Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SA606D/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C. It features nickel palladium gold terminal finish and is ideal for telecom circuit applications.
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The use of plastic/epoxy material makes this product lightweight and durable, ideal for telecom applications.
With surface mount capability, this IC is easy to install on circuit boards, saving time and space.
The rectangular package shape allows for efficient placement on PCBs, optimizing space utilization.
The 20 terminals provide ample connectivity options, making this IC versatile for various telecom interfaces.
The small outline, low profile, and shrink pitch package style offers a compact design without compromising performance.
With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions.
The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.
The nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability.
The dual terminal position allows for flexibility in circuit design and layout, accommodating various configurations.
With a maximum seated height of 1.5 mm, this IC is suitable for applications with height restrictions.
The compact width of 4.4 mm saves space on PCBs, making it an efficient choice for telecom interface designs.
The length of 6.5 mm is optimized for compact PCB layouts, offering space-saving benefits.
Designed for industrial applications, this IC can withstand demanding operational environments.
The gull wing terminal form provides secure soldering connections, ensuring stable performance in high-stress situations.
Specifically designed for telecom circuits, this IC offers reliable and efficient performance for telecommunications applications.
With a nominal supply voltage of 3 V, this IC is compatible with standard power sources in telecom systems.
The terminal pitch of 0.65 mm allows for precise connections and efficient signal transmission in telecom interfaces.
Other Function Telecom Interface ICs SA606D/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Style (Meter):
Qualification:
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Nominal Supply Voltage:
Surface Mount:
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SA606D/01,118 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - EOL 01/Jun/2016
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
1N4148
Semitronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Yageo
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
Hitano Enterprise
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
ETRX357
Silicon Labs
ETRX357 by Silicon Labs is a telecom IC with 33 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 1.27mm. This industrial-grade IC is used in telecom circuits for various applications due to its compact rectangular package style and no-lead terminal form.
RN4870U-V/RM118
Microchip Technology
RN4870U-V/RM118 by Microchip Technology is a telecom IC with 30 terminals, operating temperature range of -20 to 70°C, and data rate of 0.01 Mbps. It is a surface mount IC suitable for telecom applications requiring a nominal voltage of 3V in a compact rectangular package style.
BQ51013ARHLT
Texas Instruments
BQ51013ARHLT by Texas Instruments is a Telecom IC with 20 terminals, operating at -40 to 125°C. It has a data rate of 0.002 Mbps and nominal voltage of 5V. Ideal for telecom circuits, this chip carrier package is surface mountable with Ni/Pd/Au terminal finish.
HMC624ALP4E
Hittite Microwave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
TSC2000IPWR
TSC2000IPWR by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, single-ended input type, and nominal voltage of 2.7V. Ideal for telecom circuits due to its compact size and industrial temperature grade suitability.
CAM-M8C-0
U-blox Ag
TELECOM CIRCUIT;
2615011136000
Wuerth Elektronik & Kg
TMS3705A1DRG4
TMS3705A1DRG4 by Texas Instruments is a 16-terminal telecom IC with 5V supply voltage. It operates b/w -40 to 105°C, suitable for industrial use. The package is small outline, surface mountable, with Gull Wing terminals ideal for telecom circuit applications.
3149
Cts
Other Telecom ICs;
AD8015ARZ-REEL7
Analog Devices
AD8015ARZ-REEL7 by Analog Devices is an 8-terminal IC with a max supply current of 26mA and nominal voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and is ideal for telecom circuits due to its small outline package and matte tin terminal finish.
MAX7033EUI+
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
NINA-B112
NINA-B112 by U-blox Ag is a telecom interface IC with a rectangular package shape and microelectronic assembly style. It operates in industrial temperature range (-40°C to 85°C) and has a nominal voltage of 3V. It is suitable for various telecom circuit applications.
453-00045C
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 50; Peak Reflow Temperature (C): 250;
BGM13P22F512GA-V2R
BLUENRG-134
STMicroelectronics
BLUENRG-134 by STMicroelectronics is a telecom IC with 34 terminals in a grid array package. Operating b/w -40°C to 105°C, it has a nominal voltage of 3V. With a very thin profile and fine pitch, it's ideal for industrial telecom applications.
ZED-F9T-10B
SI4010-C2-GTR
SI4010-C2-GTR by Silicon Labs is a telecom IC with 10 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and uses CMOS technology. This small outline package is ideal for telecom circuit applications due to its industrial temperature grade and surface mount capability.
CLRC63201T/0FE,112
NXP Semiconductors
NXP Semiconductors' CLRC63201T/0FE,112 is a telecom IC with 32 terminals in a small outline package. Operating b/w -25°C to 85°C, it has a nominal voltage of 3.3V and peak reflow temperature of 250°C. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold terminal finish.
ENW89815A3KF
HTRC11001T/03EE
NXP Semiconductors' HTRC11001T/03EE is a telecom IC with 14 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and current of 0.01mA, suitable for industrial applications. The package is small outline, rectangular in shape, with gull wing terminals for surface mount assembly.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SA602AD/01,112
SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.
SA602AD/01,118
SA602AD/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold silver terminal finish and 3V nominal voltage.
SA606DK/01,118
SA606DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, with terminal finish of nickel palladium gold. Ideal for telecom circuits requiring nominal voltage of 3V and industrial temperature grade.
SA606DK/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
SA602AN
Philips Components
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIP; Terminal Pitch: 2.54 mm; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: 4.2 mm;
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SA606DK/01
SA606DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 3V, featuring gull wing terminal form and shrink pitch package style.
SA602AD/01
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SA602AD
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Nominal Supply Voltage: 6 V;
SA602AD,602
SA602AD-T
SA606DK,118
SA606DK
SA606DK,112
SA606D/01,112
SA602AD/N,118
SA606D,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
SA606D,602
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