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BGS13SN8E6327XTSA1

Infineon Technologies

BGS13SN8E6327XTSA1 by Infineon Technologies

BGS13SN8E6327XTSA1 by Infineon is a telecom IC with MOS technology. It has 8 terminals in a square chip carrier package, suitable for industrial applications. With an operating temperature range of -40 to 85°C, it is surface mountable and features TIN terminal finish.

Median Price

$0.297

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 23,222 parts In-Stock

1+ parts

$0.380

100+ parts

$0.216

1k+ parts

$0.182

10k+ parts

$0.168

23,222

$0.380

$0.216

$0.182

$0.168

DigiKey

USA . 49 parts In-Stock

1+ parts

$0.430

100+ parts

$0.229

1k+ parts

$0.193

10k+ parts

$0.179

49

$0.430

$0.229

$0.193

$0.179

Element14

Singapore . 19,248 parts In-Stock

1+ parts

$0.527

100+ parts

$0.319

1k+ parts

$0.259

10k+ parts

$0.233

19,248

$0.527

$0.319

$0.259

$0.233

Rochester

USA . 6,528,552 parts In-Stock

1+ parts

-

100+ parts

$0.194

1k+ parts

$0.161

10k+ parts

$0.144

6,528,552

-

$0.194

$0.161

$0.144

Verical

USA . 5,286,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.180

5,286,000

-

-

-

$0.180

Chip1Stop

Japan . 41,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

41,845

-

-

-

-

Arrow

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

RS (Exports)

UK . 8,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.196

10k+ parts

$0.172

8,675

-

-

$0.196

$0.172

Farnell

UK . 5,207 parts In-Stock

1+ parts

-

100+ parts

$0.297

1k+ parts

$0.199

10k+ parts

$0.138

5,207

-

$0.297

$0.199

$0.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 788 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

10k+ parts

-

788

$0.156

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.329

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.329

-

-

-

Rutronik

Germany . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Vyrian

USA . 4,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,624

-

-

-

-

VNN

France . 424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

424

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,345,326 parts In-Stock

1+ parts

$0.134

100+ parts

-

1k+ parts

-

10k+ parts

-

1,345,326

$0.134

-

-

-

Corphita

USA . 325 parts In-Stock

1+ parts

$0.148

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$0.148

-

-

-

Component Stockers USA

USA . 9,241,025 parts In-Stock

1+ parts

$0.170

100+ parts

$0.160

1k+ parts

$0.140

10k+ parts

$0.140

9,241,025

$0.170

$0.160

$0.140

$0.140

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.329

100+ parts

$0.322

1k+ parts

-

10k+ parts

-

50

$0.329

$0.322

-

-

Continental Prestige Electronics

USA . 5,500 parts In-Stock

1+ parts

$0.649

100+ parts

$0.385

1k+ parts

$0.244

10k+ parts

-

5,500

$0.649

$0.385

$0.244

-

Modulus Dynamics

Lithuania . 4,551 parts In-Stock

1+ parts

$11.181

100+ parts

$10.734

1k+ parts

$10.287

10k+ parts

-

4,551

$11.181

$10.734

$10.287

-

Corohmni

South Africa . 1,213 parts In-Stock

1+ parts

$16.756

100+ parts

-

1k+ parts

-

10k+ parts

-

1,213

$16.756

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,902

-

-

-

-

Argo Parts USA

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Discover the cutting-edge BGS13SN8E6327XTSA1 by Infineon Technologies, a top-tier manufacturer known for its superior quality and reliability. This Telecom Interface IC offers unmatched performance and versatility, making it ideal for a wide range of applications. With its advanced technology and industrial-grade temperature range, this product ensures seamless operation in any environment. Experience the value and benefits of Infineon's expertise with the BGS13SN8E6327XTSA1, providing customers with unparalleled advantages and peace of mind.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy installation and space-saving on PCBs.

Package Shape: SQUARE

Square package shape provides a more uniform and compact design, making it easier to integrate into various systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and functionality.

Package Style: CHIP CARRIER

Chip carrier packaging offers reliability and protection for the integrated circuit, ensuring durability in various operating conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this product to function reliably in both extreme cold and hot conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, leading to better performance and longevity.

Maximum Seated Height: 0.4 mm

The low seated height allows for a compact design and ease of installation in space-constrained applications.

Width: 1.1 mm

With a narrow width, this product can fit into tight spaces without sacrificing performance.

Length: 1.1 mm

Compact length contributes to the overall small footprint of the device, making it ideal for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures that the product can operate reliably in harsh environmental conditions typically found in industrial settings.

Technology: MOS

MOS technology provides efficient performance and low power consumption, making the product suitable for energy-efficient applications.

Terminal Form: BUTT

Butt terminal form simplifies installation and improves connectivity, enhancing the overall user experience.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product offers reliable and efficient communication functions in telecommunication systems.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for dense packing of components on a PCB, maximizing space utilization.

Technical Specifications

Other Function Telecom Interface ICs BGS13SN8E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-XBCC-B8

JESD-609 Code:

e3

Length:

1.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.4 mm

Surface Mount:

YES

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.1 mm

Trade Compliance

BGS13SN8E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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