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SA602AD

NXP Semiconductors

SA602AD by NXP Semiconductors

SA602AD by NXP Semiconductors is a telecom interface IC with 8 terminals, operating temperature range of -40 to 85°C. It features a small outline package style, gull wing terminal form, and nominal voltage of 6V. Ideal for telecom circuits in industrial applications.

Median Price

$2.000

Lifecycle Status

EOL

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28

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TEDSS.com

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Forefront Electronics and Design

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Component Sense

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Fibra_Brandt Electronic GMBH

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J2 Sourcing AB

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Component Electronics Inc.

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Odintec Ltd.

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Aztec Data Supply Inc.

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Corohmni

South Africa . 321 parts In-Stock

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AZTECH Wire

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Component Stockers USA

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Bastille Electronics

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Overview

Elevate your projects with the SA602AD from NXP Semiconductors, a top-tier manufacturer known for their cutting-edge technology. This versatile telecom interface IC is designed to enhance connectivity and performance in a variety of applications. With a compact design and industrial-grade temperature range, the SA602AD offers reliability and efficiency like no other. Experience seamless integration and superior functionality with this innovative product. Choose NXP Semiconductors for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and reliability of the product, making it a suitable choice for long-term use in various applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and improving overall product efficiency.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and efficient design, ideal for applications where space is limited.

No. of Terminals: 8

With 8 terminals, this product offers versatility and flexibility for connecting to other components and devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB while still offering high performance, making it a practical choice for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand extended use in demanding environments with reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can function effectively even in cold conditions, adding to its versatility.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved connectivity, reducing the risk of signal loss and enhancing overall product reliability.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for a slim and compact design, making it easier to integrate into space-constrained applications.

Width: 3.9 mm

The narrow width of 3.9 mm further contributes to the compact and space-saving design of the product, making it suitable for small electronic devices.

Length: 4.9 mm

The short length of 4.9 mm adds to the overall compactness of the product, making it a practical choice for applications with size limitations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures that the product can operate reliably in harsh industrial environments, making it a durable and robust solution.

Terminal Form: GULL WING

Gull wing terminal form offers secure and stable connections, reducing the risk of signal interference or loss, and ensuring consistent performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product is optimized for telecommunications applications, offering superior performance and reliability in such environments.

Nominal Supply Voltage: 6 V

With a nominal supply voltage of 6V, this product is compatible with standard voltage levels, making it easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for close spacing of terminals, enabling efficient and compact PCB designs for enhanced performance.

Technical Specifications

Other Function Telecom Interface ICs SA602AD attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SA602AD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-374-4819, 5962013744819

NIIN

013744819

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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