Loading...

BGA5M1BN6E6327XTSA1

Infineon Technologies

BGA5M1BN6E6327XTSA1 by Infineon Technologies

Infineon's BGA5M1BN6E6327XTSA1 is a RECTANGULAR CHIP CARRIER with 6 terminals, operating from -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT IC with a supply voltage of 1.8V, suitable for telecom interface applications due to its compact size and surface-mount capability.

Median Price

$0.312

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 12,075 parts In-Stock

1+ parts

$42.200

100+ parts

$29.500

1k+ parts

$18.100

10k+ parts

$16.000

12,075

$42.200

$29.500

$18.100

$16.000

Rochester

USA . 7,723,179 parts In-Stock

1+ parts

-

100+ parts

$0.324

1k+ parts

$0.269

10k+ parts

$0.240

7,723,179

-

$0.324

$0.269

$0.240

Verical

USA . 4,053,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.300

4,053,575

-

-

-

$0.300

Chip1Stop

Japan . 22,900 parts In-Stock

1+ parts

-

100+ parts

$0.276

1k+ parts

$0.256

10k+ parts

-

22,900

-

$0.276

$0.256

-

Avnet

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 925 parts In-Stock

1+ parts

$0.253

100+ parts

-

1k+ parts

-

10k+ parts

-

925

$0.253

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$0.308

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$0.308

-

-

-

Vyrian

USA . 5,719 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,719

-

-

-

-

VNN

France . 751 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

751

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,942,729 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

-

10k+ parts

-

1,942,729

$0.226

-

-

-

Corphita

USA . 643 parts In-Stock

1+ parts

$0.239

100+ parts

-

1k+ parts

-

10k+ parts

-

643

$0.239

-

-

-

Modulus Dynamics

Lithuania . 2,849 parts In-Stock

1+ parts

$0.287

100+ parts

$0.276

1k+ parts

$0.264

10k+ parts

-

2,849

$0.287

$0.276

$0.264

-

AZTECH Wire

Italy . 144 parts In-Stock

1+ parts

$13.730

100+ parts

-

1k+ parts

-

10k+ parts

-

144

$13.730

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.302

1k+ parts

$0.293

10k+ parts

$0.286

500

-

$0.302

$0.293

$0.286

Overview

Unlock the power of seamless communication with the BGA5M1BN6E6327XTSA1 by Infineon Technologies. Manufactured with precision and expertise, this telecom interface IC promises unparalleled quality and reliability. Ideal for a variety of applications in the telecommunications industry, this product offers customers value, efficiency, and superior performance. Say goodbye to connectivity issues and hello to a world of seamless communication with the BGA5M1BN6E6327XTSA1.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space.

Package Shape: RECTANGULAR

Rectangular shape is common and compatible with standard PCB layouts, simplifying integration into existing designs.

No. of Terminals: 6

Having 6 terminals provides flexibility for different connection requirements and functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good protection and thermal performance, suitable for telecom applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering, enhancing the assembly process.

Maximum Seated Height: 0.4 mm

Low maximum seated height saves valuable space on the PCB and reduces overall product profile.

Width: 0.7 mm

Slim width allows for compact design and integration in space-constrained applications.

Length: 1.1 mm

Short length provides a small footprint and enables efficient use of board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Terminal Form: BUTT

Butt terminal form offers secure connections and reduces the chance of disconnects or signal interruptions.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecom systems.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage is energy-efficient and suitable for portable or battery-powered devices.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and connection, ideal for compact electronic devices.

Technical Specifications

Other Function Telecom Interface ICs BGA5M1BN6E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XBCC-B6

Length:

1.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

.7 mm

Trade Compliance

BGA5M1BN6E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3