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MFRC52302HN1/TRAYB

NXP Semiconductors

MFRC52302HN1/TRAYB by NXP Semiconductors

MFRC52302HN1/TRAYB by NXP Semiconductors is a telecom interface IC designed for surface mount applications. It operates b/w -25 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile chip carrier package. Ideal for compact electronic devices, it offers efficient performance in communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,084 parts In-Stock

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Anansix

USA . 997 parts In-Stock

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Vyrian

USA . 59 parts In-Stock

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One Stop Electronics

USA . 496 parts In-Stock

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$869.000

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496

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UNI Independent Distributors

Spain . 6,111 parts In-Stock

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Corphita

USA . 2,578 parts In-Stock

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Overview

Unlock the potential of your telecom applications with the MFRC52302HN1/TRAYB from NXP Semiconductors, a name synonymous with quality and innovation. Designed for efficiency in even the most demanding environments, this compact, surface-mount IC ensures seamless connectivity and reliable performance. Experience reduced complexity and enhanced reliability, empowering your projects to thrive while benefiting from NXP’s renowned expertise and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protection for the IC, making it suitable for a variety of telecom applications.

Surface Mount: YES

Surface mount design allows for efficient assembly and reduces board space, facilitating easier integration into compact devices.

Package Shape: SQUARE

The square package shape optimizes space utilization on the PCB, making it easier to layout in designs where space is a premium.

No. of Terminals: 32

With 32 terminals, this IC offers ample connectivity options, catering to complex telecom circuit requirements.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile chip carrier design minimizes height, allowing for a sleek positioning in compact devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates its capability to function reliably in moderately high-temperature environments.

Minimum Operating Temperature: -25 °C

The operational range from -25 °C means this IC can function in colder climates, enhancing its versatility in various applications.

Terminal Position: QUAD

Quad terminal positioning supports better board layout efficiency and helps in achieving better signal integrity.

Maximum Seated Height: 1 mm

A low seated height of just 1 mm is ideal for minimizing overall device thickness, making it perfect for portable applications.

Width: 5 mm

With a width of 5 mm, this IC is compact, allowing for high density in circuit designs.

Length: 5 mm

A length of 5 mm complements its width, simplifying layout planning and enhancing compactness.

Terminal Form: NO LEAD

No lead design improves the reliability and thermal performance of the IC, as well as facilitating simplified manufacturing processes.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring it meets specialized performance requirements for communication standards.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V is standard for many modern digital circuits, ensuring broad compatibility.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for tighter layouts on PCBs, essential for high-density applications.

Technical Specifications

Other Function Telecom Interface ICs MFRC52302HN1/TRAYB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MFRC52302HN1/TRAYB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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