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TRF37A73IDSGR

Texas Instruments

TRF37A73IDSGR by Texas Instruments

TRF37A73IDSGR by Texas Instruments is a telecom interface IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3.3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and peak reflow temperature of 260°C.

Median Price

$1.222

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 39,207 parts In-Stock

1+ parts

$1.065

100+ parts

$0.819

1k+ parts

$0.431

10k+ parts

-

39,207

$1.065

$0.819

$0.431

-

DigiKey

USA . 3,562 parts In-Stock

1+ parts

$1.380

100+ parts

$1.028

1k+ parts

$0.896

10k+ parts

$0.792

3,562

$1.380

$1.028

$0.896

$0.792

Mouser Electronics

USA . 984 parts In-Stock

1+ parts

$1.530

100+ parts

$0.965

1k+ parts

$0.861

10k+ parts

$0.788

984

$1.530

$0.965

$0.861

$0.788

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.539

3,000

-

-

-

$0.539

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,180 parts In-Stock

1+ parts

$0.539

100+ parts

-

1k+ parts

-

10k+ parts

-

1,180

$0.539

-

-

-

Digiode

USA . 157 parts In-Stock

1+ parts

$1.012

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$1.012

-

-

-

Chip Stock

USA . 165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

165

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,681 parts In-Stock

1+ parts

$0.458

100+ parts

-

1k+ parts

-

10k+ parts

-

11,681

$0.458

-

-

-

Semicontronic

India . 11,560 parts In-Stock

1+ parts

$0.458

100+ parts

$0.447

1k+ parts

$0.444

10k+ parts

-

11,560

$0.458

$0.447

$0.444

-

Corohmni

South Africa . 416 parts In-Stock

1+ parts

$0.539

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$0.539

-

-

-

Corphita

USA . 4,633 parts In-Stock

1+ parts

$0.958

100+ parts

-

1k+ parts

-

10k+ parts

-

4,633

$0.958

-

-

-

Parana Technologies

USA . 470 parts In-Stock

1+ parts

$9.516

100+ parts

-

1k+ parts

$10.116

10k+ parts

-

470

$9.516

-

$10.116

-

ChromeModa Solutions

Germany . 4,201 parts In-Stock

1+ parts

$10.692

100+ parts

$8.767

1k+ parts

-

10k+ parts

-

4,201

$10.692

$8.767

-

-

IDEA Electronic Components Group

UK . 1,687 parts In-Stock

1+ parts

$10.692

100+ parts

$10.157

1k+ parts

$9.623

10k+ parts

-

1,687

$10.692

$10.157

$9.623

-

Lixinc

USA . 14,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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14,199

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

DigiPath Technology Company

USA . 848 parts In-Stock

1+ parts

-

100+ parts

$9.640

1k+ parts

-

10k+ parts

-

848

-

$9.640

-

-

Overview

Experience seamless communication like never before with the TRF37A73IDSGR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This telecom interface IC is versatile in its applications, offering a wide range of benefits to customers. Whether you're looking for enhanced connectivity or improved performance, this product delivers on value and efficiency. Upgrade your communication systems with the TRF37A73IDSGR and stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for long-term use, making it a good choice for telecom applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package provides a compact and space-efficient design, ideal for telecom devices where space is limited.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functionality within the telecom interface IC, enhancing its performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions in industrial settings.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC is optimized for efficient data transmission and connectivity in telecom systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this IC offers compatibility with standard power sources in telecom environments.

Technical Specifications

Other Function Telecom Interface ICs TRF37A73IDSGR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

TRF37A73IDSGR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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