Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGS13SN8E6327XTSA1 by Infineon is a telecom IC with MOS technology. It has 8 terminals in a square chip carrier package, suitable for industrial applications. With an operating temperature range of -40 to 85°C, it is surface mountable and features TIN terminal finish.
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Surface mount allows for easy installation and space-saving on PCBs.
Square package shape provides a more uniform and compact design, making it easier to integrate into various systems.
Having 8 terminals provides flexibility in connectivity options and functionality.
Chip carrier packaging offers reliability and protection for the integrated circuit, ensuring durability in various operating conditions.
With a high maximum operating temperature, this product can withstand demanding industrial environments.
The wide range of operating temperatures allows this product to function reliably in both extreme cold and hot conditions.
Tin terminal finish provides good conductivity and corrosion resistance, leading to better performance and longevity.
The low seated height allows for a compact design and ease of installation in space-constrained applications.
With a narrow width, this product can fit into tight spaces without sacrificing performance.
Compact length contributes to the overall small footprint of the device, making it ideal for applications where space is limited.
Industrial-grade temperature range ensures that the product can operate reliably in harsh environmental conditions typically found in industrial settings.
MOS technology provides efficient performance and low power consumption, making the product suitable for energy-efficient applications.
Butt terminal form simplifies installation and improves connectivity, enhancing the overall user experience.
Specifically designed for telecom applications, this product offers reliable and efficient communication functions in telecommunication systems.
The small terminal pitch allows for dense packing of components on a PCB, maximizing space utilization.
Other Function Telecom Interface ICs BGS13SN8E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
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Package Style (Meter):
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Technology:
Telecom IC Type:
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BGS13SN8E6327XTSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
INA826AIDGKR
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Gec Plessey Semiconductors
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Hitano Enterprise
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
Sensitron Semiconductor
Microsemi
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
AD73311ARSZ-REEL
Analog Devices
AD73311ARSZ-REEL by Analog Devices is a 16-bit linear coding telecom IC with 20 terminals and a 3/5 V supply voltage. It operates in industrial temperature range (-40 to 85°C) and features a filter for precise signal processing. This small outline, surface-mount IC is ideal for telecom circuit applications requiring high gain tolerance and CMOS technology.
SX1302IMLTRT
Semtech
TELECOM CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
MDBT50Q-P1MV2
Raytac
Raytac's MDBT50Q-P1MV2 is a telecom IC with 61 terminals, operating b/w -40 to 85°C. It supports a data rate of 2 Mbps at a nominal voltage of 3V. This surface-mount module in MICROELECTRONIC ASSEMBLY package is ideal for telecom applications requiring compact design and high-speed data transmission.
SIM900
Simcom Wireless Solutions
SIM900 by Simcom Wireless Solutions is a telecom IC with 0.0856 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has 68 terminals in a square package. Ideal for telecom applications requiring high-speed data transmission.
RN4871-I/RM128
Microchip Technology
RN4871-I/RM128 by Microchip Technology is a telecom IC with 16 terminals, operating at -40 to 85 °C. It has a data rate of 0.01 Mbps and nominal voltage of 3.3 V. Ideal for industrial applications requiring reliable telecom circuit interfaces in compact spaces.
MAX5980GTJ+T
MAX5980GTJ+T by Analog Devices is a telecom interface IC with 32 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105 °C and has a nominal voltage of 54 V. This IC is commonly used in telecom circuits for various applications.
WT32I-A-AI6-APTX
Silicon Labs
WT32I-A-AI6-APTX by Silicon Labs is a surface mount telecom interface IC with 1 function and 50 terminals. It has a rectangular package shape, measuring 23.9mm in length, 15.9mm in width, and 2.55mm in max seated height. With an operating temperature range of -40 to 85°C, it is suitable for industrial applications requiring reliable telecom circuit performance.
AD9671KBCZ
AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.
MAX7033EUI+
MAX7033EUI+ by Analog Devices is a telecom IC with 28 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V, consumes 0.00688mA current, and uses CMOS technology. This IC is ideal for telecom circuits in industrial applications due to its small outline package and dual terminal position.
ESP32-D0WDQ6
Espressif Systems (Shanghai)
ESP32-D0WDQ6 by Espressif Systems (Shanghai) is a 48-terminal IC with CMOS technology, operating at -40 to 125 °C. It has a nominal voltage of 3.3 V and is suitable for automotive telecom circuits due to its compact square chip carrier package style.
ADAR1000ACCZN
ADAR1000ACCZN by Analog Devices is a telecom IC with 88 terminals in a grid array package. It operates b/w -40°C to 85°C, with a nominal voltage of 3.3V and negative supply voltage of -5V. This IC is designed for telecom circuits requiring precise temperature control and industrial-grade performance.
ODIN-W260-04B-00
U-blox Ag
Other Telecom ICs; Moisture Sensitivity Level (MSL): 4;
AD9832BRUZ-REEL7
AD9832BRUZ-REEL7 by Analog Devices is a Telecom Interface IC with 16 terminals. It operates b/w -40 to 85°C, consuming 5mA at 3.3V. This CMOS technology-based IC is ideal for telecom circuits due to its small outline and dual terminal position.
EC25EUXGA-128-SGNS
Quectel Wireless Solutions
Quectel Wireless Solutions EC25EUXGA-128-SGNS is a telecom IC with 150 Mbps data rate, operating at -35 to 75°C. With 144 terminals and 3.8V supply voltage, it's ideal for high-speed communication applications in commercial extended temperature environments.
MAX-M10M-00B
GNSS Module;
453-00039R
Laird Technologies
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
DA14531MOD-00F0100C
Dialog Semiconductor
TELECOM CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
ZED-F9T-10B
TELECOM CIRCUIT;
CC2640R2FRGZR
CC2640R2FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and no-lead terminal form.
RN42-I/RM630
Microchip Technology's RN42-I/RM630 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for industrial applications requiring high-speed data transmission in compact spaces.
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BGS12SN6E6327XTSA1
Infineon Technologies
BGS12SN6E6327XTSA1 by Infineon Technologies is a telecom interface IC with 6 terminals, chip carrier package style, and operating temperatures from -30 to 85°C. It is surface mountable and suitable for telecom circuit applications with a nominal voltage of 2.6V.
BGS14PN10E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGS12PN10E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGS18GA14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Shape: SQUARE; Nominal Supply Voltage: 3 V;
BGS12AL74E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13PN10E6327XTSA1
BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.
BGS13S2N9E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: SQUARE;
BGS15AN16E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
BGS13GA14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 14; Package Code: BCC; Package Shape: SQUARE;
BGS12S3N6E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13PN10
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13GA14E6327
BGS12S3N6
BGS12AL7-6
BGS13S2N9
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 9; Package Code: VFLGA; Package Shape: SQUARE;
BGS12AL7-4
BGS12AL76E6327XTMA1
BGS12SL6E6327XTSA1
BGS12PN10
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VSON; Package Shape: RECTANGULAR;
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