Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Digi International's XB3-24ACM-J is a TELECOM CIRCUIT with 1 Mbps Data Rate. Operating from -40 to 85 °C, it comes in RECTANGULAR package style. Ideal for telecom interfaces, this IC is designed for various applications requiring high-speed data transmission.
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The rectangular package shape allows for easy integration into electronic devices and circuit boards, making it a convenient choice for telecom applications.
The special shape of the package style provides unique design options and flexibility for fitting into compact spaces or specialized equipment, enhancing the versatility of this telecom interface IC.
With a high maximum operating temperature of 85°C, this telecom interface IC can reliably function in a wide range of environments without risking overheating or performance issues.
The low minimum operating temperature of -40°C ensures that this telecom interface IC can withstand cold conditions and maintain stable operation, increasing its durability and reliability.
Being specifically designed as a telecom circuit interface IC, this product is optimized for telecom applications, offering high performance, compatibility, and efficiency in telecommunications systems.
With a data rate of 1 Mbps, this telecom interface IC can efficiently transmit and process data at high speeds, making it suitable for demanding telecom applications that require fast and reliable communication.
Other Function Telecom Interface ICs XB3-24ACM-J attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Digi International
Data Rate:
JESD-30 Code:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Surface Mount:
Telecom IC Type:
Terminal Form:
Terminal Position:
XB3-24ACM-J Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Firmware version 14/Jul/2021 Mult Dev Firmware Chgs 2/Nov/2020
Since 1985, Digi International Inc. (Digi) has been a pioneer in wireless communication, forging the future for connected devices and responding to the needs of the people and enterprises that use them. Before the Internet of Things was a thing, we built M2M and IoT devices, adapted to evolving network standards, and optimized data communications around the most advanced protocols and emerging technologies. From radio frequency modems to gateways, cellular routers, networking devices, embedded system-on-modules (SOM) and single-board computers (SBCs), Digi's solutions have continually grown to serve the full breadth of applications across the IoT landscape. Today, our IoT offering includes sensor-based solutions, a sophisticated platform for remotely monitoring device deployments of any size, anywhere, as well as professional design, implementation and certification teams to help you carry out your vision, no matter how large or small.
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317T/NOPB
Texas Instruments
LM317T/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount with three terminals for easy installation.
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MAX-M8W-0-10
U-blox Ag
MAX-M8W-0-10 by U-blox Ag is a GNSS module with 18 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a compact size of 2.5mm width and 10.1mm length. This module is suitable for various applications requiring precise positioning and navigation capabilities.
MGM240PB32VNA3R
Silicon Labs
TELECOM CIRCUIT;
453-00006
Laird Technologies
453-00006 by Laird Technologies is a surface mount IC with 39 terminals, operating from -40 to 85°C. With a compact rectangular package style, it's ideal for telecom circuits requiring a 3V supply voltage. This industrial-grade IC has a peak reflow temp of 260°C and low seated height of 2.33mm, making it suitable for various telecom interface applications.
TESEO-LIV3F
TESEO-LIV3F by STMicroelectronics is a telecom IC with 18 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and compact dimensions of 9.7mm width and 10.1mm length. Ideal for industrial applications requiring a telecom circuit with a terminal pitch of 1.1mm in a rectangular package style.
CC2564BYFVR
The Texas Instruments CC2564BYFVR is a telecom IC with 54 terminals in a grid array package. It operates at -40 to 85°C, with a supply voltage of 3.6V and data rate of 4 Mbps. Ideal for telecom circuits, it features very thin profile and fine pitch terminal style for compact designs.
RN42XVP-I/RM
Microchip Technology
RN42XVP-I/RM by Microchip Technology is a telecom IC with 20 terminals, operating temperature range of -40 to 85 °C. It has a data rate of 0.3 Mbps and operates at a nominal voltage of 3.3 V. This rectangular package is ideal for industrial applications requiring reliable telecom circuit connectivity.
AT86RF215M-ZUR
AT86RF215M-ZUR by Microchip Technology is a telecom IC with RF and baseband circuit. It operates at -40 to 85 °C temperature range, has 48 terminals, and a very thin profile package style. It is suitable for various telecom interface applications.
ODIN-W260
ODIN-W260 by U-blox Ag is a TELECOM CIRCUIT with 3.3V supply, operating from -40°C to 85°C. RECTANGULAR MICROELECTRONIC ASSEMBLY package for telecom interfaces, ideal for various applications requiring reliable connectivity in extreme temperature conditions.
RCB-F9T-0
LMS7002M
Lime Microsystems
Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.
TLE8457BSJXUMA1
Infineon Technologies
TLE8457BSJXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC is ideal for telecom circuit applications due to its compact size and gull wing terminal form.
RN4678-V/RM111
RN4678-V/RM111 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and supply voltage of 1.9V. It is designed for surface mount applications in telecom circuits, meeting TS 16949 screening standards. With a compact rectangular package style and no-lead terminal form, it is ideal for commercial use in various electronic devices.
RN4871-V/RM130
RN4871-V/RM130 by Microchip Technology is a telecom IC with 16 terminals, operating at -20 to 70°C. It has a supply voltage of 3.3V and data rate of 0.01 Mbps. This surface-mount IC is ideal for telecom applications requiring TS 16949 screening and operates in commercial temperature grade.
AD9832BRUZ
Analog Devices
AD9832BRUZ by Analog Devices is a 16-terminal IC with CMOS technology. It operates b/w -40 to 85°C, drawing 5mA at 3.3V. Telecom circuit application, SMT package style, and matte tin finish make it ideal for telecom interfaces.
SIM7070G
Simcom Wireless Solutions
SIM7070G by Simcom Wireless Solutions is a telecom IC with 1.119 Mbps data rate, suitable for industrial use. It operates b/w -40 to 85°C, has 68 terminals in a square package shape, and is surface mountable.
MAX7042ATJ
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
RN4871-I/RM140
RN4871-I/RM140 by Microchip Technology is a telecom IC with 16 terminals, operating at -40 to 85°C. It has a data rate of 0.01 Mbps and nominal voltage of 3V. Ideal for industrial applications requiring surface mount technology in compact spaces.
NRF52840-CKAA-R7
Nordic Semiconductor Asa
NRF52840-CKAA-R7 by Nordic Semiconductor Asa is a 93-terminal GRID ARRAY IC with 2 Mbps data rate, operating from -40 to 85 °C. Ideal for TELECOM CIRCUIT applications due to its low profile and fine pitch design.
MAX3946ETG+T
MAX3946ETG+T by Analog Devices is a 24-terminal telecom IC with 3.3V supply voltage, operating from -40 to 95°C. It features a square chip carrier package style, matte tin finish, and industrial temperature grade. Ideal for telecom circuits, it has a terminal pitch of 0.5mm and no-lead terminal form.
BGM240SA22VNA2R
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XB3-24Z8PT-J
Digi International
XB3-24Z8PT-J by Digi Int. is a telecom IC with 20 terminals in MICROELECTRONIC ASSEMBLY package. Operating temp range -40 to 85°C, INDUSTRIAL grade. Ideal for TELECOM CIRCUIT applications due to THROUGH-HOLE terminal form and DUAL position.
XB3-24Z8UT-J
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Shape: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XB3-24Z8ST-J
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Shape: UNSPECIFIED; No. of Functions: 1;
XB3-24Z8UM-J
The Digi International XB3-24Z8UM-J is a surface mount telecom IC with 34 terminals. Operating temperature range of -40 to 85°C, suitable for industrial applications. Package style is microelectronic assembly, making it ideal for telecom circuit interfaces.
XB3-24DMCM-J
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
XB3-24Z8PT
The Digi International XB3-24Z8PT is a telecom IC with 20 terminals in a MICROELECTRONIC ASSEMBLY package. It operates in temperatures ranging from -40°C to 85°C, making it suitable for industrial applications requiring reliable telecom circuit connections. The terminal form is THROUGH-HOLE, ideal for robust and secure installations.
XB3-24Z8ST
The Digi International XB3-24Z8ST is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. Its dual terminal position and microelectronic assembly style enhance its functionality in telecommunications systems.
XB3-24Z8UT
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
XB3-24Z8CM-J
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 34; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
XB3-24Z8UM
The Digi International XB3-24Z8UM is a surface mount telecom IC with 34 terminals. Operating temperature ranges from -40°C to 85°C, suitable for industrial applications. With a compact size of 13mm x 19mm, it's ideal for telecom circuit integration in various devices.
XB3-24Z8US-J
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 37; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N37;
XB3-24Z8RM-J
XB3-24AUM
The Digi International XB3-24AUM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in telecom interface ICs.
XB3-24DMUM-J
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XB3-24AUT-J
TELECOM CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Package Style (Meter): SPECIAL SHAPE;
XB3-24DMCM
XB3-24ARM-J
The Digi International XB3-24ARM-J is a TELECOM CIRCUIT IC with 1 Mbps data rate. Operating temperature range: -40 to 85°C. RECTANGULAR package shape for telecom interfaces, ideal for various telecommunications applications.
XB3-24ARM
The Digi International XB3-24ARM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40°C to 85°C, making it suitable for various telecom applications. The RECTANGULAR package style and SPECIAL SHAPE design enhance its performance in Other Function Telecom Interface ICs.
XB3-24Z8US
The Digi International XB3-24Z8US is a telecom IC with 37 terminals, suitable for industrial applications. It operates b/w -40°C to 85°C, making it ideal for harsh environments. This surface-mount IC comes in a rectangular package style and is designed for other telecom interface functions.
XB3-24APS
The Digi International XB3-24APS is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in Other Function Telecom Interface ICs.
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