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BGS13S2N9E6327XTSA1

Infineon Technologies

BGS13S2N9E6327XTSA1 by Infineon Technologies

BGS13S2N9E6327XTSA1 by Infineon is a telecom IC with 9 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With MOS technology and a nominal voltage of 3V, it's ideal for telecom circuit applications.

Median Price

$0.100

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,462 parts In-Stock

1+ parts

$0.023

100+ parts

$0.022

1k+ parts

$0.021

10k+ parts

-

2,462

$0.023

$0.022

$0.021

-

Rochester

USA . 156,160 parts In-Stock

1+ parts

-

100+ parts

$0.118

1k+ parts

$0.098

10k+ parts

$0.088

156,160

-

$0.118

$0.098

$0.088

Verical

USA . 100,515 parts In-Stock

1+ parts

-

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$0.110

100,515

-

-

-

$0.110

DigiKey

USA . 22,031 parts In-Stock

1+ parts

-

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$0.100

22,031

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$0.100

Chip1Stop

Japan . 2,462 parts In-Stock

1+ parts

-

100+ parts

$0.091

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-

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2,462

-

$0.091

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Distributors (In-Stock)

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Digiode

USA . 185 parts In-Stock

1+ parts

$0.024

100+ parts

-

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185

$0.024

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Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$0.069

100+ parts

-

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61

$0.069

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DigiKey Marketplace

USA . 186,160 parts In-Stock

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Vyrian

USA . 43,083 parts In-Stock

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Cyclops Electronics Ltd

UK . 12,030 parts In-Stock

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12,030

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Bristol Electronics

USA . 11,167 parts In-Stock

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VNN

France . 2,927 parts In-Stock

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2,927

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Distributors (Availability)

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Ampacity Inc.

Singapore . 68,660 parts In-Stock

1+ parts

$0.019

100+ parts

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68,660

$0.019

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Corphita

USA . 611 parts In-Stock

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$0.022

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611

$0.022

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

$0.065

10k+ parts

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100

$0.068

-

$0.065

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Argo Parts USA

USA . 3,373 parts In-Stock

1+ parts

$0.069

100+ parts

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1k+ parts

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10k+ parts

$0.067

3,373

$0.069

-

-

$0.067

Continental Prestige Electronics

USA . 482 parts In-Stock

1+ parts

$0.069

100+ parts

-

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$0.068

482

$0.069

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-

$0.068

Component Stockers USA

USA . 276,471 parts In-Stock

1+ parts

$0.100

100+ parts

$0.090

1k+ parts

$0.060

10k+ parts

$0.090

276,471

$0.100

$0.090

$0.060

$0.090

Modulus Dynamics

Lithuania . 1,556 parts In-Stock

1+ parts

$16.953

100+ parts

$16.275

1k+ parts

$15.597

10k+ parts

-

1,556

$16.953

$16.275

$15.597

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QUARKTWIN TECHNOLOGY LTD

USA . 10,726 parts In-Stock

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10,726

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Authorized Procurement Solutions

USA . 1,495 parts In-Stock

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1,495

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Overview

Unlock the power of seamless connectivity with the BGS13S2N9E6327XTSA1 by Infineon Technologies. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Its versatile applications in various industries make it a must-have for your next project. Experience the value and benefits of smooth communication, enhanced efficiency, and superior performance with this state-of-the-art product. Upgrade your technology game with the BGS13S2N9E6327XTSA1 and stay ahead of the curve.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient installation on PCBs, saving time and resources during production.

No. of Terminals: 9

Having a reasonable number of terminals makes the product versatile for various applications without being overly complex.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even under challenging conditions.

Technology: MOS

The MOS technology used in this product offers high performance and efficiency in telecom interface applications.

Nominal Supply Voltage: 3 V

The 3V supply voltage is common in many applications, making integration and compatibility easier.

Technical Specifications

Other Function Telecom Interface ICs BGS13S2N9E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-XBGA-B9

JESD-609 Code:

e3

Length:

1.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGS13S2N9E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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