Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors' MFRC52302HN1,151 is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for applications requiring a very thin profile and surface mount compatibility.
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Nova Conductors
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Semi Source
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Netroflash
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Futuretech Components
UNI Independent Distributors
Perfect Parts
Argo Parts USA
iodParts Technologies Inc.
PLASTIC/EPOXY material offers good durability and protection for the IC, making it reliable for long-term use.
Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.
Square shape helps in efficient use of space on the PCB, making it suitable for compact designs.
Having 32 terminals allows for multiple connections and functionalities, providing versatility in telecom applications.
High maximum operating temperature ensures stable performance even in challenging environmental conditions.
Low minimum operating temperature enables the IC to function effectively in various temperature ranges.
Nickel palladium gold finish offers excellent conductivity and corrosion resistance, ensuring reliable connections.
Quad terminal position provides a secure and stable connection, reducing the risk of signal loss or disconnection.
Low maximum seated height allows for slim and compact designs, ideal for space-constrained applications.
Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the IC.
Other Function Telecom Interface ICs MFRC52302HN1,151 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MFRC52302HN1,151 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - MFRC520,2,3 Wire Diameter 14/May/2014 MFRC520,22,23 Wire Diameter Update 09/Aug/2014
PCN Assembly/Origin - Assembly Site Addition 05/Oct/2014
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
North American Philips Discrete Products Div
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
Gec Plessey Semiconductors
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
Semicoa
Eic Semiconductor
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
Crimson Semiconductor
1552200253
Molex
WIRE AND CABLE;
Promax-johnton
TRF7970ARHBR
Texas Instruments
TRF7970ARHBR by Texas Instruments is a telecom IC with 32 terminals, operating at 5V. It has a data rate of 0.848 Mbps and can withstand temperatures from -40 to 110°C. Ideal for telecom circuits, it comes in a square chip carrier package suitable for surface mounting applications.
ST25RU3993-BQFT
TELECOM CIRCUIT;
NEO-M8P-2-11
U-blox Ag
NEO-M8P-2-11 by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85 °C. It features AEC-Q100 screening level and TS 16949 certification. Ideal for industrial applications requiring precise positioning and reliable communication.
SARA-R510S-00B
WL1835MODGBMOCT
Texas Instruments' WL1835MODGBMOCT is a telecom IC with 100 terminals, operating at 3.7V and supporting data rates up to 100 Mbps. It features a rectangular package style, surface mount capability, and operates within -20 to 70°C temperature range. Ideal for telecom interface applications requiring high-speed data transmission in commercial-grade environments.
WT12-A-AI4
Silicon Labs
Silicon Labs' WT12-A-AI4 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 31 terminals. Operating from -40 to 85 °C, it's ideal for INDUSTRIAL applications requiring TELECOM CIRCUIT ICs at 3.3 V supply voltage and 1.5 mm terminal pitch.
LBWA1UZ1GC-958
Murata Manufacturing
Murata Manufacturing's LBWA1UZ1GC-958 is a telecom IC with 3.3V supply voltage, operating from -30°C to 85°C. It features a plastic/epoxy package in grid array style for surface mount applications. Ideal for telecom circuits, this IC has bottom terminals and square shape.
NRF52840-QIAA-R
Nordic Semiconductor Asa
NRF52840-QIAA-R by Nordic Semiconductor Asa is a telecom IC with 73 terminals, operating from -40 to 85°C. It has a nominal voltage of 3V and terminal pitch of 0.5mm. This square-shaped chip carrier is suitable for industrial applications requiring a very thin profile.
BLE113-A-V1
BLE113-A-V1 by Silicon Labs is a surface mount telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It features a rectangular package style, measures 15.725mm in length, and has a terminal pitch of 0.8mm. Ideal for industrial applications requiring low-profile telecom circuit integration.
DWM1001C
Qorvo
DWM1001C by Qorvo is a telecom IC with 34 terminals, operating at -40 to 85°C. It offers a data rate of 6.8 Mbps and operates at 3.3V supply voltage. This surface-mount device in a rectangular package is ideal for industrial applications requiring high-speed telecommunications interfaces.
CC2520RHDTG4
CC2520RHDTG4 by Texas Instruments is a telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40°C to 125°C, suitable for automotive applications. With a nominal voltage of 3V, it features CMOS technology and terminal finish in nickel palladium gold.
TSC2000IPWRG4
TSC2000IPWRG4 by Texas Instruments is a Telecom Interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, single-ended input type, and nominal voltage of 2.7V for telecom circuit applications.
SA612AN
NXP Semiconductors
SA612AN by NXP Semiconductors is an 8-terminal telecom IC with a nominal voltage of 6V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 250°C. With through-hole terminal form, it's ideal for telecom circuit applications due to its compact rectangular package style.
CC3135MODRNMMOBR
CC3135MODRNMMOBR by Texas Instruments is a telecom IC with 63 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring reliable communication interfaces in compact spaces. With surface mount capability and nickel gold finish, it offers robust connectivity solutions in various electronic devices.
MAX-M8W-0
MAX-M8W-0 by U-blox Ag is an AEC-Q100 graded GNSS Module with 18 terminals, operating b/w -40 to 85°C. With a compact size of 9.7mm x 10.1mm x 2.7mm, it's ideal for industrial applications requiring precise location tracking and navigation capabilities at a supply voltage of 3V.
BGT24MTR12E6327XUMA1
Infineon Technologies
BGT24MTR12E6327XUMA1 by Infineon is a telecom IC with 32 terminals in a chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a supply voltage of 3.3V, it features a terminal pitch of 0.5mm and is surface mountable for various telecom interface applications.
450-0178C
Ls Research
ZED-F9P-02B
The U-blox Ag ZED-F9P-02B is a GNSS module with 54 terminals, operating temperature range of -40 to 85°C. It is surface mountable and designed for industrial applications requiring precise positioning and timing accuracy. The TS 16949 screening level ensures high quality standards for telecom interfaces.
MGM240PB32VNN3R
BMD-300-A-R-00
BMD-300-A-R-00 by U-blox Ag is a surface mount telecom IC with 47 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3V. With a data rate of 2 Mbps, it is ideal for applications requiring high-speed telecommunications functionality.
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MFRC53101T/0FE,112
The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.
MFRC53001T/0FE,112
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR;
MFRC63003HNE
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
MFRC63002HN,151
NXP Semiconductors' MFRC63002HN,151 is a telecom IC with 32 terminals in a square chip carrier package. Operating b/w -25 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features a max seated height of 1mm.
MFRC63102HN,151
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
MFRC63002HN,118
The NXP Semiconductors MFRC63002HN,118 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85°C, with peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 5V and terminal pitch of 0.5mm.
MFRC63002HN
The NXP Semiconductors MFRC63002HN is a telecom interface IC with 1 function. It has a square package and a terminal position of quad. With a max operating temperature of 85°C and min operating temperature of -25°C, it is suitable for various telecom circuit applications.
MFRC63002HN,157
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MFRC53101T/0FE
NXP Semiconductors' MFRC53101T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. Its small outline package measures 7.5mm in width and 20.5mm in length, suitable for surface mount applications. With a nominal voltage of 5V, it's ideal for various telecom circuit functions.
MFRC63003HNY
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC63002HN/T/R
MFRC531
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
MFRC63002HN/TRAYBM
MFRC63002HN/TRAYB
MFRC52302HN1,157
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC52301HN1/TRAYBM
MFRC52302HN1/TRAYB
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;
MFRC52301HN1/TRAYB
MFRC52302HN1/TRAYBM
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