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AX5243-1-TA05

Onsemi

AX5243-1-TA05 by Onsemi

AX5243-1-TA05 by Onsemi is a telecom IC with CMOS technology, operating b/w -40 to 85°C. It features 20 terminals in a square chip carrier package style, suitable for telecom circuit applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in industrial temperature grades.

Median Price

$1.013

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$1.013

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VNN

France . 25,620 parts In-Stock

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Vyrian

USA . 3,343 parts In-Stock

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Digiode

USA . 2,196 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

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LWI Electronics Inc

India . 10 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,741 parts In-Stock

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$1.013

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$0.992

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Argo Parts USA

USA . 113 parts In-Stock

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AZTECH Wire

Italy . 422 parts In-Stock

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$11.731

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Aztec Data Supply Inc.

USA . 153 parts In-Stock

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$16.610

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Ampacity Inc.

Singapore . 685 parts In-Stock

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$438.000

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Semicontronic

India . 459 parts In-Stock

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$967.000

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$942.825

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$937.990

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Problanco Electronics

Mexico . 7,045 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 1,761 parts In-Stock

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Corphita

USA . 1,463 parts In-Stock

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Kulean Microsystems

USA . 1,195 parts In-Stock

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SupplyDigital Components

Austria . 896 parts In-Stock

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UHIMA Technologies

Türkiye . 854 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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Overview

Discover the innovative AX5243-1-TA05 by Onsemi, a high-quality telecom interface IC that offers unparalleled performance and reliability. With Onsemi's proven track record of excellence in manufacturing, this product is designed to meet the demands of various applications in the telecommunications industry. Experience seamless connectivity and enhanced functionality with the AX5243-1-TA05, providing customers with value, efficiency, and cutting-edge technology. Elevate your projects with this versatile and advanced solution from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on a circuit board, saving time and effort in assembly.

Package Shape: SQUARE

Square shape provides a compact design, ideal for space-constrained applications.

No. of Terminals: 20

Sufficient number of terminals for connecting various components, offering flexibility in circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a variety of environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in both extreme cold and hot conditions.

Terminal Finish: TIN

Tin finish provides good conductivity and solderability for reliable connections.

Width: 4 mm

Compact width allows for space-saving integration into electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures suitability for harsh operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency.

Nominal Supply Voltage: 3 V

Operates at a low supply voltage, making it suitable for battery-powered applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, saving space on the circuit board.

Technical Specifications

Other Function Telecom Interface ICs AX5243-1-TA05 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

AX5243-1-TA05 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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