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TRF37A73IDSGT

Texas Instruments

TRF37A73IDSGT by Texas Instruments

TRF37A73IDSGT by Texas Instruments is an 8-terminal telecom IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and features no-lead terminal form. The package style is small outline, heat sink/slug, very thin profile, making it suitable for telecom circuit applications.

Median Price

$1.158

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 213 parts In-Stock

1+ parts

$0.600

100+ parts

$0.595

1k+ parts

$0.593

10k+ parts

-

213

$0.600

$0.595

$0.593

-

Texas Instruments

USA . 10,064 parts In-Stock

1+ parts

$1.158

100+ parts

$0.956

1k+ parts

$0.517

10k+ parts

-

10,064

$1.158

$0.956

$0.517

-

DigiKey

USA . 313 parts In-Stock

1+ parts

$1.810

100+ parts

$1.349

1k+ parts

-

10k+ parts

-

313

$1.810

$1.349

-

-

Mouser Electronics

USA . 230 parts In-Stock

1+ parts

$1.810

100+ parts

$1.240

1k+ parts

$1.070

10k+ parts

$1.010

230

$1.810

$1.240

$1.070

$1.010

Rochester

USA . 58 parts In-Stock

1+ parts

-

100+ parts

$1.010

1k+ parts

$0.838

10k+ parts

$0.747

58

-

$1.010

$0.838

$0.747

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,759 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

10k+ parts

-

2,759

$0.552

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.794

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.794

-

-

-

Vyrian

USA . 1,952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,952

-

-

-

-

Chip Stock

USA . 162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

162

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,765 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,765

$0.510

-

-

-

Corphita

USA . 2,525 parts In-Stock

1+ parts

$0.523

100+ parts

-

1k+ parts

-

10k+ parts

-

2,525

$0.523

-

-

-

Continental Prestige Electronics

USA . 3,688 parts In-Stock

1+ parts

$0.794

100+ parts

-

1k+ parts

-

10k+ parts

$0.778

3,688

$0.794

-

-

$0.778

Argo Parts USA

USA . 2,229 parts In-Stock

1+ parts

$0.794

100+ parts

-

1k+ parts

-

10k+ parts

-

2,229

$0.794

-

-

-

Andel Nordic

Denmark . 3,445 parts In-Stock

1+ parts

$4.161

100+ parts

-

1k+ parts

$3.995

10k+ parts

$3.995

3,445

$4.161

-

$3.995

$3.995

Parana Technologies

USA . 1,276 parts In-Stock

1+ parts

$6.638

100+ parts

-

1k+ parts

$7.356

10k+ parts

-

1,276

$6.638

-

$7.356

-

IDEA Electronic Components Group

UK . 727 parts In-Stock

1+ parts

$7.458

100+ parts

-

1k+ parts

$6.712

10k+ parts

-

727

$7.458

-

$6.712

-

ChromeModa Solutions

Germany . 521 parts In-Stock

1+ parts

$7.458

100+ parts

$6.116

1k+ parts

-

10k+ parts

-

521

$7.458

$6.116

-

-

Corohmni

South Africa . 465 parts In-Stock

1+ parts

$16.055

100+ parts

-

1k+ parts

-

10k+ parts

-

465

$16.055

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

DigiPath Technology Company

USA . 956 parts In-Stock

1+ parts

-

100+ parts

$6.724

1k+ parts

-

10k+ parts

-

956

-

$6.724

-

-

Overview

Enhance your telecommunications systems with the TRF37A73IDSGT by Texas Instruments. Known for their superior quality and expertise in manufacturing, Texas Instruments delivers cutting-edge solutions for telecom interface ICs. This small outline, heat sink package offers a very thin profile and dual terminals, making it ideal for industrial applications. With a nominal supply voltage of 3.3V, this Telecom Circuit type IC provides reliability and efficiency. Upgrade your telecom systems today and experience the value and benefits that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability to the product, making it suitable for long-term use in various environments.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Package Shape: SQUARE

Optimal shape for space-saving design and efficient component placement on the PCB.

No. of Terminals: 8

Provides sufficient connectivity options for interfacing with other components and devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of small outline, heat sink/slug, and very thin profile design makes the product suitable for compact and efficient telecom applications.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, enhancing the product's reliability.

Minimum Operating Temperature: -40 °C

Designed to operate effectively in extreme low-temperature conditions, providing versatility in different operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent conductivity and corrosion resistance, ensuring longevity and consistent performance of the terminals.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and easier integration into different system designs.

Maximum Seated Height: 0.8 mm

Low seated height enables a compact overall product design, perfect for space-constrained applications.

Width: 2 mm

Compact width size facilitates efficient PCB layout and integration into space-limited designs.

Maximum Time At Peak Reflow Temperature (s): 30

Supports quick and reliable soldering during assembly, ensuring proper connections and reducing production time.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints, enhancing the overall robustness of the product.

Length: 2 mm

Compact length size contributes to a smaller footprint on the PCB, ideal for densely populated board layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range makes the product suitable for harsh operating conditions and industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.

Nominal Supply Voltage: 3.3 V

Compatible with standard 3.3V supply voltage, facilitating easy integration into various electronic systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, maximizing space efficiency in the overall design.

Technical Specifications

Other Function Telecom Interface ICs TRF37A73IDSGT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

TRF37A73IDSGT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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