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BGT24LTR11N16E6327XTSA1

Infineon Technologies

BGT24LTR11N16E6327XTSA1 by Infineon Technologies

BGT24LTR11N16E6327XTSA1 by Infineon is a Telecom IC with 16 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and a terminal pitch of 0.5mm. This chip carrier is ideal for telecom circuit applications due to its very thin profile and industrial temperature grade suitability.

Median Price

$4.977

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,650 parts In-Stock

1+ parts

$3.182

100+ parts

-

1k+ parts

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10k+ parts

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9,650

$3.182

-

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Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$3.790

100+ parts

-

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1

$3.790

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Farnell

UK . 877 parts In-Stock

1+ parts

$5.590

100+ parts

$3.160

1k+ parts

$2.790

10k+ parts

-

877

$5.590

$3.160

$2.790

-

Mouser Electronics

USA . 3,489 parts In-Stock

1+ parts

$6.890

100+ parts

$4.080

1k+ parts

$3.890

10k+ parts

$3.390

3,489

$6.890

$4.080

$3.890

$3.390

Newark

USA . 25 parts In-Stock

1+ parts

$7.170

100+ parts

$4.280

1k+ parts

$3.940

10k+ parts

-

25

$7.170

$4.280

$3.940

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DigiKey

USA . 1,317 parts In-Stock

1+ parts

$9.940

100+ parts

$4.952

1k+ parts

$4.187

10k+ parts

-

1,317

$9.940

$4.952

$4.187

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Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$10.256

100+ parts

$9.743

1k+ parts

$9.743

10k+ parts

-

450

$10.256

$9.743

$9.743

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Rochester

USA . 12,074 parts In-Stock

1+ parts

-

100+ parts

$3.400

1k+ parts

$3.040

10k+ parts

$2.860

12,074

-

$3.400

$3.040

$2.860

Verical

USA . 9,650 parts In-Stock

1+ parts

-

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9,650

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-

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Avnet

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$3.154

9,000

-

-

-

$3.154

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$3.630

3,000

-

-

-

$3.630

Element14

Singapore . 823 parts In-Stock

1+ parts

-

100+ parts

$5.720

1k+ parts

$5.630

10k+ parts

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823

-

$5.720

$5.630

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RS (Exports)

UK . 182 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$4.364

182

-

-

-

$4.364

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 236 parts In-Stock

1+ parts

$1.273

100+ parts

-

1k+ parts

-

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236

$1.273

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.220

100+ parts

-

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500

$4.220

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-

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Vyrian

USA . 3,716 parts In-Stock

1+ parts

-

100+ parts

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3,716

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-

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Rutronik

Germany . 3,000 parts In-Stock

1+ parts

-

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3,000

-

-

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IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$5.287

3,000

-

-

-

$5.287

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$6.060

3,000

-

-

-

$6.060

VNN

France . 47 parts In-Stock

1+ parts

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47

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,068 parts In-Stock

1+ parts

$1.140

100+ parts

$1.112

1k+ parts

$1.106

10k+ parts

-

4,068

$1.140

$1.112

$1.106

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Ampacity Inc.

Singapore . 3,536 parts In-Stock

1+ parts

$1.140

100+ parts

-

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10k+ parts

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3,536

$1.140

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Corphita

USA . 876 parts In-Stock

1+ parts

$1.206

100+ parts

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876

$1.206

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Argo Parts USA

USA . 3,285 parts In-Stock

1+ parts

$3.698

100+ parts

-

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-

10k+ parts

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3,285

$3.698

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Continental Prestige Electronics

USA . 3,846 parts In-Stock

1+ parts

$4.250

100+ parts

$3.350

1k+ parts

-

10k+ parts

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3,846

$4.250

$3.350

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$10.256

100+ parts

$9.743

1k+ parts

$9.743

10k+ parts

-

450

$10.256

$9.743

$9.743

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Corohmni

South Africa . 329 parts In-Stock

1+ parts

$10.516

100+ parts

-

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10k+ parts

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329

$10.516

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Aztec Data Supply Inc.

USA . 16,496 parts In-Stock

1+ parts

$14.427

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16,496

$14.427

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Modulus Dynamics

Lithuania . 3,321 parts In-Stock

1+ parts

$17.681

100+ parts

$16.974

1k+ parts

$16.267

10k+ parts

-

3,321

$17.681

$16.974

$16.267

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RC Electronics

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

$5.450

1k+ parts

$5.140

10k+ parts

$5.030

90,000

-

$5.450

$5.140

$5.030

QUARKTWIN TECHNOLOGY LTD

USA . 19,583 parts In-Stock

1+ parts

-

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19,583

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Perfect Parts

USA . 14,689 parts In-Stock

1+ parts

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14,689

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-

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Epart123

USA . 12,000 parts In-Stock

1+ parts

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100+ parts

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$3.120

12,000

-

-

-

$3.120

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

-

-

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Robosynatics

Brazil . 3,414 parts In-Stock

1+ parts

-

100+ parts

$9.117

1k+ parts

$8.931

10k+ parts

$8.931

3,414

-

$9.117

$8.931

$8.931

Lucentia Tech

USA . 3,414 parts In-Stock

1+ parts

-

100+ parts

$9.117

1k+ parts

$8.931

10k+ parts

$8.931

3,414

-

$9.117

$8.931

$8.931

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

-

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GreenTree Electronics

Israel . 1,200 parts In-Stock

1+ parts

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1,200

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S.R.D Solutions

India . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

-

-

-

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Kepictronics

USA . 290 parts In-Stock

1+ parts

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290

-

-

-

-

Overview

Discover the cutting-edge BGT24LTR11N16E6327XTSA1 by Infineon Technologies, setting a new standard in Telecom Interface ICs. Crafted with precision and expertise, this product offers unparalleled quality and reliability. From enhancing communication systems to boosting networking capabilities, this innovative chip carrier delivers exceptional performance in various industrial applications. Unlock the potential of seamless connectivity and elevated efficiency with Infineon's state-of-the-art solution. Elevate your projects with the value and benefits that only Infineon can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making it ideal for telecom interface ICs.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and space-saving, making the product compact and efficient.

Package Shape: SQUARE

Square package shape provides better fitting on printed circuit boards and efficient use of space.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities in the telecom interface IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environmental conditions and ensure reliable performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V ensures compatibility with common power sources and efficient power consumption.

Technical Specifications

Other Function Telecom Interface ICs BGT24LTR11N16E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PBCC-B16

JESD-609 Code:

e3

Length:

2.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.77 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.4 mm

Trade Compliance

BGT24LTR11N16E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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