Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MFRC52302HN1/TRAYB by NXP Semiconductors is a telecom interface IC designed for surface mount applications. It operates b/w -25 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile chip carrier package. Ideal for compact electronic devices, it offers efficient performance in communication systems.
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The use of durable plastic/epoxy material ensures reliability and protection for the IC, making it suitable for a variety of telecom applications.
Surface mount design allows for efficient assembly and reduces board space, facilitating easier integration into compact devices.
The square package shape optimizes space utilization on the PCB, making it easier to layout in designs where space is a premium.
With 32 terminals, this IC offers ample connectivity options, catering to complex telecom circuit requirements.
The very thin profile chip carrier design minimizes height, allowing for a sleek positioning in compact devices.
A maximum operating temperature of 85 °C indicates its capability to function reliably in moderately high-temperature environments.
The operational range from -25 °C means this IC can function in colder climates, enhancing its versatility in various applications.
Quad terminal positioning supports better board layout efficiency and helps in achieving better signal integrity.
A low seated height of just 1 mm is ideal for minimizing overall device thickness, making it perfect for portable applications.
With a width of 5 mm, this IC is compact, allowing for high density in circuit designs.
A length of 5 mm complements its width, simplifying layout planning and enhancing compactness.
No lead design improves the reliability and thermal performance of the IC, as well as facilitating simplified manufacturing processes.
Designed specifically for telecom applications, ensuring it meets specialized performance requirements for communication standards.
Operating at a nominal supply voltage of 3.3 V is standard for many modern digital circuits, ensuring broad compatibility.
A terminal pitch of 0.5 mm allows for tighter layouts on PCBs, essential for high-density applications.
Other Function Telecom Interface ICs MFRC52302HN1/TRAYB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
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MFRC52302HN1/TRAYB Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
1N4148
Onsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
Transistor & Electronic
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CC2564MODNCMOER
CC2564MODNCMOER by Texas Instruments is a telecom IC with 33 terminals, operating at 3.6V with a data rate of 4 Mbps. It is surface mountable, has a rectangular package shape, and is suitable for applications requiring high-speed wireless communication in compact electronic devices.
XB3-24Z8UT
Digi International
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
CC1120RHBT
CC1120RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.2 Mbps, suitable for telecom circuits in industrial applications. This surface-mount chip carrier package measures 5x5mm with a very thin profile, making it ideal for compact designs.
RS9116W-DB00-CC1
Redpine Signals
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 107; Package Code: LGA; Package Shape: RECTANGULAR;
U2270B-MFPY
Atmel
U2270B-MFPY by Atmel is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates in temperatures ranging from -40 to 105 °C. It is commonly used in telecom circuits for various applications.
CC2640F128RSMT
CC2640F128RSMT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features a terminal pitch of 0.4mm and no-lead terminal form for industrial applications.
CLEO35-WIFI1
FTDI
CLEO35-WIFI1 by FTDI is a TELECOM CIRCUIT IC with 3.3V supply voltage, operating from -40 to 125 °C. Its MICROELECTRONIC ASSEMBLY package measures 31.6mm x 35.3mm x 4.6mm, ideal for automotive telecom applications due to its wide temperature range and compact design.
L80-M39
Quectel Wireless Solutions
L80-M39 by Quectel is a telecom interface IC with 1 function. It has a square package shape, 12 terminals, and a max operating temperature of 85°C. This IC is commonly used in industrial applications requiring reliable telecom circuitry.
SA616DK/01,118
NXP Semiconductors
SA616DK/01,118 by NXP Semiconductors is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates at temperatures ranging from -40 to 85 °C. It is suitable for telecom circuit applications.
CC2520RHDT
CC2520RHDT by Texas Instruments is a telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a data rate of 0.25 Mbps and nominal voltage of 3V, it's ideal for telecom circuits requiring high reliability.
BMD-300-A-R
U-blox Ag
The U-blox Ag BMD-300-A-R is a surface mount telecom IC with a data rate of 2 Mbps. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Its package style is microelectronic assembly, making it ideal for various telecom circuit designs.
CC430F5135IRGZR
CC430F5135IRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.5 Mbps. Ideal for industrial applications requiring low power consumption and reliable communication.
WL1835MODGBMOCT
Texas Instruments' WL1835MODGBMOCT is a telecom IC with 100 terminals, operating at 3.7V and supporting data rates up to 100 Mbps. It features a rectangular package style, surface mount capability, and operates within -20 to 70°C temperature range. Ideal for telecom interface applications requiring high-speed data transmission in commercial-grade environments.
HMC244AG16
HMC244AG16 by Analog Devices is a telecom IC with 16 terminals in a low profile flatpack package. It operates b/w -40 to 85°C, with gold over nickel terminal finish. Ideal for telecom circuits, it has a nominal voltage of 3V and gull wing terminal form.
CY7B933-JXIT
Infineon Technologies
CY7B933-JXIT by Infineon is a BICMOS technology telecom IC with 400 Mbps data rate. It operates at 5V, has 28 terminals in a square chip carrier package, and can withstand industrial temperature range. Ideal for telecom circuit applications requiring high-speed data transmission.
MT9041AP
Mitel Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
HT12D(20SOP)
Holtek Semiconductor
HT12D(20SOP) by Holtek Semiconductor is a CMOS telecom IC with 20 terminals. It operates at -20 to 70°C, powered by 2.4/12V supplies. This small outline package is surface mountable and commonly used in telecom circuits for various applications.
HMC624ALP4E
Analog Devices' HMC624ALP4E is a 24-terminal telecom IC with a 5V supply voltage, operating b/w -40 to 85°C. It features a chip carrier package style, matte tin terminal finish, and quad terminal position. Ideal for industrial applications requiring very thin profile components in telecom circuits.
RFFC2071ATR13
Rf Micro Devices
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
USB3740B-AI9TR
Standard Microsystems
USB3740B-AI9TR by Standard Microsystems is a telecom IC with 10 terminals, operating b/w -40 to 85°C. It has a thin profile chip carrier package style, suitable for industrial applications at 5V supply voltage. With surface mount and quad terminal position, it's ideal for compact telecom circuit designs.
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MFRC53101T/0FE,112
The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.
MFRC52302HN1,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MFRC53001T/0FE,112
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR;
MFRC63003HNE
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
MFRC63002HN,151
NXP Semiconductors' MFRC63002HN,151 is a telecom IC with 32 terminals in a square chip carrier package. Operating b/w -25 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features a max seated height of 1mm.
MFRC63102HN,151
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
MFRC63002HN,118
The NXP Semiconductors MFRC63002HN,118 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85°C, with peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 5V and terminal pitch of 0.5mm.
MFRC63002HN
The NXP Semiconductors MFRC63002HN is a telecom interface IC with 1 function. It has a square package and a terminal position of quad. With a max operating temperature of 85°C and min operating temperature of -25°C, it is suitable for various telecom circuit applications.
MFRC63002HN,157
MFRC53101T/0FE
NXP Semiconductors' MFRC53101T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. Its small outline package measures 7.5mm in width and 20.5mm in length, suitable for surface mount applications. With a nominal voltage of 5V, it's ideal for various telecom circuit functions.
MFRC63003HNY
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC63002HN/T/R
MFRC531
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
MFRC63002HN/TRAYBM
MFRC63002HN/TRAYB
MFRC52302HN1,157
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC52301HN1/TRAYBM
MFRC52301HN1/TRAYB
MFRC52302HN1/TRAYBM
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;
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