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BQ51010YFFT

Texas Instruments

BQ51010YFFT by Texas Instruments

BQ51010YFFT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, 0.625 mm height, and 0.4 mm pitch. It is used in TELECOM CIRCUITS with a nominal voltage of 7 V. Ideal for surface mount applications due to its very thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,677 parts In-Stock

1+ parts

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8,677

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Digiode

USA . 1,999 parts In-Stock

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1,999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 17 parts In-Stock

1+ parts

$12.573

100+ parts

-

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17

$12.573

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Parana Technologies

USA . 123 parts In-Stock

1+ parts

$13.203

100+ parts

-

1k+ parts

$13.708

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123

$13.203

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$13.708

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Northwest PG Solutions

USA . 243 parts In-Stock

1+ parts

$13.830

100+ parts

$12.447

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243

$13.830

$12.447

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DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$14.538

100+ parts

$13.375

1k+ parts

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2,301

$14.538

$13.375

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ChromeModa Solutions

Germany . 5,023 parts In-Stock

1+ parts

$14.835

100+ parts

$12.165

1k+ parts

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5,023

$14.835

$12.165

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IDEA Electronic Components Group

UK . 2,202 parts In-Stock

1+ parts

$14.835

100+ parts

$14.093

1k+ parts

$13.352

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2,202

$14.835

$14.093

$13.352

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AZTECH Wire

Italy . 661 parts In-Stock

1+ parts

$15.246

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661

$15.246

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One Stop Electronics

USA . 546 parts In-Stock

1+ parts

$805.000

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546

$805.000

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Corphita

USA . 726 parts In-Stock

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726

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Overview

Discover the cutting-edge technology of the BQ51010YFFT by Texas Instruments, a top-tier manufacturer known for its high-quality products. This telecom interface IC offers unparalleled performance and reliability, making it ideal for a wide range of applications. From wireless chargers to IoT devices, this versatile component delivers superior functionality and efficiency. Trust Texas Instruments to provide innovative solutions that exceed your expectations. Upgrade your designs with the BQ51010YFFT and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and reducing costs.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor that can easily fit into various electronic devices and systems.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and interface functions within the product.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with very thin profile and fine pitch enables high density mounting and ensures efficient use of space in electronic devices.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections to the circuit board, enhancing reliability of the product.

Maximum Seated Height: 0.625 mm

Low maximum seated height allows for slim and compact design of the product, ideal for space-constrained applications.

Width: 1.56 mm

Narrow width enhances the product's compatibility with smaller electronic devices and circuit board layouts.

Length: 2.76 mm

Compact length enables the product to fit into tight spaces and ensures efficient use of board real estate.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections for improved performance and durability of the product.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product offers specialized features and functions tailored to the telecom industry's requirements.

Nominal Supply Voltage: 7 V

Operating at a nominal supply voltage of 7V, the product is compatible with standard power sources in telecom systems, ensuring reliable performance.

Terminal Pitch: 0.4 mm

With a tight terminal pitch of 0.4mm, the product allows for high-density mounting and efficient use of board space, ideal for compact telecom applications.

Technical Specifications

Other Function Telecom Interface ICs BQ51010YFFT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B28

Length:

2.76 mm

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

7 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.56 mm

Trade Compliance

BQ51010YFFT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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