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BGS15AN16E6327XTSA1

Infineon Technologies

BGS15AN16E6327XTSA1 by Infineon Technologies

BGS15AN16E6327XTSA1 by Infineon is a telecom interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, with a nominal voltage of 3.5V. This IC is designed for telecom circuits, featuring a very thin profile and tin terminal finish for surface mount applications.

Median Price

$0.634

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$0.634

1k+ parts

$0.527

10k+ parts

$0.469

55

-

$0.634

$0.527

$0.469

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 133 parts In-Stock

1+ parts

$0.494

100+ parts

-

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133

$0.494

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.738

100+ parts

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50

$0.738

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Vyrian

USA . 12,140 parts In-Stock

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12,140

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VNN

France . 1,620 parts In-Stock

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1,620

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EPE Components Inc.

USA . 1,500 parts In-Stock

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1,500

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Bristol Electronics

USA . 1,500 parts In-Stock

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1,500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 55 parts In-Stock

1+ parts

$0.442

100+ parts

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55

$0.442

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Corphita

USA . 47 parts In-Stock

1+ parts

$0.468

100+ parts

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47

$0.468

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-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.723

100+ parts

-

1k+ parts

$0.694

10k+ parts

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1,000

$0.723

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$0.694

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Continental Prestige Electronics

USA . 2,196 parts In-Stock

1+ parts

$0.738

100+ parts

-

1k+ parts

-

10k+ parts

$0.723

2,196

$0.738

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-

$0.723

Argo Parts USA

USA . 1,608 parts In-Stock

1+ parts

$0.738

100+ parts

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1,608

$0.738

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AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$6.174

100+ parts

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578

$6.174

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Modulus Dynamics

Lithuania . 1,090 parts In-Stock

1+ parts

$7.301

100+ parts

$7.009

1k+ parts

$6.717

10k+ parts

-

1,090

$7.301

$7.009

$6.717

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Aztec Data Supply Inc.

USA . 2,371 parts In-Stock

1+ parts

$8.530

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2,371

$8.530

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Corohmni

South Africa . 193 parts In-Stock

1+ parts

$12.900

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193

$12.900

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RC Electronics

USA . 30,300 parts In-Stock

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30,300

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Perfect Parts

USA . 15,820 parts In-Stock

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15,820

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Overview

Upgrade your telecom systems with the high-quality BGS15AN16E6327XTSA1 by Infineon Technologies. This versatile telecom interface IC offers unparalleled performance and reliability, thanks to Infineon's reputation as a top manufacturer in the industry. With a wide range of applications, this chip carrier with a very thin profile is perfect for various telecom circuits. Experience seamless communication and enhanced efficiency with this innovative product, providing exceptional value and benefits to customers looking to optimize their telecommunications infrastructure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the IC, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

No. of Terminals: 16

Provides sufficient connectivity options for various telecom interfaces, making it versatile for different communication needs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably even in demanding environmental conditions.

Nominal Supply Voltage: 3.5 V

The nominal supply voltage of 3.5V is commonly used in telecom applications, ensuring compatibility with existing systems.

Technical Specifications

Other Function Telecom Interface ICs BGS15AN16E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.77 mm

Nominal Supply Voltage:

3.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.3 mm

Trade Compliance

BGS15AN16E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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