Loading...

BGS18GA14E6327XTSA1

Infineon Technologies

BGS18GA14E6327XTSA1 by Infineon Technologies

BGS18GA14E6327XTSA1 by Infineon Technologies is a telecom interface IC with 14 terminals in a square package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits requiring a nominal voltage of 3V. With surface mount capability and compact dimensions of 2x2mm, it is ideal for microelectronic assembly applications.

Median Price

$0.500

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 179,770 parts In-Stock

1+ parts

-

100+ parts

$0.491

1k+ parts

$0.408

10k+ parts

$0.363

179,770

-

$0.491

$0.408

$0.363

Verical

USA . 94,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.509

10k+ parts

$0.454

94,500

-

-

$0.509

$0.454

Chip1Stop

Japan . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 252 parts In-Stock

1+ parts

$0.383

100+ parts

-

1k+ parts

-

10k+ parts

-

252

$0.383

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.659

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.659

-

-

-

Chip Stock

USA . 65,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65,690

-

-

-

-

VNN

France . 5,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,851

-

-

-

-

Vyrian

USA . 4,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,028

-

-

-

-

EPE Components Inc.

USA . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Bristol Electronics

USA . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Prism Electronics

USA . 47 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

47

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 71,858 parts In-Stock

1+ parts

$0.343

100+ parts

-

1k+ parts

-

10k+ parts

-

71,858

$0.343

-

-

-

Corphita

USA . 308 parts In-Stock

1+ parts

$0.363

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$0.363

-

-

-

Argo Parts USA

USA . 109 parts In-Stock

1+ parts

$0.514

100+ parts

-

1k+ parts

-

10k+ parts

$0.499

109

$0.514

-

-

$0.499

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.524

100+ parts

$0.524

1k+ parts

$0.524

10k+ parts

-

500

$0.524

$0.524

$0.524

-

Modulus Dynamics

Lithuania . 4,322 parts In-Stock

1+ parts

$9.213

100+ parts

$8.844

1k+ parts

$8.476

10k+ parts

-

4,322

$9.213

$8.844

$8.476

-

Aztec Data Supply Inc.

USA . 46,202 parts In-Stock

1+ parts

$12.050

100+ parts

-

1k+ parts

-

10k+ parts

-

46,202

$12.050

-

-

-

Corohmni

South Africa . 579 parts In-Stock

1+ parts

$16.454

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$16.454

-

-

-

AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$17.310

100+ parts

-

1k+ parts

-

10k+ parts

-

732

$17.310

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.646

1k+ parts

$0.626

10k+ parts

$0.613

1,000

-

$0.646

$0.626

$0.613

Perfect Parts

USA . 282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

282

-

-

-

-

Overview

Experience top-notch quality and performance with the BGS18GA14E6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies has crafted this telecom interface IC to meet the highest standards of reliability and efficiency. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers looking for a dependable solution for their electronic needs. Upgrade your telecom circuit with the BGS18GA14E6327XTSA1 and experience seamless functionality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Package Shape: SQUARE

The square package shape can help optimize space on the circuit board, allowing for a more compact design.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting to other components and allows for various functionality options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions without overheating.

Nominal Supply Voltage: 3 V

Operating at a common supply voltage of 3V makes this product compatible with a wide range of systems and applications.

Technical Specifications

Other Function Telecom Interface ICs BGS18GA14E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-XQMA-B14

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

.65 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Width:

2 mm

Trade Compliance

BGS18GA14E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19