Loading...

CY7B923-JXCT

Infineon Technologies

CY7B923-JXCT by Infineon Technologies

Infineon's CY7B923-JXCT is a BICMOS telecom IC with 28 terminals, operating at 5V. It offers a data rate of 400 Mbps and operates b/w 0-70°C. Ideal for telecom circuits, this chip carrier has a matte tin finish and is surface mountable.

Median Price

$203.481

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$203.481

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$203.481

-

-

-

Chip Stock

USA . 4,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,084

-

-

-

-

Vyrian

USA . 609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

609

-

-

-

-

Digiode

USA . 323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

323

-

-

-

-

Sea View Technologies

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Bristol Electronics

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 101 parts In-Stock

1+ parts

$9.352

100+ parts

$8.978

1k+ parts

$8.604

10k+ parts

-

101

$9.352

$8.978

$8.604

-

Aztec Data Supply Inc.

USA . 1,288 parts In-Stock

1+ parts

$10.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,288

$10.280

-

-

-

AZTECH Wire

Italy . 609 parts In-Stock

1+ parts

$15.516

100+ parts

-

1k+ parts

-

10k+ parts

-

609

$15.516

-

-

-

Continental Prestige Electronics

USA . 4,534 parts In-Stock

1+ parts

$203.481

100+ parts

-

1k+ parts

-

10k+ parts

$199.411

4,534

$203.481

-

-

$199.411

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$203.481

100+ parts

$199.411

1k+ parts

-

10k+ parts

-

1,000

$203.481

$199.411

-

-

Semicontronic

India . 1,614 parts In-Stock

1+ parts

$302.000

100+ parts

$294.450

1k+ parts

$292.940

10k+ parts

-

1,614

$302.000

$294.450

$292.940

-

Ampacity Inc.

Singapore . 1,597 parts In-Stock

1+ parts

$626.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,597

$626.000

-

-

-

Lixinc

USA . 11,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,153

-

-

-

-

Microchip USA

USA . 3,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,794

-

-

-

-

Argo Parts USA

USA . 947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

947

-

-

-

-

Corphita

USA . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

375

-

-

-

-

Authorized Procurement Solutions

USA . 104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

104

-

-

-

-

Advanced Electronics

New Zealand . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

Overview

Discover the top-quality CY7B923-JXCT by Infineon Technologies, a versatile telecom interface IC perfect for a wide range of applications. With a commitment to excellence, Infineon Technologies delivers products that exceed expectations. This innovative chip carrier offers customers seamless connectivity, reliability, and efficiency. Say goodbye to disruptions and hello to enhanced performance with Infineon Technologies’ CY7B923-JXCT. Step up your game today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the IC, making it a reliable choice.

Surface Mount:

YES - Allows for easy installation and saves space on the PCB, making it convenient for assembly.

Package Shape:

SQUARE - Offers a compact design that is ideal for applications with limited space constraints.

Power Supplies (V):

5 - Provides a standard power supply voltage, ensuring compatibility with most systems.

No. of Terminals:

28 - Offers sufficient connectivity options for various applications, providing versatility.

Package Style (Meter):

CHIP CARRIER - Ensures efficient heat dissipation and thermal performance for optimal operation.

Maximum Operating Temperature:

70 °C - Can operate effectively in moderate temperature environments, suitable for most applications.

Minimum Operating Temperature:

0 °C - Provides a wide operating temperature range, allowing for use in diverse conditions.

Terminal Finish:

MATTE TIN - Offers corrosion resistance and reliable electrical connections, enhancing the longevity of the IC.

Terminal Position:

QUAD - Facilitates easy installation and reduces the chance of errors during assembly.

Maximum Seated Height:

4.572 mm - Compact size allows for easy integration into space-constrained designs.

Width:

11.5316 mm - Compact dimensions make it suitable for applications that require a small footprint.

Maximum Time At Peak Reflow Temperature (s):

20 - Ensures effective soldering during assembly, contributing to product reliability.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during assembly processes without compromising performance.

Length:

11.5316 mm - Compact dimensions allow for versatile placement in different PCB layouts.

Temperature Grade:

COMMERCIAL - Suitable for standard commercial applications, offering reliable performance in typical operating conditions.

Technology:

BICMOS - Features advanced technology for improved performance and efficiency in telecom applications.

Terminal Form:

J BEND - Facilitates easy soldering and connectivity, ensuring a secure connection in the circuit.

Maximum Supply Current:

0.085 mA - Low power consumption for energy-efficient operation, extending battery life in portable devices.

Telecom IC Type:

TELECOM CIRCUIT - Specifically designed for telecom applications, ensuring compatibility and reliable performance in communication systems.

Nominal Supply Voltage:

5 V - Standard voltage level for compatibility with a wide range of systems and devices.

Terminal Pitch:

1.27 mm - Provides a suitable pitch for easy soldering and secure connections on the PCB.

Data Rate:

400 Mbps - High data rate capability for efficient data transfer in telecom applications.

Moisture Sensitivity Level (MSL):

3 - Designed to withstand moderate moisture exposure, ensuring reliability in various environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs CY7B923-JXCT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.5316 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.085 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.5316 mm

Trade Compliance

CY7B923-JXCT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20