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CY7B923-JXC

Infineon Technologies

CY7B923-JXC by Infineon Technologies

CY7B923-JXC by Infineon is a BICMOS telecom IC with 28 terminals, operating at 5V. It has a data rate of 400 Mbps and can handle a max supply current of 85mA. This chip carrier package is ideal for telecom circuits requiring high-speed data transmission in commercial temperature environments.

Median Price

$226.306

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Rochester

USA . 7,646 parts In-Stock

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$208.100

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$195.610

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Verical

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$244.512

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$228.912

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492

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$228.912

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Digiode

USA . 141 parts In-Stock

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$230.128

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Forefront Electronics and Design

USA . 36 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Speed Components Ltd

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ComSIT Distribution GmbH

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LIBRA Elektronik GmbH

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Sensible Micro Corp

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J2 Sourcing AB

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Elcom Components

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North Shore Components

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Electronics Depot

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EMSNET

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Rebound Electronics

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,387 parts In-Stock

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$16.050

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$15.408

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$14.766

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$16.050

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$14.766

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Aztec Data Supply Inc.

USA . 1,434 parts In-Stock

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$17.150

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Ampacity Inc.

Singapore . 636 parts In-Stock

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$205.900

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Corphita

USA . 641 parts In-Stock

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Continental Prestige Electronics

USA . 6,303 parts In-Stock

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$272.054

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Netroflash

USA . 100 parts In-Stock

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A-Z Elektronik GmbH

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GreenTree Electronics

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Futuretech Components

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Alle Elektronik GmbH

Germany . 4,837 parts In-Stock

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Glotronic Ltd.

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Argo Parts USA

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RC Electronics

USA . 980 parts In-Stock

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$36.460

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$35.370

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Perfect Parts

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Advanced Electronics

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Computer Components Inc. - USA

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iodParts Technologies Inc.

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Overview

Discover the cutting-edge CY7B923-JXC by Infineon Technologies, a game-changing Telecom Interface IC that sets new standards in quality and reliability. Crafted with precision by an industry-leading manufacturer, this product is designed to excel in a variety of applications within the telecom sector. With its innovative technology and top-notch performance, the CY7B923-JXC guarantees unmatched value and benefits for customers seeking a superior solution for their interface IC needs. Elevate your projects with this exceptional product and experience the advantages it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy assembly and integration into electronic devices, saving space and simplifying the manufacturing process.

Power Supplies (V): 5

Operates at a standard voltage of 5V, making it compatible with a wide range of electronic systems and power sources.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options, allowing for versatile connectivity and functionality within a system.

Maximum Operating Temperature: 70 °C

Capable of operating at high temperatures, ensuring reliable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, making it suitable for use in various climates and conditions.

Data Rate: 400 Mbps

High data rate of 400 Mbps allows for fast and efficient data transmission, essential for telecom applications requiring quick communication.

Technical Specifications

Other Function Telecom Interface ICs CY7B923-JXC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.5316 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

85 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.5316 mm

Trade Compliance

CY7B923-JXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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