13x19mm). Ideal for telecom circuits, this IC is designed for various applications requiring reliable communication interfaces.
NEO-M8U-06B
NEO-M8U-06B by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and MSL level of 4, suitable for industrial applications requiring precise positioning and timing. The compact rectangular package measures 12.2mm x 16mm with a low seated height of 2.6mm, making it ideal for surface mount designs in automotive or IoT devices.
RFFC2071ATR13
Qorvo
RFFC2071ATR13 by Qorvo is a surface mount telecom interface IC with 32 terminals. It operates in an industrial temperature range of -40 to 85 °C and has a very thin profile with a seated height of 0.95 mm. This CMOS technology chip carrier is commonly used in telecom circuits with a nominal voltage of 3 V.
RS9116W-DB00-CC1-B2A
Silicon Labs
453-00006
Laird Technologies
453-00006 by Laird Technologies is a surface mount IC with 39 terminals, operating from -40 to 85°C. With a compact rectangular package style, it's ideal for telecom circuits requiring a 3V supply voltage. This industrial-grade IC has a peak reflow temp of 260°C and low seated height of 2.33mm, making it suitable for various telecom interface applications.
MAX-M8Q
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGS12SN6E6327XTSA1
BGS12SN6E6327XTSA1 by Infineon Technologies is a telecom interface IC with 6 terminals, chip carrier package style, and operating temperatures from -30 to 85°C. It is surface mountable and suitable for telecom circuit applications with a nominal voltage of 2.6V.
BGS14PN10E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGS12PN10E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGS18GA14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Shape: SQUARE; Nominal Supply Voltage: 3 V;
BGS12AL74E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13S2N9E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: SQUARE;
BGS15AN16E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
BGS13SN8E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 8; Package Code: BCC; Package Shape: SQUARE;
BGS13GA14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 14; Package Code: BCC; Package Shape: SQUARE;
BGS12S3N6E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13PN10
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13GA14E6327
BGS12S3N6
BGS12AL7-6
BGS13S2N9
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 9; Package Code: VFLGA; Package Shape: SQUARE;
BGS12AL7-4
BGS12AL76E6327XTMA1
BGS12SL6E6327XTSA1
BGS12PN10
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VSON; Package Shape: RECTANGULAR;
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