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BQ51013YFFR

Texas Instruments

BQ51013YFFR by Texas Instruments

BQ51013YFFR by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating b/w 0-125°C. It features TIN SILVER COPPER finish, 0.4mm terminal pitch, and 5V supply voltage. Ideal for TELECOM CIRCUITS due to its very thin profile and fine pitch package style.

Median Price

$4.170

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 105,000 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

105,000

-

$3.610

$3.230

$3.040

DigiKey

USA . 105,000 parts In-Stock

1+ parts

-

100+ parts

$4.170

1k+ parts

-

10k+ parts

-

105,000

-

$4.170

-

-

Verical

USA . 69,000 parts In-Stock

1+ parts

-

100+ parts

$4.513

1k+ parts

$4.037

10k+ parts

$3.800

69,000

-

$4.513

$4.037

$3.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,286 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$4.000

-

-

-

Vyrian

USA . 3,562 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

3,562

$4.170

-

-

-

DigiKey Marketplace

USA . 105,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,473 parts In-Stock

1+ parts

$3.789

100+ parts

-

1k+ parts

-

10k+ parts

-

4,473

$3.789

-

-

-

Parana Technologies

USA . 875 parts In-Stock

1+ parts

$5.557

100+ parts

-

1k+ parts

$6.334

10k+ parts

-

875

$5.557

-

$6.334

-

DigiPath Technology Company

USA . 1,615 parts In-Stock

1+ parts

$6.119

100+ parts

$5.630

1k+ parts

-

10k+ parts

-

1,615

$6.119

$5.630

-

-

ChromeModa Solutions

Germany . 3,217 parts In-Stock

1+ parts

$6.244

100+ parts

$5.120

1k+ parts

-

10k+ parts

-

3,217

$6.244

$5.120

-

-

IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$6.244

100+ parts

-

1k+ parts

$5.620

10k+ parts

-

1,411

$6.244

-

$5.620

-

Microchip USA

USA . 475 parts In-Stock

1+ parts

$25.500

100+ parts

$25.420

1k+ parts

$25.420

10k+ parts

$25.340

475

$25.500

$25.420

$25.420

$25.340

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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25,000

-

-

-

-

Assy Fe

Spain . 4,880 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,880

-

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,790

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,234

-

-

-

-

Alle Elektronik GmbH

Germany . 1,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,489

-

-

-

-

Native Components

USA . 866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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866

-

-

-

-

Northwest PG Solutions

USA . 696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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696

-

-

-

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Kepictronics

USA . 70 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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70

-

-

-

-

Overview

Discover the innovative BQ51013YFFR by Texas Instruments, a cutting-edge Telecom Interface IC that offers unparalleled quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is sure to exceed your expectations. Perfect for a wide range of applications, this IC provides seamless connectivity and exceptional performance. Experience the value and benefits of this top-of-the-line product, designed to enhance your projects and streamline your operations. Upgrade to Texas Instruments today and see the difference for yourself.

Feature Benefit Bullets

Surface Mount: YES

Ease of assembly during manufacturing process as it can be directly mounted onto PCB.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and easy placement.

No. of Terminals: 28

Sufficient number of terminals for connectivity and functionality of the telecom interface IC.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Can operate in low temperature conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

Provides good electrical conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal positioning helps in efficient heat dissipation.

Maximum Seated Height: 0.625 mm

Low profile allows for compact design and space-saving on the PCB.

Width: 1.56 mm

Narrow width contributes to space efficiency and placement flexibility on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for a short duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during soldering process.

Length: 2.76 mm

Compact length helps in designing smaller and more portable telecom devices.

Terminal Form: BALL

Ball terminal form facilitates easy and reliable connections.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed and optimized for telecom applications, ensuring high performance and reliability in telecommunications equipment.

Nominal Supply Voltage: 5 V

Operates at standard 5V supply voltage, compatible with most telecom systems and devices.

Terminal Pitch: 0.4 mm

Fine pitch design allows for high density packaging and efficient use of PCB space.

Technical Specifications

Other Function Telecom Interface ICs BQ51013YFFR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B28

JESD-609 Code:

e1

Length:

2.76 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.56 mm

Trade Compliance

BQ51013YFFR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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