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SA602AD/01,112

NXP Semiconductors

SA602AD/01,112 by NXP Semiconductors

SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.

Median Price

$1.290

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31 parts In-Stock

1+ parts

$1.290

100+ parts

$1.260

1k+ parts

$1.240

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31

$1.290

$1.260

$1.240

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,215 parts In-Stock

1+ parts

$1.226

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1,215

$1.226

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Nova Conductors

Japan . 100 parts In-Stock

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$1.307

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100

$1.307

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Vyrian

USA . 2,961 parts In-Stock

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Flip Electronics

USA . 2,023 parts In-Stock

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2,023

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Anansix

USA . 483 parts In-Stock

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483

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Distributors (Availability)

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Ampacity Inc.

Singapore . 31 parts In-Stock

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$1.100

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31

$1.100

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Semicontronic

India . 31 parts In-Stock

1+ parts

$1.100

100+ parts

$1.072

1k+ parts

$1.067

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31

$1.100

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$1.067

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Corphita

USA . 3,108 parts In-Stock

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$1.161

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3,108

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Corohmni

South Africa . 354 parts In-Stock

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$1.307

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354

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Argo Parts USA

USA . 3,525 parts In-Stock

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$1.307

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Aztec Data Supply Inc.

USA . 2,792 parts In-Stock

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$8.524

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2,792

$8.524

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$11.440

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$10.410

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$9.381

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60

$11.440

$10.410

$9.381

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AZTECH Wire

Italy . 529 parts In-Stock

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$17.054

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529

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Component Stockers USA

USA . 682 parts In-Stock

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$99.990

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682

$99.990

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UNI Independent Distributors

Spain . 6,773 parts In-Stock

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Perfect Parts

USA . 1,714 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$1.281

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$1.242

10k+ parts

$1.216

100

-

$1.281

$1.242

$1.216

Overview

Experience the superior quality and innovative design of the SA602AD/01,112 by NXP Semiconductors. This telecom interface IC offers unparalleled performance and reliability for a wide range of applications. With a compact package body and dual terminal position, this product is perfect for industrial-grade projects that require precision and efficiency. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your telecom circuits with the SA602AD/01,112 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the IC, making it suitable for long-term use in telecom applications.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated onto PCBs, simplifying assembly and saving space.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on a circuit board, optimizing space utilization.

No. of Terminals: 20

Having 20 terminals provides sufficient connectivity options for telecom interfaces, enabling versatile functionality.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design, along with shrink pitch, enhances the compactness of the IC for applications with space constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it suitable for industrial use.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this IC is energy-efficient and compatible with common power sources in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs SA602AD/01,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA602AD/01,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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