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TRF37C32IRTVR

Texas Instruments

TRF37C32IRTVR by Texas Instruments

TRF37C32IRTVR by Texas Instruments is a telecom interface IC with 2 channels, operating at 3.3V. It features a package style of chip carrier with very thin profile and terminal finish of Ni/Pd/Au/Ag. Ideal for industrial applications requiring a temp range of -40 to 85°C.

Median Price

$23.700

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,873 parts In-Stock

1+ parts

-

100+ parts

$18.960

1k+ parts

$16.970

10k+ parts

$15.970

5,873

-

$18.960

$16.970

$15.970

DigiKey

USA . 5,873 parts In-Stock

1+ parts

-

100+ parts

$24.950

1k+ parts

-

10k+ parts

-

5,873

-

$24.950

-

-

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$23.700

1k+ parts

$21.212

10k+ parts

$19.962

3,000

-

$23.700

$21.212

$19.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,705 parts In-Stock

1+ parts

$17.404

100+ parts

-

1k+ parts

-

10k+ parts

-

1,705

$17.404

-

-

-

Vyrian

USA . 872 parts In-Stock

1+ parts

$18.320

100+ parts

-

1k+ parts

-

10k+ parts

-

872

$18.320

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,495 parts In-Stock

1+ parts

$13.540

100+ parts

-

1k+ parts

$14.042

10k+ parts

-

1,495

$13.540

-

$14.042

-

DigiPath Technology Company

USA . 649 parts In-Stock

1+ parts

$14.910

100+ parts

$13.717

1k+ parts

-

10k+ parts

-

649

$14.910

$13.717

-

-

ChromeModa Solutions

Germany . 3,951 parts In-Stock

1+ parts

$15.214

100+ parts

$12.475

1k+ parts

-

10k+ parts

-

3,951

$15.214

$12.475

-

-

IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$15.214

100+ parts

$14.453

1k+ parts

$13.693

10k+ parts

-

893

$15.214

$14.453

$13.693

-

Ampacity Inc.

Singapore . 5,812 parts In-Stock

1+ parts

$15.570

100+ parts

-

1k+ parts

-

10k+ parts

-

5,812

$15.570

-

-

-

Corphita

USA . 1,927 parts In-Stock

1+ parts

$16.488

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

$16.488

-

-

-

Overview

Unlock unparalleled performance and reliability with the TRF37C32IRTVR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers seamless integration and superior functionality for a wide range of applications. From telecommunications to industrial automation, this product delivers unmatched value, efficiency, and innovation. Trust in Texas Instruments to elevate your projects to new heights with cutting-edge technology and unparalleled quality. Experience the difference with the TRF37C32IRTVR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and strength, making it suitable for use in various telecom applications.

Surface Mount: YES

Surface mount capability makes it easier to integrate this product into circuit boards, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, allowing for versatile and flexible telecom interface configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal management and compact design characteristics, ideal for telecom applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures functionality even in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of high-quality terminal finishes like nickel, palladium, gold, and silver enhances conductivity and corrosion resistance, improving overall performance and longevity.

Terminal Position: QUAD

The quad terminal position is designed for optimal signal transmission and connectivity, reducing signal interference and improving overall signal quality.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8 mm, this product offers a low-profile design, which can be beneficial in space-constrained telecom applications.

Width: 5 mm

The width of 5 mm provides a compact form factor, making it easier to integrate into various telecom equipment and devices.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and reflow processes, leading to reliable and stable connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 C, this product can withstand the soldering process without any damage, ensuring a secure and durable assembly.

Length: 5 mm

The length of 5 mm complements the compact width, providing a balanced and space-efficient package for telecom applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification guarantees reliable operation in harsh industrial environments, making it a suitable choice for industrial telecom applications.

No. of Channels: 2

Featuring 2 channels allows for simultaneous data transmission or reception, enhancing the efficiency and performance of the telecom interface.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failure and ensures a more robust and reliable connection.

Telecom IC Type: TELECOM CIRCUIT

The telecom circuit type is specifically designed for telecom applications, providing optimized performance and compatibility with telecom systems and networks.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product is compatible with common power sources in telecom equipment, simplifying integration and operation.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density packaging and precise alignment of terminals, enabling efficient signal transmission and connectivity.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that this product can withstand moderate exposure to moisture without compromising its performance and reliability.

Technical Specifications

Other Function Telecom Interface ICs TRF37C32IRTVR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Additional Features:

RF frequency(Min)(MHz) is 1700; RF frequency(Max)(MHz) is 3800

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TRF37C32IRTVR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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