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SA606DK,118

NXP Semiconductors

SA606DK,118 by NXP Semiconductors

SA606DK,118 by NXP Semiconductors is a telecom interface IC with 20 terminals. It operates b/w -40 to 85°C and has a supply voltage of 3V. The package is small outline, low profile, ideal for industrial telecom circuit applications.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,047 parts In-Stock

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Digiode

USA . 4,142 parts In-Stock

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Anansix

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Nova Conductors

Japan . 100 parts In-Stock

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AZTECH Wire

Italy . 541 parts In-Stock

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$11.732

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Ampacity Inc.

Singapore . 1,472 parts In-Stock

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One Stop Electronics

USA . 757 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Bastille Electronics

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Overview

Experience superior quality and reliability with the SA606DK,118 by NXP Semiconductors. This compact telecom interface IC offers unparalleled performance in a small outline package, making it perfect for a wide range of applications. With NXP's reputation for excellence in semiconductor manufacturing, you can trust that this product will deliver exceptional value and benefits to meet your needs. Upgrade your telecommunications systems with the SA606DK,118 and enjoy increased efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, making it suitable for various operating environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape is common and practical for easy integration into electronic devices and systems.

No. of Terminals: 20

With a sufficient number of terminals, this IC can support complex telecom interfaces and functions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of environments, including cold climates.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and layout, accommodating different configurations.

Maximum Seated Height: 1.5 mm

Low seated height enables compact design and space-saving integration of the IC into electronic devices.

Width: 4.4 mm

Narrow width allows for efficient use of PCB space, especially important in compact electronic devices.

Length: 6.5 mm

Moderate length provides a balance between compactness and ease of handling during assembly.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto PCBs, enhancing the reliability of the connections.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC offers optimized performance and functionality in telecommunication systems.

Nominal Supply Voltage: 3 V

Optimized for a nominal supply voltage of 3 V, ensuring compatibility with common power sources in telecom setups.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on PCBs, enabling compact and efficient telecom interface designs.

Technical Specifications

Other Function Telecom Interface ICs SA606DK,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA606DK,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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