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SA606D/01,118

NXP Semiconductors

SA606D/01,118 by NXP Semiconductors

SA606D/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C. It features nickel palladium gold terminal finish and is ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,979 parts In-Stock

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6,979

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Digiode

USA . 3,609 parts In-Stock

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3,609

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Anansix

USA . 1,022 parts In-Stock

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1,022

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Nova Conductors

Japan . 41 parts In-Stock

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41

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Distributors (Availability)

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$10.796

100+ parts

$9.824

1k+ parts

$8.853

10k+ parts

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100

$10.796

$9.824

$8.853

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AZTECH Wire

Italy . 450 parts In-Stock

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$13.013

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450

$13.013

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One Stop Electronics

USA . 1,159 parts In-Stock

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$212.000

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1,159

$212.000

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Corphita

USA . 2,380 parts In-Stock

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2,380

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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UNI Independent Distributors

Spain . 1,795 parts In-Stock

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1,795

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Overview

Elevate your telecom experience with the SA606D/01,118 by NXP Semiconductors. Crafted with precision and expertise, this high-quality Telecom Interface IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product boasts a small outline, low profile package design that ensures seamless integration. With a nominal supply voltage of 3V and industrial-grade temperature range, customers can trust in the durability and efficiency of this innovative solution. Upgrade your telecom systems today and unlock the endless possibilities that the SA606D/01,118 has to offer.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY:

The use of plastic/epoxy material makes this product lightweight and durable, ideal for telecom applications.

Surface Mount YES:

With surface mount capability, this IC is easy to install on circuit boards, saving time and space.

Package Shape RECTANGULAR:

The rectangular package shape allows for efficient placement on PCBs, optimizing space utilization.

No. of Terminals 20:

The 20 terminals provide ample connectivity options, making this IC versatile for various telecom interfaces.

Package Style (Meter) SMALL OUTLINE, LOW PROFILE, SHRINK PITCH:

The small outline, low profile, and shrink pitch package style offers a compact design without compromising performance.

Maximum Operating Temperature 85 °C:

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions.

Minimum Operating Temperature -40 °C:

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Finish NICKEL PALLADIUM GOLD:

The nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position DUAL:

The dual terminal position allows for flexibility in circuit design and layout, accommodating various configurations.

Maximum Seated Height 1.5 mm:

With a maximum seated height of 1.5 mm, this IC is suitable for applications with height restrictions.

Width 4.4 mm:

The compact width of 4.4 mm saves space on PCBs, making it an efficient choice for telecom interface designs.

Length 6.5 mm:

The length of 6.5 mm is optimized for compact PCB layouts, offering space-saving benefits.

Temperature Grade INDUSTRIAL:

Designed for industrial applications, this IC can withstand demanding operational environments.

Terminal Form GULL WING:

The gull wing terminal form provides secure soldering connections, ensuring stable performance in high-stress situations.

Telecom IC Type TELECOM CIRCUIT:

Specifically designed for telecom circuits, this IC offers reliable and efficient performance for telecommunications applications.

Nominal Supply Voltage 3 V:

With a nominal supply voltage of 3 V, this IC is compatible with standard power sources in telecom systems.

Terminal Pitch 0.65 mm:

The terminal pitch of 0.65 mm allows for precise connections and efficient signal transmission in telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs SA606D/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA606D/01,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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