Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon's BGS12AL74E6327XTSA1 is a telecom IC with 6 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom interfaces, this surface-mount IC features gold terminal finish and 0.55mm pitch.
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Surface mount capability allows for easy and efficient installation on PCBs, saving time and resources.
Rectangular package shape provides a standard form factor for compatibility with various applications and designs.
Having 6 terminals allows for multiple connections and functionalities in a compact package.
Chip carrier package style offers good protection and compact size for integrated circuits.
Wide operating temperature range makes this IC suitable for various environments and climates.
Gold terminal finish ensures good conductivity and corrosion resistance for reliable performance.
Narrow width allows for space-saving integration in tight PCB layouts.
Low nominal supply voltage provides energy efficiency and compatibility with low-power applications.
Other Function Telecom Interface ICs BGS12AL74E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
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Maximum Operating Temperature:
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Telecom IC Type:
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BGS12AL74E6327XTSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Weitronic Enterprise
Bytesonic Electronics
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
Temic Semiconductors
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
Kec
LM7805CT/NOPB
Texas Instruments
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
Panjit International
SPC TECHNOLOGY/ MULTICOMP
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
Won-top Electronics
OPA2277UA/2K5E4
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
LBEE5KL1YN-814
Murata Manufacturing
TELECOM CIRCUIT;
RFFC2071ATR13
Rf Micro Devices
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
WL1835MODGBMOCT
Texas Instruments' WL1835MODGBMOCT is a telecom IC with 100 terminals, operating at 3.7V and supporting data rates up to 100 Mbps. It features a rectangular package style, surface mount capability, and operates within -20 to 70°C temperature range. Ideal for telecom interface applications requiring high-speed data transmission in commercial-grade environments.
CY7B933-JXC
Infineon Technologies
Infineon Technologies' CY7B933-JXC is a BICMOS technology telecom IC with 28 terminals in a square chip carrier package. Operating at 5V, it supports data rates up to 400 Mbps and draws a max supply current of 155mA. Ideal for telecom circuits, this IC has a temperature range of 0-70°C and is surface mountable.
AD9874ABST
Analog Devices
AD9874ABST by Analog Devices is a telecom interface IC with 48 terminals in a square package. It operates at -40 to 85°C, with power supplies of 3/3.3V and 3/5V. This BICMOS technology IC is ideal for telecom circuits requiring low profile, fine pitch components.
RN42XVP-I/RM
Microchip Technology
RN42XVP-I/RM by Microchip Technology is a telecom IC with 20 terminals, operating temperature range of -40 to 85 °C. It has a data rate of 0.3 Mbps and operates at a nominal voltage of 3.3 V. This rectangular package is ideal for industrial applications requiring reliable telecom circuit connectivity.
ESP32-PICO-D4
Espressif Systems (Shanghai)
ESP32-PICO-D4 by Espressif Systems is a telecom IC with 48 terminals in a square package. Operating from -40 to 85°C, it has a supply voltage of 3.3V. Ideal for industrial applications, this surface-mount IC is designed for telecom circuits with a terminal pitch of 0.5mm.
88E6176-A1-TFJ2I000
Marvell Technology
Marvell Technology's 88E6176-A1-TFJ2I000 is a telecom circuit IC with 128 terminals in a square flatpack package. It features gull wing terminal form and quad terminal position, suitable for surface mount applications. Ideal for various functions in telecommunications interfaces.
RN4020-V/RMBEC133
RN4020-V/RMBEC133 by Microchip Tech is a telecom IC with 24 terminals, operating at -30 to 85°C. It has a data rate of 1 Mbps and operates at 3.3V supply voltage. Ideal for telecom applications due to its TS16949 screening level and compact rectangular package style.
SPSGRF-915
SPSGRF-915 by STMicroelectronics is a telecom IC with 11 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm. This surface-mount IC is ideal for industrial telecom applications due to its compact rectangular package design.
CC2640R2FTWRGZTQ1
CC2640R2FTWRGZTQ1 by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, has a data rate of 1 Mbps, and requires a nominal voltage of 3V. Ideal for industrial applications requiring reliable communication at high speeds in compact spaces.
MAX5980GTJ+T
MAX5980GTJ+T by Analog Devices is a telecom interface IC with 32 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105 °C and has a nominal voltage of 54 V. This IC is commonly used in telecom circuits for various applications.
MCP2120-I/SL
MCP2120-I/SL by Microchip: Telecom IC with 14 terminals, 3/5V supply, CMOS tech. Ideal for telecom circuits, operates in -40 to 85°C range. Small outline package, matte tin finish, TS16949 screening level.
SA606DK/01,118
NXP Semiconductors
SA606DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, with terminal finish of nickel palladium gold. Ideal for telecom circuits requiring nominal voltage of 3V and industrial temperature grade.
DA16200MOD-AAC4WA32
Dialog Semiconductor
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MAX7044AKA-T
Maxim Integrated
MAX7044AKA-T by Maxim Integrated is a telecom IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, suitable for automotive applications due to its CMOS technology and small form factor.
NEO-M8P-0-11
U-blox Ag
NEO-M8P-0-11 by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85 °C. It has AEC-Q100 screening level and TS 16949 certification. Ideal for industrial applications requiring precise positioning and communication capabilities.
XB3-24Z8ST-J
Digi International
XB3-24Z8ST-J by Digi Int. is a telecom IC with 20 terminals in MICROELECTRONIC ASSEMBLY package. Operating temp range -40 to 85°C, suitable for INDUSTRIAL applications. Features THROUGH-HOLE terminals and DUAL position, ideal for TELECOM CIRCUIT designs.
BGM121A256V2
Silicon Labs
Silicon Labs' BGM121A256V2 is a telecom IC with 56 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial-grade applications. The surface-mountable square package measures 6.5mm x 6.5mm x 1.4mm, making it suitable for compact telecom interface solutions.
455-00002
Laird Technologies
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGS12SN6E6327XTSA1
BGS12SN6E6327XTSA1 by Infineon Technologies is a telecom interface IC with 6 terminals, chip carrier package style, and operating temperatures from -30 to 85°C. It is surface mountable and suitable for telecom circuit applications with a nominal voltage of 2.6V.
BGS14PN10E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGS12PN10E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGS18GA14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Shape: SQUARE; Nominal Supply Voltage: 3 V;
BGS13PN10E6327XTSA1
BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.
BGS13S2N9E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: SQUARE;
BGS15AN16E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
BGS13SN8E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 8; Package Code: BCC; Package Shape: SQUARE;
BGS13GA14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 14; Package Code: BCC; Package Shape: SQUARE;
BGS12S3N6E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13PN10
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13GA14E6327
BGS12S3N6
BGS12AL7-6
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
BGS13S2N9
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 9; Package Code: VFLGA; Package Shape: SQUARE;
BGS12AL7-4
BGS12AL76E6327XTMA1
BGS12SL6E6327XTSA1
BGS12PN10
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VSON; Package Shape: RECTANGULAR;
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