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TRF37B32IRTVT

Texas Instruments

TRF37B32IRTVT by Texas Instruments

TRF37B32IRTVT by Texas Instruments is a 32-terminal telecom IC with 2 channels, operating at -40 to 85°C. It features a no-lead terminal form, quad position, and nickel/palladium/gold/silver finish. Ideal for telecom circuits, this chip carrier has a very thin profile and is suitable for industrial applications.

Median Price

$24.120

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 53 parts In-Stock

1+ parts

$1.710

100+ parts

$1.710

1k+ parts

-

10k+ parts

-

53

$1.710

$1.710

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-

Texas Instruments

USA . 4,804 parts In-Stock

1+ parts

$23.389

100+ parts

$20.431

1k+ parts

$14.090

10k+ parts

-

4,804

$23.389

$20.431

$14.090

-

Mouser Electronics

USA . 121 parts In-Stock

1+ parts

$36.630

100+ parts

-

1k+ parts

$24.960

10k+ parts

-

121

$36.630

-

$24.960

-

Rochester

USA . 2,205 parts In-Stock

1+ parts

-

100+ parts

$19.880

1k+ parts

$17.790

10k+ parts

$16.740

2,205

-

$19.880

$17.790

$16.740

DigiKey

USA . 2,205 parts In-Stock

1+ parts

-

100+ parts

$26.160

1k+ parts

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2,205

-

$26.160

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Verical

USA . 1,955 parts In-Stock

1+ parts

-

100+ parts

$24.850

1k+ parts

$22.238

10k+ parts

$20.925

1,955

-

$24.850

$22.238

$20.925

Farnell

UK . 53 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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53

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,742 parts In-Stock

1+ parts

$1.624

100+ parts

-

1k+ parts

-

10k+ parts

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1,742

$1.624

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Vyrian

USA . 419 parts In-Stock

1+ parts

$1.710

100+ parts

-

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-

10k+ parts

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419

$1.710

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Chip Stock

USA . 133 parts In-Stock

1+ parts

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133

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 143 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

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143

$1.539

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Component Stockers USA

USA . 1,932 parts In-Stock

1+ parts

$1.690

100+ parts

$19.090

1k+ parts

$17.260

10k+ parts

-

1,932

$1.690

$19.090

$17.260

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Parana Technologies

USA . 1,647 parts In-Stock

1+ parts

$5.979

100+ parts

-

1k+ parts

$6.756

10k+ parts

-

1,647

$5.979

-

$6.756

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IDEA Electronic Components Group

UK . 1,723 parts In-Stock

1+ parts

$6.718

100+ parts

-

1k+ parts

$6.046

10k+ parts

-

1,723

$6.718

-

$6.046

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ChromeModa Solutions

Germany . 1,068 parts In-Stock

1+ parts

$6.718

100+ parts

$5.509

1k+ parts

-

10k+ parts

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1,068

$6.718

$5.509

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DigiPath Technology Company

USA . 1,462 parts In-Stock

1+ parts

-

100+ parts

$6.057

1k+ parts

-

10k+ parts

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1,462

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$6.057

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Experience the superior quality of Texas Instruments with the TRF37B32IRTVT telecom interface IC. Designed for maximum performance and reliability, this versatile product is perfect for a wide range of applications in the telecommunications industry. With its innovative design and advanced features, customers can trust that they are getting a top-of-the-line product that delivers value and benefits. Upgrade your telecom systems with the TRF37B32IRTVT and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and reducing production costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring reliable performance in various industrial settings.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V enables compatibility with a wide range of power sources, offering flexibility in system design and integration.

Moisture Sensitivity Level (MSL): 2

A low moisture sensitivity level of 2 indicates that the product is less susceptible to moisture damage during storage and handling, enhancing its reliability and shelf life.

Technical Specifications

Other Function Telecom Interface ICs TRF37B32IRTVT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Additional Features:

RF frequency(Min)(MHz) is 700; RF frequency(Max)(MHz) is 2700

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TRF37B32IRTVT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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