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CY7B923-JXI

Infineon Technologies

CY7B923-JXI by Infineon Technologies

CY7B923-JXI by Infineon is a BICMOS telecom IC with 400 Mbps data rate, operating at 5V. It features a square chip carrier package style, matte tin terminal finish, and quad terminal position. Ideal for industrial applications requiring high-speed telecommunications interfaces.

Median Price

$301.344

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,555 parts In-Stock

1+ parts

$277.100

100+ parts

$260.470

1k+ parts

$243.850

10k+ parts

-

16,555

$277.100

$260.470

$243.850

-

Verical

USA . 12,511 parts In-Stock

1+ parts

-

100+ parts

$325.587

1k+ parts

$304.813

10k+ parts

-

12,511

-

$325.587

$304.813

-

DigiKey

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,500

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-

-

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Flip Electronics (Authorized)

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$195.927

100+ parts

-

1k+ parts

-

10k+ parts

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50

$195.927

-

-

-

Digiode

USA . 751 parts In-Stock

1+ parts

$306.442

100+ parts

-

1k+ parts

-

10k+ parts

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751

$306.442

-

-

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Vyrian

USA . 7,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,834

-

-

-

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Chip Stock

USA . 2,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,528

-

-

-

-

Flip Electronics

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,500

-

-

-

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Cyclops Electronics Ltd

UK . 1,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,074

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,017 parts In-Stock

1+ parts

$14.951

100+ parts

$14.353

1k+ parts

$13.755

10k+ parts

-

3,017

$14.951

$14.353

$13.755

-

Continental Prestige Electronics

USA . 3,562 parts In-Stock

1+ parts

$195.927

100+ parts

-

1k+ parts

-

10k+ parts

$192.008

3,562

$195.927

-

-

$192.008

Netroflash

USA . 500 parts In-Stock

1+ parts

$195.927

100+ parts

$192.008

1k+ parts

-

10k+ parts

-

500

$195.927

$192.008

-

-

Ampacity Inc.

Singapore . 7,576 parts In-Stock

1+ parts

$274.180

100+ parts

-

1k+ parts

-

10k+ parts

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7,576

$274.180

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-

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Corphita

USA . 733 parts In-Stock

1+ parts

$290.313

100+ parts

-

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733

$290.313

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Microchip USA

USA . 187 parts In-Stock

1+ parts

$477.247

100+ parts

-

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187

$477.247

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A-Z Elektronik GmbH

Germany . 7,244 parts In-Stock

1+ parts

-

100+ parts

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7,244

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-

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Alle Elektronik GmbH

Germany . 4,829 parts In-Stock

1+ parts

-

100+ parts

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4,829

-

-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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100+ parts

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3,790

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-

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Authorized Procurement Solutions

USA . 2,900 parts In-Stock

1+ parts

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100+ parts

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2,900

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Argo Parts USA

USA . 2,111 parts In-Stock

1+ parts

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2,111

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Kepictronics

USA . 1,550 parts In-Stock

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1,550

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Perfect Parts

USA . 146 parts In-Stock

1+ parts

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146

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Futuretech Components

Singapore . 15 parts In-Stock

1+ parts

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100+ parts

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15

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-

Overview

Upgrade your telecommunications systems with the CY7B923-JXI by Infineon Technologies. Crafted with precision and expertise, this advanced telecom interface IC offers unparalleled performance and reliability. Perfect for a wide range of applications in the industry, this product ensures seamless connectivity and efficient data transmission. Experience the value and benefits that only Infineon Technologies can provide, with top-notch quality and cutting-edge technology at your fingertips. Elevate your systems today with the CY7B923-JXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product resistant to impact and environmental factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization on the circuit board, especially in compact designs.

Power Supplies (V): 5

Operating at 5V provides a standard power supply option, ensuring compatibility with various systems and applications.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options, enabling the product to interface with multiple devices or components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers thermal efficiency and protection for the integrated circuit, enhancing performance and reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable operation even in demanding environments, increasing the product's reliability and lifespan.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures from -40°C to 85°C ensures functionality in both extreme cold and hot conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and conductivity, contributing to reliable connections and signal transmission.

Terminal Position: QUAD

Quad terminal position facilitates easy mounting and soldering on the circuit board, enhancing the product's assembly efficiency.

Maximum Seated Height: 4.572 mm

Low maximum seated height helps in reducing the overall profile of the component, making it suitable for space-constrained applications.

Width: 11.5316 mm

Compact width dimension enables efficient placement and routing on the circuit board, optimizing the overall design layout.

Maximum Time At Peak Reflow Temperature (s): 20

With a maximum reflow time of 20 seconds, the product ensures quick and effective soldering process during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for reliable and robust solder joints, ensuring long-term performance under various conditions.

Length: 11.5316 mm

Optimal length dimension contributes to the product's overall compactness, ideal for applications with limited board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating indicates the product's suitability for rugged environments and extended operational use.

Technology: BICMOS

BICMOS technology offers a balance between bipolar and CMOS advantages, providing high-speed performance and low power consumption.

Terminal Form: J BEND

J bend terminal form simplifies the soldering process and enhances mechanical stability, ensuring secure connections on the board.

Maximum Supply Current: 0.095 mA

Low maximum supply current of 0.095 mA helps in reducing power consumption and heat generation, improving overall efficiency.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, the product offers specialized features and performance tailored for telecommunications requirements.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources, ensuring seamless integration in various systems.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch facilitates easy connectivity and soldering, allowing for precise placement and secure connections on the board.

Data Rate: 400 Mbps

High data rate of 400 Mbps enables fast and efficient communication, making the product suitable for high-speed telecom applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling precautions during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs CY7B923-JXI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.5316 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.095 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.5316 mm

Trade Compliance

CY7B923-JXI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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