Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF37A73IDSGT by Texas Instruments is an 8-terminal telecom IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and features no-lead terminal form. The package style is small outline, heat sink/slug, very thin profile, making it suitable for telecom circuit applications.
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Provides durability and reliability to the product, making it suitable for long-term use in various environments.
Enables easy and efficient PCB assembly, saving time and effort during the manufacturing process.
Optimal shape for space-saving design and efficient component placement on the PCB.
Provides sufficient connectivity options for interfacing with other components and devices.
Combination of small outline, heat sink/slug, and very thin profile design makes the product suitable for compact and efficient telecom applications.
Ensures stable performance even in high-temperature environments, enhancing the product's reliability.
Designed to operate effectively in extreme low-temperature conditions, providing versatility in different operating environments.
Offers excellent conductivity and corrosion resistance, ensuring longevity and consistent performance of the terminals.
Dual terminal position allows for flexible PCB layout and easier integration into different system designs.
Low seated height enables a compact overall product design, perfect for space-constrained applications.
Compact width size facilitates efficient PCB layout and integration into space-limited designs.
Supports quick and reliable soldering during assembly, ensuring proper connections and reducing production time.
High peak reflow temperature ensures secure solder joints, enhancing the overall robustness of the product.
Compact length size contributes to a smaller footprint on the PCB, ideal for densely populated board layouts.
Industrial-grade temperature range makes the product suitable for harsh operating conditions and industrial applications.
Lead-free terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices.
Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.
Compatible with standard 3.3V supply voltage, facilitating easy integration into various electronic systems.
Fine terminal pitch allows for high-density mounting on the PCB, maximizing space efficiency in the overall design.
Other Function Telecom Interface ICs TRF37A73IDSGT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Channels:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
TRF37A73IDSGT Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.33.00.01
SB
8542.33.00.00
PCN Design/Specification - Mult Dev Material Chg 29/Mar/2018
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317AEMP/NOPB
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Rectron
BSS138
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
MBRS1100T3G
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
451-00001C
Laird Technologies
Laird Technologies' 451-00001C is a surface mount telecom IC with 71 terminals. Operating temp range: -40 to 85°C. Features include data rate of 2 Mbps, nominal voltage of 3.3 V, and compact rectangular package suitable for telecom circuit applications.
JN5168-001-M06Z
NXP Semiconductors
TELECOM CIRCUIT; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 3;
ETRX357
Silicon Labs
ETRX357 by Silicon Labs is a telecom IC with 33 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 1.27mm. This industrial-grade IC is used in telecom circuits for various applications due to its compact rectangular package style and no-lead terminal form.
XBP9X-DMUS-001
Digi International
XBP9X-DMUS-001 by Digi Int. is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 37 terminals, operating from -40 to 85 °C at 3.3V. It's a 0.25 Mbps TELECOM CIRCUIT IC ideal for telecom interfaces due to its surface mount capability and NO LEAD terminal form.
ZOE-M8Q-0-10
U-blox Ag
ZOE-M8Q-0-10 by U-blox Ag is a telecom IC with 51 terminals, operating at -40 to 85°C. It features a 3V supply voltage, 0.5mm terminal pitch, and AEC-Q100 screening for industrial applications. This surface-mount device in square package shape is ideal for compact telecom circuit designs.
BT832AF
Fanstel
BT832AF by Fanstel is a telecom IC with 1 Mbps data rate, suitable for industrial applications. It features a rectangular microelectronic assembly package style, surface mount design, and operates b/w -40 to 85°C temperatures. With 40 terminals and compact dimensions of 14mm width and 20.8mm length, it offers versatile connectivity options in telecom interfaces.
CC2530F32RHAT
CC2530F32RHAT by Texas Instruments is a 40-terminal telecom IC with a nominal voltage of 3V. It operates b/w -40 to 125°C, suitable for automotive applications. The chip carrier package style has a very thin profile and is surface mountable, making it ideal for compact designs.
RS9116W-SB00-AA1-X2A
TELECOM CIRCUIT;
BGM113A256V2R
BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.
SA638
Philips Semiconductors
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
SN65DSI86IPAPRQ1
SN65DSI86IPAPRQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 85°C, with terminal finish of NiPdAu. This IC has a nominal voltage of 1.2V and is suitable for industrial temperature grade applications.
NEO-M8U-05B
NEO-M8U-05B by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its compact size of 12.2x16mm and low supply voltage of 3V make it ideal for industrial applications requiring precise positioning and timing accuracy. With AEC-Q100 screening, it's suitable for automotive and IoT devices needing reliable telecom interfaces.
WT32I-A-AI6IAP
The Silicon Labs WT32I-A-AI6IAP is a telecom IC with 50 terminals, rectangular package shape, and industrial temperature grade. It is surface mountable and has a microelectronic assembly package style. Ideal for telecom circuit applications with operating temperatures ranging from -40°C to 85°C.
JN5168-001-M03Z
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 240;
RN42HID-I/RM
Microchip Technology's RN42HID-I/RM is a telecom IC with 32 terminals, operating at 3.3V. It offers a data rate of 3 Mbps and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed wireless communication.
SA612AD/01,118
SA612AD/01,118 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This small outline IC is suitable for telecom circuit applications due to its dual terminal position and gull wing form factor.
TESEO-VIC3D
CC1120RHBT
CC1120RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.2 Mbps, suitable for telecom circuits in industrial applications. This surface-mount chip carrier package measures 5x5mm with a very thin profile, making it ideal for compact designs.
HMC980LP4ETR
Analog Devices
Analog Devices' HMC980LP4ETR is a 24-terminal telecom IC with matte tin finish, operating b/w -40 to 85°C. It comes in a square chip carrier package style, suitable for industrial applications requiring a nominal voltage of 12V. The IC is surface mountable and has a terminal pitch of 0.5mm, making it ideal for telecom circuit designs.
MAX7044AKA+T
MAX7044AKA+T by Analog Devices is a CMOS telecom IC with 8 terminals, operating at temperatures from -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, making it ideal for automotive applications requiring small outline packages and surface mount technology.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TRF37B73IDSGT
TRF37B73IDSGT by Texas Instruments is an 8-terminal telecom IC with a package style of small outline, heat sink/slug, and very thin profile. It operates b/w -40 to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits due to its nickel palladium gold terminal finish and industrial temperature grade suitability.
TRF37B32IRTVR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
TRF3722IRGZT
TRF3722IRGZT by Texas Instruments is a telecom IC with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.5mm. Suitable for telecom circuits, it comes in a square chip carrier package style with nickel palladium gold finish.
TRF3020PT
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
TRF370315IRGERG4
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: QCCN; Package Shape: SQUARE;
TRF370315IRGETG4
TRF3703IRGER
TRF3703IRGET
TRF3722IRGZR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
TRF37A32IRTVR
TRF37A32IRTVT
TRF37A73IDSGR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
TRF37B32IRTVT
TRF37B73IDSGR
TRF37C32IRTVR
TRF37C32IRTVT
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