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CY7B933-SXC

Infineon Technologies

CY7B933-SXC by Infineon Technologies

CY7B933-SXC by Infineon Technologies is a BICMOS technology Telecom Interface IC with 28 terminals, operating at 5V. It has a data rate of 400 Mbps and is designed for telecom circuits. The package style is small outline, making it suitable for applications requiring high-speed communication in commercial temperature environments.

Median Price

$100.000

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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DigiKey

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DF Sales Co.

USA . 4 parts In-Stock

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DF Sales Co.

USA . 4 parts In-Stock

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Vyrian

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Digiode

USA . 844 parts In-Stock

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Nova Conductors

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Chip Stock

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Goldney Electronics S.L.

Spain . 9 parts In-Stock

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Sunrise Surplus Inc.

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Greenchips

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SIE Connect GmbH - GreenChips

Germany . 7 parts In-Stock

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Flip Electronics

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North Shore Components

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Modulus Dynamics

Lithuania . 3,202 parts In-Stock

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$12.825

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$12.312

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$11.799

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$146.600

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Microchip USA

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Futuretech Components

Singapore . 4,070 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Aranea Global

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Kepictronics

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Corphita

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Perfect Parts

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Speed Components Ltd (Excess)

Israel . 12 parts In-Stock

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Overview

Unlock seamless communication with the CY7B933-SXC from Infineon Technologies. Crafted with precision and expertise, this telecom interface IC sets a new standard in performance and reliability. Ideal for a wide range of applications, this innovative product offers unparalleled value, benefits, and advantages to customers looking for cutting-edge solutions. Experience the difference with the CY7B933-SXC and elevate your connectivity to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Power Supplies (V): 5

Operating at 5V makes the product compatible with a wide range of systems and applications.

No. of Terminals: 28

Having 28 terminals allows for multiple connections and interfaces, increasing the versatility of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments, ensuring reliability in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, enhancing the performance and longevity of the product.

Width: 7.505 mm

Compact width of 7.505 mm saves space on the PCB, making the product suitable for applications with limited board space.

Data Rate: 400 Mbps

High data rate of 400 Mbps allows for fast and efficient data transmission, making the product suitable for high-speed communication systems.

Technical Specifications

Other Function Telecom Interface ICs CY7B933-SXC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.905 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.67 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.155 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.505 mm

Trade Compliance

CY7B933-SXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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