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BQ51010YFFR

Texas Instruments

BQ51010YFFR by Texas Instruments

BQ51010YFFR by Texas Instruments is a telecom interface IC with 28 terminals in a rectangular grid array package. It operates at a nominal voltage of 7V and has a terminal pitch of 0.4mm. This IC is suitable for telecom circuit applications due to its very thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,594 parts In-Stock

1+ parts

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7,594

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Digiode

USA . 4,589 parts In-Stock

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4,589

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Distributors (Availability)

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Parana Technologies

USA . 2,259 parts In-Stock

1+ parts

$10.894

100+ parts

-

1k+ parts

$11.366

10k+ parts

-

2,259

$10.894

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$11.366

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DigiPath Technology Company

USA . 1,026 parts In-Stock

1+ parts

$11.996

100+ parts

$11.036

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1,026

$11.996

$11.036

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ChromeModa Solutions

Germany . 1,583 parts In-Stock

1+ parts

$12.241

100+ parts

$10.038

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1,583

$12.241

$10.038

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$12.241

100+ parts

$11.629

1k+ parts

$11.017

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-

1,499

$12.241

$11.629

$11.017

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AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$15.441

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235

$15.441

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One Stop Electronics

USA . 1,467 parts In-Stock

1+ parts

$120.000

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1,467

$120.000

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Corphita

USA . 4,349 parts In-Stock

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4,349

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Northwest PG Solutions

USA . 1,721 parts In-Stock

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1,721

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Native Components

USA . 222 parts In-Stock

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222

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Overview

Elevate your telecom interface applications with the BQ51010YFFR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers innovative solutions that meet the highest industry standards. This versatile IC offers a compact design with a low profile package, making it ideal for space-constrained applications. With a nominal supply voltage of 7V, this telecom circuit IC provides efficient power management for your devices. Experience seamless connectivity and enhanced performance with the BQ51010YFFR, setting a new standard in telecom interface technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient mounting on PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor that is commonly used in the industry, making it compatible with a wide range of PCB designs.

No. of Terminals: 28

Having 28 terminals allows for multiple connections and functionalities to be integrated into the IC, making it suitable for telecom applications that require complex circuitry.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch leads to improved signal integrity, high-density packaging, and reliability in high-frequency telecom applications.

Terminal Position: BOTTOM

Bottom terminal position enables easier routing of traces on the PCB, leading to better signal integrity and reducing interference with other components.

Maximum Seated Height: 0.625 mm

Low maximum seated height helps in achieving a compact design and allows for integration in slim devices or applications where space is limited.

Width: 1.56 mm

Narrow width makes the IC suitable for applications where board space is restricted and helps in achieving high-density board layouts.

Length: 2.76 mm

Compact length ensures the IC can be accommodated in small form factors without compromising on functionality or performance.

Terminal Form: BALL

Ball terminal form offers reliable connections with the PCB, contributing to better electrical performance and long-term reliability in telecom interfaces.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type ensures compatibility, reliability, and optimized performance in telecommunication systems.

Nominal Supply Voltage: 7 V

Operates at a nominal supply voltage of 7 V, which is commonly used in telecom applications and ensures compatibility with existing power systems.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm enables high-density mounting and allows for more terminals in a compact space, making it ideal for telecom interfaces with multiple connections.

Technical Specifications

Other Function Telecom Interface ICs BQ51010YFFR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B28

Length:

2.76 mm

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

7 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.56 mm

Trade Compliance

BQ51010YFFR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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