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BQ51013BYFPR

Texas Instruments

BQ51013BYFPR by Texas Instruments

BQ51013BYFPR by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.

Median Price

$3.192

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,042 parts In-Stock

1+ parts

$2.525

100+ parts

$2.213

1k+ parts

$1.250

10k+ parts

-

13,042

$2.525

$2.213

$1.250

-

Mouser Electronics

USA . 1,369 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

$2.310

1,369

$3.860

-

-

$2.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.590

-

-

-

Digiode

USA . 674 parts In-Stock

1+ parts

$2.399

100+ parts

-

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674

$2.399

-

-

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VNN

France . 30,841 parts In-Stock

1+ parts

-

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30,841

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-

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Vyrian

USA . 8,029 parts In-Stock

1+ parts

-

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8,029

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-

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Rotakorn

Sweden . 3,247 parts In-Stock

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-

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3,247

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Prism Electronics

USA . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 28,839 parts In-Stock

1+ parts

$1.150

100+ parts

$1.090

1k+ parts

$1.060

10k+ parts

$1.360

28,839

$1.150

$1.090

$1.060

$1.360

Argo Parts USA

USA . 3,731 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

-

10k+ parts

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3,731

$1.590

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-

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Continental Prestige Electronics

USA . 2,586 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

-

10k+ parts

$1.558

2,586

$1.590

-

-

$1.558

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

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10k+ parts

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2,000

$1.590

-

-

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Semicontronic

India . 7,820 parts In-Stock

1+ parts

$2.150

100+ parts

$2.096

1k+ parts

$2.086

10k+ parts

-

7,820

$2.150

$2.096

$2.086

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Ampacity Inc.

Singapore . 7,783 parts In-Stock

1+ parts

$2.150

100+ parts

-

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7,783

$2.150

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Corphita

USA . 1,647 parts In-Stock

1+ parts

$2.272

100+ parts

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1,647

$2.272

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Parana Technologies

USA . 1,275 parts In-Stock

1+ parts

$13.742

100+ parts

-

1k+ parts

$14.228

10k+ parts

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1,275

$13.742

-

$14.228

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DigiPath Technology Company

USA . 723 parts In-Stock

1+ parts

$15.131

100+ parts

$13.921

1k+ parts

-

10k+ parts

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723

$15.131

$13.921

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ChromeModa Solutions

Germany . 5,115 parts In-Stock

1+ parts

$15.440

100+ parts

$12.661

1k+ parts

-

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5,115

$15.440

$12.661

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IDEA Electronic Components Group

UK . 983 parts In-Stock

1+ parts

$15.440

100+ parts

$14.668

1k+ parts

$13.896

10k+ parts

-

983

$15.440

$14.668

$13.896

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$16.260

100+ parts

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251

$16.260

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$18.459

100+ parts

$17.536

1k+ parts

$17.536

10k+ parts

-

2,000

$18.459

$17.536

$17.536

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Kepictronics

USA . 42,146 parts In-Stock

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42,146

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A-Z Elektronik GmbH

Germany . 11,597 parts In-Stock

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11,597

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Alle Elektronik GmbH

Germany . 3,903 parts In-Stock

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3,903

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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Overview

Experience the next level of connectivity with the BQ51013BYFPR by Texas Instruments. This innovative telecom interface IC offers reliability and precision, backed by the renowned quality of its manufacturer. Perfect for a wide range of applications, this product provides seamless integration and superior performance. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the BQ51013BYFPR and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and reliable installation on PCBs, making the product suitable for mass production and automated assembly processes.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables higher component density, reducing overall board size and improving signal integrity.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions without compromising performance or reliability.

Nominal Supply Voltage: 5 V

Operating at a standard nominal supply voltage of 5V ensures compatibility with most common power sources and simplifies circuit design considerations.

Technical Specifications

Other Function Telecom Interface ICs BQ51013BYFPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.002 Mbps

JESD-30 Code:

R-XBGA-B28

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.88 mm

Trade Compliance

BQ51013BYFPR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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