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AX5243-1-TW30

Onsemi

AX5243-1-TW30 by Onsemi

AX5243-1-TW30 by Onsemi is a CMOS telecom IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features include 3V supply voltage, matte tin finish, and quad terminal position for telecom interface functions.

Median Price

$5.135

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,458 parts In-Stock

1+ parts

$5.467

100+ parts

$5.135

1k+ parts

$4.886

10k+ parts

$4.886

2,458

$5.467

$5.135

$4.886

$4.886

Avnet

USA . 15,000 parts In-Stock

1+ parts

-

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$1.950

15,000

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$1.950

Verical

USA . 2,458 parts In-Stock

1+ parts

-

100+ parts

$5.135

1k+ parts

$4.886

10k+ parts

$4.886

2,458

-

$5.135

$4.886

$4.886

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,482 parts In-Stock

1+ parts

$5.194

100+ parts

-

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1,482

$5.194

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Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$6.371

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51

$6.371

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Flip Electronics

USA . 87,000 parts In-Stock

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87,000

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Kiltronic GmbH

Germany . 44,024 parts In-Stock

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Chip Stock

USA . 10,500 parts In-Stock

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VNN

France . 3,832 parts In-Stock

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Vyrian

USA . 3,470 parts In-Stock

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Velocity Electronics

USA . 133 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,295 parts In-Stock

1+ parts

$4.360

100+ parts

-

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2,295

$4.360

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Semicontronic

India . 1,998 parts In-Stock

1+ parts

$4.360

100+ parts

$4.251

1k+ parts

$4.229

10k+ parts

-

1,998

$4.360

$4.251

$4.229

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Corphita

USA . 134 parts In-Stock

1+ parts

$4.920

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134

$4.920

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Corohmni

South Africa . 145 parts In-Stock

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$5.135

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145

$5.135

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Continental Prestige Electronics

USA . 3,866 parts In-Stock

1+ parts

$5.619

100+ parts

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$5.507

3,866

$5.619

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-

$5.507

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.371

100+ parts

-

1k+ parts

$6.052

10k+ parts

$5.925

1,000

$6.371

-

$6.052

$5.925

Aztec Data Supply Inc.

USA . 3,879 parts In-Stock

1+ parts

$8.600

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3,879

$8.600

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Advanced Electronics

New Zealand . 89 parts In-Stock

1+ parts

$10.340

100+ parts

$9.409

1k+ parts

$8.479

10k+ parts

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89

$10.340

$9.409

$8.479

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AZTECH Wire

Italy . 659 parts In-Stock

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$17.060

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659

$17.060

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Lixinc

USA . 9,410 parts In-Stock

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Problanco Electronics

Mexico . 7,180 parts In-Stock

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SupplyDigital Components

Austria . 6,794 parts In-Stock

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RC Electronics

USA . 6,466 parts In-Stock

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TANS Electronics

Latvia . 6,383 parts In-Stock

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Kulean Microsystems

USA . 5,495 parts In-Stock

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Argo Parts USA

USA . 2,287 parts In-Stock

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UHIMA Technologies

Türkiye . 390 parts In-Stock

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GreenTree Electronics

Israel . 148 parts In-Stock

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Authorized Procurement Solutions

USA . 48 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the AX5243-1-TW30 by Onsemi. Crafted with precision and expertise, this telecom interface IC is designed to elevate your communication experience. Its compact square shape and advanced technology ensure reliability and efficiency in various applications. Say goodbye to connectivity issues and hello to smooth, uninterrupted communication with this high-quality product. Upgrade your systems today and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto a PCB, saving time and reducing production costs.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the PCB and allowing for easy placement in tight areas.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity and functionality, allowing for multiple input and output options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring a reliable electrical connection over time.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the IC efficient and reliable in telecom applications.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is commonly used in telecom applications, ensuring compatibility with existing systems and components.

Technical Specifications

Other Function Telecom Interface ICs AX5243-1-TW30 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

AX5243-1-TW30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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