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CC2640R2FTWRGZTQ1

Texas Instruments

CC2640R2FTWRGZTQ1 by Texas Instruments

CC2640R2FTWRGZTQ1 by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, has a data rate of 1 Mbps, and requires a nominal voltage of 3V. Ideal for industrial applications requiring reliable communication at high speeds in compact spaces.

Median Price

$6.649

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,944 parts In-Stock

1+ parts

$6.333

100+ parts

$5.163

1k+ parts

$3.442

10k+ parts

-

3,944

$6.333

$5.163

$3.442

-

Mouser Electronics

USA . 1,451 parts In-Stock

1+ parts

$10.260

100+ parts

$6.790

1k+ parts

$6.150

10k+ parts

-

1,451

$10.260

$6.790

$6.150

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.649

10k+ parts

$6.473

250

-

-

$6.649

$6.473

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.163

100+ parts

-

1k+ parts

-

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-

100

$5.163

-

-

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Digiode

USA . 540 parts In-Stock

1+ parts

$6.016

100+ parts

-

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540

$6.016

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Vyrian

USA . 1,694 parts In-Stock

1+ parts

-

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1,694

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,390 parts In-Stock

1+ parts

$5.163

100+ parts

-

1k+ parts

-

10k+ parts

$5.060

2,390

$5.163

-

-

$5.060

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.163

100+ parts

-

1k+ parts

$4.905

10k+ parts

$4.802

100

$5.163

-

$4.905

$4.802

Ampacity Inc.

Singapore . 1,631 parts In-Stock

1+ parts

$5.380

100+ parts

-

1k+ parts

-

10k+ parts

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1,631

$5.380

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Semicontronic

India . 1,404 parts In-Stock

1+ parts

$5.380

100+ parts

$5.246

1k+ parts

$5.219

10k+ parts

-

1,404

$5.380

$5.246

$5.219

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Parana Technologies

USA . 2,271 parts In-Stock

1+ parts

$5.696

100+ parts

-

1k+ parts

$6.488

10k+ parts

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2,271

$5.696

-

$6.488

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Corphita

USA . 385 parts In-Stock

1+ parts

$5.700

100+ parts

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385

$5.700

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DigiPath Technology Company

USA . 1,336 parts In-Stock

1+ parts

$6.272

100+ parts

$5.770

1k+ parts

-

10k+ parts

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1,336

$6.272

$5.770

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ChromeModa Solutions

Germany . 2,858 parts In-Stock

1+ parts

$6.400

100+ parts

$5.248

1k+ parts

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2,858

$6.400

$5.248

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IDEA Electronic Components Group

UK . 1,483 parts In-Stock

1+ parts

$6.400

100+ parts

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1k+ parts

$5.760

10k+ parts

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1,483

$6.400

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$5.760

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Corohmni

South Africa . 835 parts In-Stock

1+ parts

$6.860

100+ parts

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835

$6.860

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$17.656

100+ parts

$16.773

1k+ parts

$16.773

10k+ parts

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2,000

$17.656

$16.773

$16.773

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Lixinc

USA . 17,538 parts In-Stock

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17,538

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QUARKTWIN TECHNOLOGY LTD

USA . 15,244 parts In-Stock

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Argo Parts USA

USA . 3,874 parts In-Stock

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3,874

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A-Z Elektronik GmbH

Germany . 2,648 parts In-Stock

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2,648

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Authorized Procurement Solutions

USA . 250 parts In-Stock

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250

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Overview

Elevate your telecommunications projects with the CC2640R2FTWRGZTQ1 by Texas Instruments. This cutting-edge Telecom Interface IC boasts top-notch quality and reliability, thanks to its AEC-Q100 screening level and industrial temperature grade. Whether you're designing IoT devices, smart home systems, or wearable technology, this chip carrier with a very thin profile offers unmatched performance and efficiency. Trust in Texas Instruments' decades of expertise in semiconductor manufacturing and unlock endless possibilities with the CC2640R2FTWRGZTQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, perfect for telecom applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on circuit boards.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board.

No. of Terminals: 48

With 48 terminals, this product offers a high level of connectivity for various telecom functions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style provides efficient thermal management and space-saving benefits.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability in high-temperature environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent solderability and electrical conductivity.

Terminal Position: QUAD

The quad terminal position allows for easy connection to other components on the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height makes this product suitable for compact designs.

Width: 7 mm

The 7mm width offers a small footprint, ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures reliable solder joints.

Length: 7 mm

The 7mm length provides a compact form factor for tight layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows this product to operate in harsh environmental conditions.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and offers improved electrical performance.

Telecom IC Type: TELECOM CIRCUIT

This product is specifically designed for telecom circuit applications, ensuring optimal performance in such systems.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is common in many telecom applications, making this product a versatile choice.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density packaging on the circuit board.

Data Rate: 1 Mbps

The 1 Mbps data rate capability enables fast and efficient communication in telecom systems.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this product can withstand moderate levels of moisture exposure.

Technical Specifications

Other Function Telecom Interface ICs CC2640R2FTWRGZTQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2640R2FTWRGZTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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