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CC2640R2FRSMT

Texas Instruments

CC2640R2FRSMT by Texas Instruments

CC2640R2FRSMT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Suitable for telecom circuits, it has a terminal pitch of 0.4mm and is designed for industrial temperature grades.

Median Price

$4.908

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 51,376 parts In-Stock

1+ parts

$4.066

100+ parts

$3.315

1k+ parts

$2.210

10k+ parts

-

51,376

$4.066

$3.315

$2.210

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Mouser Electronics

USA . 523 parts In-Stock

1+ parts

$5.750

100+ parts

$3.660

1k+ parts

$3.320

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523

$5.750

$3.660

$3.320

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DigiKey

USA . 635 parts In-Stock

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635

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Digiode

USA . 3,906 parts In-Stock

1+ parts

$3.863

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-

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3,906

$3.863

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Nova Conductors

Japan . 25 parts In-Stock

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$4.000

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25

$4.000

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Chip Stock

USA . 39,680 parts In-Stock

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39,680

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Vyrian

USA . 17,572 parts In-Stock

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17,572

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TME

Poland . 750 parts In-Stock

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$3.770

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750

-

-

$3.770

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,757 parts In-Stock

1+ parts

$3.046

100+ parts

-

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2,757

$3.046

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Continental Prestige Electronics

USA . 2,395 parts In-Stock

1+ parts

$3.046

100+ parts

-

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$2.985

2,395

$3.046

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-

$2.985

Ampacity Inc.

Singapore . 17,462 parts In-Stock

1+ parts

$3.460

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17,462

$3.460

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Corphita

USA . 2,530 parts In-Stock

1+ parts

$3.659

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2,530

$3.659

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Netroflash

USA . 500 parts In-Stock

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$4.000

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500

$4.000

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Semicontronic

India . 17,339 parts In-Stock

1+ parts

$7.520

100+ parts

$7.332

1k+ parts

$7.294

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17,339

$7.520

$7.332

$7.294

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Advanced Electronics

New Zealand . 86 parts In-Stock

1+ parts

$7.728

100+ parts

$7.342

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$7.342

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86

$7.728

$7.342

$7.342

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Parana Technologies

USA . 537 parts In-Stock

1+ parts

$11.447

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$11.866

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537

$11.447

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$11.866

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DigiPath Technology Company

USA . 766 parts In-Stock

1+ parts

$12.605

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766

$12.605

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ChromeModa Solutions

Germany . 5,222 parts In-Stock

1+ parts

$12.862

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$10.547

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5,222

$12.862

$10.547

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IDEA Electronic Components Group

UK . 1,484 parts In-Stock

1+ parts

$12.862

100+ parts

$12.219

1k+ parts

$11.576

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1,484

$12.862

$12.219

$11.576

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Corohmni

South Africa . 1,234 parts In-Stock

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$16.225

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Lixinc

USA . 12,913 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,055 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

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100+ parts

$3.778

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$3.778

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$3.778

500

-

$3.778

$3.778

$3.778

GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Transform your telecommunications projects with the CC2640R2FRSMT by Texas Instruments. Known for its exceptional quality and reliability, Texas Instruments is a leading manufacturer in the industry. This versatile telecom interface IC offers a wide range of applications, making it a valuable asset for any project. With advanced features and innovative technology, this product provides customers with unmatched performance and efficiency. Upgrade your systems today with the CC2640R2FRSMT and experience the difference that Texas Instruments can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Package Shape: SQUARE

Square package shape helps in optimizing board space and layout.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile allows for enhanced thermal management and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of these finishes ensures good conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for efficient power distribution and signal routing.

Maximum Seated Height: 1 mm

Low seated height helps in achieving a compact overall design.

Width: 4 mm

The compact width allows for efficient space utilization on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and effective soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables reliable solder joints.

Length: 4 mm

The compact length contributes to a space-saving design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh operating conditions.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces health risks during manufacturing.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in communication systems.

Nominal Supply Voltage: 3 V

The 3V supply voltage is commonly used in telecom applications, ensuring compatibility with existing systems.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density PCB layouts and connectivity.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the IC is sensitive to moisture but has a relatively long floor life, providing flexibility during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs CC2640R2FRSMT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC2640R2FRSMT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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