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SA606DK,112

NXP Semiconductors

SA606DK,112 by NXP Semiconductors

SA606DK,112 by NXP Semiconductors is a telecom interface IC with 20 terminals. It operates b/w -40 to 85°C and has a supply voltage of 3V. With a small outline package style, it's ideal for industrial telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,859 parts In-Stock

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Digiode

USA . 2,706 parts In-Stock

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Anansix

USA . 1,857 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 311 parts In-Stock

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$16.400

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Ampacity Inc.

Singapore . 871 parts In-Stock

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One Stop Electronics

USA . 212 parts In-Stock

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Continental Prestige Electronics

USA . 4,264 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 1,757 parts In-Stock

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Argo Parts USA

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Aranea Global

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Overview

Unlock the power of seamless connectivity with the SA606DK,112 by NXP Semiconductors. This innovative telecom interface IC boasts top-notch quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for efficient and high-performance solutions. Say goodbye to connectivity issues and hello to a world of possibilities with the SA606DK,112.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for long-term use in various telecom applications.

Surface Mount YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort in production processes.

Package Shape RECTANGULAR

Rectangular shape helps in efficient placement and utilization of space on the circuit board, ensuring a compact design.

No. of Terminals 20

Having 20 terminals allows for versatile connectivity options, making the IC suitable for a range of telecom interface functions.

Maximum Operating Temperature 85 °C

Ability to operate at a maximum temperature of 85°C ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature -40 °C

With a minimum operating temperature of -40°C, the IC can function effectively in cold conditions.

Terminal Position DUAL

Dual-terminal position provides redundancy and enhances the reliability of connections for uninterrupted telecom operations.

Maximum Seated Height 1.5 mm

Low profile design with a maximum seated height of 1.5 mm allows for compact integration into space-constrained telecom devices.

Width 4.4 mm

Narrow width of 4.4 mm enables efficient placement and utilization of the IC in tight spaces on the circuit board.

Maximum Time At Peak Reflow Temperature (s) 40

IC can withstand a peak reflow temperature for up to 40 seconds during assembly processes, ensuring proper soldering and reliability.

Peak Reflow Temperature °C 260

Peak reflow temperature of 260°C allows for secure soldering of the IC during assembly, ensuring a strong connection.

Length 6.5 mm

Compact length of 6.5 mm contributes to space-saving design and efficient use of board real estate in telecom applications.

Temperature Grade INDUSTRIAL

Industrial temperature grade ensures reliable performance and durability in harsh environmental conditions typically encountered in telecom settings.

Terminal Form GULL WING

Gull wing terminal form facilitates easy and secure soldering onto the circuit board, ensuring a reliable electrical connection.

Telecom IC Type TELECOM CIRCUIT

Specifically designed for telecom circuit applications, ensuring optimal performance and compatibility in telecommunications systems.

Nominal Supply Voltage 3 V

Support for a nominal supply voltage of 3 V ensures compatibility with standard power sources in telecom equipment, simplifying integration.

Terminal Pitch 0.65 mm

Fine terminal pitch of 0.65 mm allows for high-density mounting on the circuit board, enabling efficient use of space and connectivity options.

Technical Specifications

Other Function Telecom Interface ICs SA606DK,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

SA606DK,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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