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BQ51013AYFPR

Texas Instruments

BQ51013AYFPR by Texas Instruments

BQ51013AYFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.

Median Price

$3.454

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,499 parts In-Stock

1+ parts

$3.454

100+ parts

$3.027

1k+ parts

$1.710

10k+ parts

-

5,499

$3.454

$3.027

$1.710

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,184 parts In-Stock

1+ parts

$3.281

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-

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2,184

$3.281

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Vyrian

USA . 3,854 parts In-Stock

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3,854

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Distributors (Availability)

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Corphita

USA . 4,924 parts In-Stock

1+ parts

$3.109

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-

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4,924

$3.109

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AZTECH Wire

Italy . 762 parts In-Stock

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$9.100

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762

$9.100

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Parana Technologies

USA . 202 parts In-Stock

1+ parts

$15.615

100+ parts

-

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$15.984

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202

$15.615

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$15.984

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DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

$17.194

100+ parts

$15.819

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433

$17.194

$15.819

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ChromeModa Solutions

Germany . 3,474 parts In-Stock

1+ parts

$17.545

100+ parts

$14.387

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3,474

$17.545

$14.387

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IDEA Electronic Components Group

UK . 294 parts In-Stock

1+ parts

$17.545

100+ parts

$16.668

1k+ parts

$15.790

10k+ parts

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294

$17.545

$16.668

$15.790

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Authorized Procurement Solutions

USA . 18,000 parts In-Stock

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18,000

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Metaverse IC Inc.

Canada . 15,521 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Lixinc

USA . 13,104 parts In-Stock

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13,104

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Component Stockers USA

USA . 6,463 parts In-Stock

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6,463

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QUARKTWIN TECHNOLOGY LTD

USA . 3,143 parts In-Stock

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3,143

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A-Z Elektronik GmbH

Germany . 2,445 parts In-Stock

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2,445

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Alle Elektronik GmbH

Germany . 1,630 parts In-Stock

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1,630

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Native Components

USA . 477 parts In-Stock

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477

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Northwest PG Solutions

USA . 219 parts In-Stock

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219

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Overview

Experience the superior quality and reliability of Texas Instruments with the BQ51013AYFPR. This Telecom Interface IC offers unparalleled performance in a variety of applications, providing customers with a top-of-the-line solution for their needs. With its advanced features and innovative design, this product delivers exceptional value and benefits to users, making it the perfect choice for your next project. Trust Texas Instruments for all your electronic component needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for the package body makes the product lightweight and durable, making it easy to handle and less prone to damage during transportation or handling.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs in production processes.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of space on a PCB, allowing for a compact overall design and maximizing component density.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options, allowing for versatile interfacing with other components in a telecom system.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product is suitable for use in a wide range of environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the product can withstand cold environments, making it versatile for various application scenarios.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of Tin/Silver/Copper terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable performance over extended periods of use.

Width: 1.88 mm

The narrow width of 1.88 mm allows for efficient use of space on a PCB, enabling a compact and streamlined design.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V offers compatibility with standard power sources, making integration into existing systems straightforward.

Data Rate: 0.002 Mbps

The data rate of 0.002 Mbps enables efficient data transfer in telecom applications, ensuring smooth communication processes.

Technical Specifications

Other Function Telecom Interface ICs BQ51013AYFPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.002 Mbps

JESD-30 Code:

R-PBGA-B28

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.88 mm

Trade Compliance

BQ51013AYFPR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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