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BGA524N6E6327XTSA1

Infineon Technologies

BGA524N6E6327XTSA1 by Infineon Technologies

BGA524N6E6327XTSA1 by Infineon is a telecom interface IC with 6 terminals. It operates b/w -40 to 85°C, suitable for industrial use. This small outline package has a very thin profile and no-lead terminal finish, making it ideal for telecom circuit applications.

Median Price

$0.354

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 54,207 parts In-Stock

1+ parts

$0.249

100+ parts

-

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54,207

$0.249

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Mouser Electronics

USA . 4,318 parts In-Stock

1+ parts

$1.440

100+ parts

$0.562

1k+ parts

$0.383

10k+ parts

$0.268

4,318

$1.440

$0.562

$0.383

$0.268

Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$11.163

100+ parts

$10.605

1k+ parts

$10.605

10k+ parts

-

500

$11.163

$10.605

$10.605

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Rochester

USA . 44,244 parts In-Stock

1+ parts

-

100+ parts

$0.354

1k+ parts

$0.294

10k+ parts

$0.262

44,244

-

$0.354

$0.294

$0.262

RS (Exports)

UK . 14,745 parts In-Stock

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14,745

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Verical

USA . 5,457 parts In-Stock

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$0.268

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5,457

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-

$0.268

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Element14

Singapore . 5,016 parts In-Stock

1+ parts

-

100+ parts

$0.489

1k+ parts

$0.343

10k+ parts

$0.303

5,016

-

$0.489

$0.343

$0.303

Chip1Stop

Japan . 2,925 parts In-Stock

1+ parts

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100+ parts

$0.305

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2,925

-

$0.305

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 338 parts In-Stock

1+ parts

$0.237

100+ parts

-

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338

$0.237

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Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$0.365

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55

$0.365

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Vyrian

USA . 21,922 parts In-Stock

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21,922

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Chip Stock

USA . 17,600 parts In-Stock

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Rutronik

Germany . 15,000 parts In-Stock

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VNN

France . 4,404 parts In-Stock

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Atlantic Semiconductor

USA . 182 parts In-Stock

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182

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Bristol Electronics

USA . 181 parts In-Stock

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181

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ComSIT Distribution GmbH

Germany . 129 parts In-Stock

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129

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 21,217 parts In-Stock

1+ parts

$0.212

100+ parts

-

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21,217

$0.212

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Semicontronic

India . 20,917 parts In-Stock

1+ parts

$0.212

100+ parts

$0.207

1k+ parts

$0.206

10k+ parts

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20,917

$0.212

$0.207

$0.206

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Corphita

USA . 383 parts In-Stock

1+ parts

$0.224

100+ parts

-

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383

$0.224

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Argo Parts USA

USA . 4,928 parts In-Stock

1+ parts

$0.365

100+ parts

-

1k+ parts

-

10k+ parts

$0.354

4,928

$0.365

-

-

$0.354

Continental Prestige Electronics

USA . 8,328 parts In-Stock

1+ parts

$0.747

100+ parts

$0.410

1k+ parts

$0.295

10k+ parts

-

8,328

$0.747

$0.410

$0.295

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Aztec Data Supply Inc.

USA . 926 parts In-Stock

1+ parts

$5.914

100+ parts

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926

$5.914

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Modulus Dynamics

Lithuania . 684 parts In-Stock

1+ parts

$6.460

100+ parts

$6.202

1k+ parts

$5.943

10k+ parts

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684

$6.460

$6.202

$5.943

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$11.163

100+ parts

$10.605

1k+ parts

$10.605

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500

$11.163

$10.605

$10.605

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Corohmni

South Africa . 39 parts In-Stock

1+ parts

$12.205

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39

$12.205

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Perfect Parts

USA . 70,017 parts In-Stock

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Component Connect

USA . 60,422 parts In-Stock

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iodParts Technologies Inc.

India . 18,338 parts In-Stock

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$0.266

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18,338

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$0.266

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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S.R.D Solutions

India . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,219 parts In-Stock

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3,219

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Robosynatics

Brazil . 3,169 parts In-Stock

1+ parts

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100+ parts

$14.171

1k+ parts

$13.882

10k+ parts

$13.882

3,169

-

$14.171

$13.882

$13.882

Lucentia Tech

USA . 3,169 parts In-Stock

1+ parts

-

100+ parts

$14.171

1k+ parts

$13.882

10k+ parts

$13.882

3,169

-

$14.171

$13.882

$13.882

Infinite Electronics LLP (Excess)

. 1,002 parts In-Stock

1+ parts

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1,002

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Formix International (Excess)

India . 44 parts In-Stock

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44

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Overview

Unlock the power of seamless communication with the BGA524N6E6327XTSA1 from Infineon Technologies. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability for a wide range of applications. With its compact design and advanced features, this product ensures optimal performance in industrial environments, providing customers with exceptional value and benefits. Experience the difference with Infineon Technologies – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes it easier to integrate this IC into various electronic devices and PCBs efficiently.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and alignment on the PCB, optimizing space usage.

No. of Terminals: 6

Having 6 terminals provides sufficient connection points for the IC to interface with other components in a telecom system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the IC can function reliably even in demanding industrial environments.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage of 1.8V ensures efficient power consumption and compatibility with modern electronic devices.

Technical Specifications

Other Function Telecom Interface ICs BGA524N6E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

.7 mm

Trade Compliance

BGA524N6E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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