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TRF3722IRGZR

Texas Instruments

TRF3722IRGZR by Texas Instruments

TRF3722IRGZR by Texas Instruments is a 48-terminal telecom IC with a nominal voltage of 3.3V, operating b/w -40 to 85°C. It features a chip carrier package style, nickel palladium gold terminal finish, and is suitable for telecom circuit applications.

Median Price

$15.854

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,345 parts In-Stock

1+ parts

$12.807

100+ parts

$11.187

1k+ parts

$7.715

10k+ parts

-

9,345

$12.807

$11.187

$7.715

-

DigiKey

USA . 6,977 parts In-Stock

1+ parts

$18.900

100+ parts

$13.039

1k+ parts

$12.232

10k+ parts

$11.720

6,977

$18.900

$13.039

$12.232

$11.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,248 parts In-Stock

1+ parts

$10.925

100+ parts

-

1k+ parts

-

10k+ parts

-

1,248

$10.925

-

-

-

Vyrian

USA . 3,666 parts In-Stock

1+ parts

$11.500

100+ parts

-

1k+ parts

-

10k+ parts

-

3,666

$11.500

-

-

-

Chip Stock

USA . 5,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,180

-

-

-

-

NexGen Digital

USA . 158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

158

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,308 parts In-Stock

1+ parts

$7.937

100+ parts

-

1k+ parts

$8.499

10k+ parts

-

2,308

$7.937

-

$8.499

-

IDEA Electronic Components Group

UK . 2,083 parts In-Stock

1+ parts

$8.918

100+ parts

$8.472

1k+ parts

$8.026

10k+ parts

-

2,083

$8.918

$8.472

$8.026

-

ChromeModa Solutions

Germany . 1,002 parts In-Stock

1+ parts

$8.918

100+ parts

$7.313

1k+ parts

-

10k+ parts

-

1,002

$8.918

$7.313

-

-

Corphita

USA . 4,156 parts In-Stock

1+ parts

$10.350

100+ parts

-

1k+ parts

-

10k+ parts

-

4,156

$10.350

-

-

-

Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

DigiPath Technology Company

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$8.040

1k+ parts

-

10k+ parts

-

100

-

$8.040

-

-

Overview

Enhance your telecom systems with the TRF3722IRGZR by Texas Instruments, a cutting-edge solution that guarantees top-notch quality and reliability. As a leading manufacturer in the industry, Texas Instruments offers unmatched expertise and innovation in the field of Other Function Telecom Interface ICs. This versatile product is ideal for a wide range of applications, providing seamless connectivity and optimal performance. Elevate your projects with the TRF3722IRGZR, delivering exceptional value, benefits, and advantages to meet your unique needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Easy to mount on PCBs, saving time and effort during assembly.

No. of Terminals: 48

Offers ample connectivity options for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Nominal Supply Voltage: 3.3 V

Compatible with common voltage standards in telecommunications.

Technical Specifications

Other Function Telecom Interface ICs TRF3722IRGZR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF3722IRGZR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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